Mini Molded Chip Power Inductor Linepri LMSC252010100MTA with Electrode Pin Embedded in Magnetic Powder
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Description
The LMSC252010100MTA is a Mini Molded Chip Power Inductor. Its construction involves a coil and electrode pin embedded within soft magnetic powder, which is then pressed, formed, and solidified. This design offers advantages such as a closed magnetic circuit, resistance to electromagnetic interference, and high installation density, making it ideal for SMT processes. It primarily functions as an energy storage or filter component in electronic circuits.
Key Features
- Metal material for large current and low loss
- Closed magnetic circuit design reduces leakage flux
- Super low resistance, ultra-high current rating
- Halogen-free, RoHS compliant
Typical Applications
- PDA, notebook, smartphone, and server applications
- Battery-powered devices
- DC/DC converters in distributed power systems
Outline Dimensions
| Type | A (mm) | B (mm) | C (mm) | D (mm) | L (mm) | G (mm) | H (mm) |
| 252010 | 2.50.2 | 2.00.2 | 1.0Max | 0.7Typ | 2.6 | 0.6 | 2.1 |
Electrical Characteristics
| Part Number | L (H) | Test Freq. (MHz) | DC Resistance (m) | Saturation Current (Isat) (A) | Temperature Rise Current (Irms) (A) | Rated Voltage Max (V) | |||
| Typ | Max | Typ | Max | Typ | Max | ||||
| LMSC252010100MTA | 10 | 1 | 470 | 490 | 1.6 | 1.5 | 1.2 | 1.1 | 20 |
Notes:
- Inductance Tolerance: 20%
- All test data is referenced to 25 ambient
- Test Condition: 1MHz, 1.0Vrms
- Idc: DC current (A) that will cause an approximate T of 40
- Isat: DC current (A) that will cause L0 to drop approximately 30%
- Operating Temperature Range: -40 to +125
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 1. Appearance shows no obvious damage. 2. Coverage area of new solder on electrode surface > 95%. | 1. Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0) 2. Solder temperature: 2455 3. Immersion time: 31 seconds. |
| Terminal Strength | 1. Sample shall not fall off the test board. 2. No disconnection of leads or cracks on product matrix. 3. Inductance value change shall not exceed 10%. | 1. Solder test samples onto test board using reflow soldering. Push perpendicular to the side of the sample at a speed of 30mm/min until 17.5N is reached. 2. Duration: 101 seconds. 3. R-radius of push-head: 0.5mm. |
| Bending | 1. Sample must not drop off the test board. 2. No disconnection of lead-out terminals or cracks on product matrix. | 1. Solder test samples onto test board using reflow soldering. Apply force until bending degree of test board reaches 2mm. 2. PCB size: 100401.0 (or 0.8mm) mm. 3. Bending duration: 30s. 4. Test rate: 0.5mm/s. |
| Reflow | 1. Appearance shows no obvious mechanical damage. 2. Change in inductance value does not exceed 10%. | Max. 260, for 3 times. |
| Long-term humid heat | 1. Appearance: no hidden cracks, rust, or excessive glue. 2. Change in inductance value should not exceed 10%. | 1. Temperature: 60. 2. Humidity: 95%RH. 3. Time: 1000H +24/-0 hours. 4. Test after standing for 1H. |
| Dropping | 1. No obvious damage to appearance. 2. Change in inductance value should not exceed 10%. | 1. Solder test samples onto test boards using reflow soldering, then place into drop-test boxes. 2. Drop boxes from 1m height onto a marble floor. 3. Drop boxes onto each of the 6 faces three times (18 drops total). 4. Counterweight: 250g 20g. |
| Long-term high temperature and high humidity | 1. Surface: no hidden cracks, rust, glue overflow, or obvious damage. 2. Variation of inductance value should not exceed 10%. | 1. Temperature: 852. 2. Humidity: 855%. 3. Duration: 1000H +24/0 hours. 4. Test after standing for 1H. |
| Low-temperature storage | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Change in inductance value shall not exceed 10%. | 1. Temperature: -402. 2. Time: 1000 +24/-0 hours. 3. Test after standing for 1 hour. |
| High-temperature storage | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Change in inductance value shall not exceed 10%. | 1. Temperature: 125+2/-0. 2. Time: 1000+24/-0 hours. 3. Test after standing for 1 hour. |
| Long-term durability | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Change in inductance value shall not exceed 10%. | 1. Temperature: 85 2 2. Duration: 1000 + 24 / -0 hours 3. Applied current: Rated current 4. Conduct test after standing for 1 hour. |
| Thermal Shock | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Change in inductance value shall not exceed 10%. | 1. -55+0/-5 for 303 min room temp within 5 min 125+5/-0 for 303 min room temp. 2. Conversion time: 5 minutes Max. 3. Cycles: 100. 4. Conduct test after standing for 1 hour. |
| Vibration | 1. Product should not have any parts falling off or cracks. 2. Variation of inductance value should not exceed 10%. | 1. Solder test samples onto test board by reflow soldering. 2. Acceleration: 5g. 3. Sweep speed: 20 min/cycle. 4. Cycles: 12 cycles per axis (X, Y, Z), 36 total. 5. Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | 1. Surface: free of hidden cracks, rust, glue overflow, and obvious damage. 2. Change in inductance value shall not exceed 10%. | 1. Temperature: 60. 2. Humidity: 95%RH. 3. Applied Current: Rated current. 4. Duration: 1000H +24/-0 hours. 5. Conduct test after standing for 1 hour. |
Packaging and Storage
Tape Packaging Dimensions
| Dimensions | Code (mm) | Units/Reel | |||
| A0 | B0 | K0 | T | 3K | |
| 2.300.05 | 2.80.05 | 1.200.05 | 0.230.05 |
Tape Direction
Reel Dimensions
Peel Force of Top Cover Tape
The peel speed shall be about 300 mm/minute. The peel force of top cover tape shall be between 0.1 to 0.7N.
Storage
- To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.
- Recommended conditions: -10~40, 70% RH (Max.).
- Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, product should be used within one year from the time of delivery.
- In case of storage over 6 months, solderability shall be checked before actual usage.
Reflow Profile
Reflow Soldering Method
Soldering Iron Method
3505 max. 3 seconds.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina