Thick Film Chip Array Resistors LIZ CA034AJA0680G Pb Free Halogen Free Wide Resistance Range
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The CA Series Thick Film Chip Array Resistors are Pb-free and halogen-free components designed for various electronic applications. These resistors offer a wide resistance range from 1 to 1M and are available in different sizes and tolerances to meet specific design requirements. They are constructed with a ceramic substrate, silver electrodes, a ruthenium oxide resistive layer, and protected by glass and epoxy resin, ensuring reliability and performance.
Product Attributes
- Brand: (LIZHI ELECTRON)
- Origin: Kunshan City, Jiangsu Province, China
- Type: Thick Film Chip Array Resistors
- Compliance: Pb-free, Halogen-free (meeting RoHS exemption for lead in glass)
Technical Specifications
| Model | Type | Size | Rated Power | Tolerance | Resistance Range | Max Working Voltage | Max Overload Voltage | Dielectric Withstanding Voltage | Zero Ohm Resistance Value | Zero Ohm Rated Current | Operating Temperature Range | Storage Condition |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CA024A | Thick Film Chip Array Resistors (8P4R) | 0402 | 1/16W | 1%, 2%, 5% | 1 ~ 1M | 50V | 100V | 220V | <50m | 1A | -55 ~ +155 | 530, 3075%RH |
| CA034A | Thick Film Chip Array Resistors (8P4R) | 0603 | 1/10W | 1%, 2%, 5% | 1 ~ 1M | 50V | 100V | 430V | <50m | 1A |
Dimensions
| Type | L (mm) | W (mm) | H (mm) | L1 (mm) | Q (mm) | P (mm) | L2 (mm) |
|---|---|---|---|---|---|---|---|
| CA024A | 2.000.10 | 1.000.10 | 0.400.05 | 0.180.10 | 0.330.10 | 0.500.10 | 0.260.10 |
| CA034A | 3.200.20 | 1.500.20 | 0.550.05 | 0.300.15 | 0.500.15 | 0.800.15 | 0.300.20 |
Performance Specifications
| Item | Test Method | Test Conditions | Specification |
|---|---|---|---|
| Temperature Coefficient | JIS C 5201 4.8 | TCR=R-R0/t-t0R0 106ppm | 200 PPM/ |
| Solderability | JIS C 5201 4.17 | Dip into soldering bath at 2455 for 30.5 sec. | Min 95% coverage |
| Insulation Resistance | JIS C 5201 4.6 | Applied dielectric withstanding voltage for 605 sec. | >10G |
| Dielectric Withstanding Voltage | JIS C 5201 4.7 | Applied dielectric withstanding voltage for 605 sec. | No evidence of flashover, arcing or insulation breakdown |
| Short-time Overload | JIS C 5201 4.13 | Applied 2.5 times rated voltage for 5 sec. | (1.0% +0.05) Max |
| Temperature Cycling | JIS C 5201 4.19 | 1552 to -553, 5 cycles. | (2.0%+0.05) Max |
| Humidity | JIS C 5201 4.24 | 402, 90~95% RH; Rated voltage applied for 1.5h, rest for 0.5h, repeated for 1000 hours. | (2.0%+0.05) Max |
| Load Life | JIS C 5201 4.25.1 | 702, ON TIME:1.5H, OFF TIME:0.5H, rated voltage applied for 1000 hours. | (2.0%+0.05) Max |
| Terminal Bending | JIS C 5201 4.33 | Bend test on mounted specimen, 1mm bend distance, maintained for 201 sec. | (1.0%+0.05) Max |
| Moisture Resistance | MIL-STD-202 METHOD 106 | Temperature cycling from 25C to 65C, 90~100% RH for 10 cycles. | (2.0% +0.05) Max |
Taping Specification
| Dimension | CA024A | CA034A |
|---|---|---|
| Reel Dimension A (mm) | 1782.0 | 1782.0 |
| Reel Dimension B (mm) | 60.01.0 | 60.01.0 |
| Reel Dimension C (mm) | 13.50.5 | 13.50.5 |
| Reel Dimension F (mm) | 11.40.1 | 11.40.1 |
| Reel Dimension W (mm) | 9.000.3 | 9.000.3 |
| Quantity per Reel | 10,000 pcs | 5,000 pcs |
| Carrier Tape Dimension A (mm) | 1.200.10 | 1.900.15 |
| Carrier Tape Dimension B (mm) | 2.200.10 | 3.400.20 |
| Carrier Tape Dimension D (mm) | 1.500.0 | 1.500.0 |
| Carrier Tape Dimension F (mm) | 1.0 | 1.0 |
| Carrier Tape Dimension P0 (mm) | 3.500.05 | 3.500.05 |
| Carrier Tape Dimension P1 (mm) | 4.000.10 | 4.000.10 |
| Carrier Tape Dimension P2 (mm) | 4.000.10 | 4.000.10 |
| Carrier Tape Dimension W (mm) | 2.000.05 | 2.000.05 |
Peel Force of Top Cover Tape
Top cover tape is pulled at a speed of 200 mm/min at an angle of 165 to 180 degrees.
- Paper carrier tape: 0.1N to 0.7N (10g to 70g)
- Plastic carrier tape: 0.15N to 0.80N (15g to 80g)
Soldering
Hand Soldering Temperature: 35010 for less than 3 seconds. Avoid direct contact of the solder iron tip with the component body.
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Contact Person
Sellina