Mini Molded Chip Power Inductor Linepri LMSH201610R47MTA Featuring Halogen Free and RoHS Compliance

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Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

The LMSH201610R47MTA Mini Molded Chip Power Inductor is constructed using soft magnetic powder, a coil, and electrode pins. The coil is enclosed within the soft magnetic powder, which is then pressed, formed, and solidified. This molded inductance design offers a closed magnetic circuit, effective electromagnetic interference (EMI) shielding, high installation density, and is well-suited for SMT processes. It primarily functions as an energy storage or filter component in electronic circuits.

Key Features

Metal material for high current and low loss
Closed magnetic circuit design minimizes leakage flux
Super low resistance and ultra-high current rating
Halogen-free and RoHS compliant

Typical Applications

PDA, notebook, smartphone, and server applications
Battery-powered devices
DC/DC converters in distributed power systems

Technical Specifications

Part Number	Inductance (H)	Test Frequency (MHz)	DC Resistance (m)	Saturation Current (Isat) (A)	Temperature Rise Current (Irms) (A)	Rated Voltage (V)
	Typ	Typ	Typ	Max	Max	Max
LMSH201610R47MTA	0.47	1	17	20	6.1	5.6	5.0	4.8	20

Outline Dimensions (Fig. 4-1)

Type	A (mm)	B (mm)	C (mm)	D (mm)	L (mm)	G (mm)	H (mm)
201610	2.00.2	1.60.2	1.0Max	0.6 Typ	2.1	0.5	1.7

Electrical Characteristics Notes

Inductance Tolerance: 20%
All test data is referenced to 25 ambient
Test Condition: 1MHz, 1.0Vrms
Idc: DC current (A) that will cause an approximate T of 40
Isat: DC current (A) that will cause L0 to drop approximately 30%
Operating Temperature Range: -40 to +125
Part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions.
Rated current is either saturation current or heating current, whichever is lower.

Reliability Test Items

Test Item	Requirements	Test Methods and Remarks
Solderability	Appearance: No obvious damage. Solder coverage area on electrode surface: > 95%.	Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); Solder temp: 2455; Immersion time: 31 sec.
Terminal Strength	Sample shall not fall off. No disconnection of leads or cracks. Inductance value change 10%.	Solder onto test board via reflow. Push perpendicular to side at 30mm/min until 12.5N. Duration: 101 sec. Push-head radius: 0.5mm.
Bending	Sample must not drop off. No disconnection of leads or cracks.	Solder onto test board via reflow. Apply force until bending degree reaches 2mm. PCB size: 100x40x1.0 (or 0.8mm) mm. Bending duration: 30s. Test rate: 0.5mm/s.
Reflow	Appearance: No obvious mechanical damage. Inductance value change 10%.	Max. 260, for 3 times.
Long-term humid heat	Appearance: No hidden cracks, rust, or excessive glue. Inductance value change 10%.	Temp: 60. Humidity: 95%RH. Time: 1000H +24/-0 hours. Test after standing for 1H.
Dropping	Appearance: No obvious damage. Inductance value change 10%.	Solder onto test boards via reflow, place into drop-test boxes. Drop from 1m onto marble floor. Drop onto each of 6 faces 3 times (18 drops total). Counterweight: 250g 20g.
Long-term high temperature and high humidity	Appearance: No hidden cracks, rust, glue overflow, or obvious damage. Inductance value change 10%.	Temp: 852. Humidity: 855%. Duration: 1000H +24/0 hours. Test after standing for 1H.
Low-temperature storage	Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. Inductance value change 10%.	Temp: -402. Time: 1000 +24/-0 hours. Test after standing for 1 hour.
High-temperature storage	Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. Inductance value change 10%.	Temp: 125+2/-0. Time: 1000+24/-0 hours. Test after standing for 1 hour.
Long-term durability	Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. Inductance value change 10%.	Temp: 85 2. Duration: 1000 + 24 / -0 hours. Applied current: Rated current. Conduct test after standing for 1 hour.
Thermal Shock	Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. Inductance value change 10%.	-55+0/-5 (303 min) room temp (within 5 min) 125+5/-0 (303 min) room temp. Conversion time: 5 min Max. Cycles: 100. Conduct test after standing for 1 hour.
Vibration	No parts falling off or cracks. Inductance value change 10%.	Solder onto test board via reflow. Acceleration: 5g. Sweep speed: 20 min/cycle. Cycles: 12 cycles/axis (X, Y, Z), 36 total. Frequency: 10 - 2000Hz.
Humid heat load (60/95%RH+ loading)	Surface: Free of hidden cracks, rust, glue overflow, and obvious damage. Inductance value change 10%.	Temp: 60. Humidity: 95%RH. Applied Current: Rated current. Duration: 1000H +24/-0 hours. Conduct test after standing for 1 hour.

Packaging and Storage

Tape Packaging Dimensions

Dimensions	Code (mm)	Units/Reel
A0	1.950.05	3K
B0	2.350.05
K0	1.150.05
T	0.250.05

Tape Direction

(Refer to Fig. 7.2)

Reel Dimensions (Unit: mm)

(Refer to Fig. 7.3)

Peel Force of Top Cover Tape

Peel speed: approx. 300 mm/minute. Peel force: 0.1 to 0.7N.

Storage Recommendations

Maintain solderability of terminal electrodes and good condition of packing material by controlling temperature and humidity.
Recommended conditions: -10~40, 70% RH (Max.).
Even under ideal conditions, solderability may decrease over time. Use within one year from delivery.
If stored over 6 months, check solderability before actual usage.