Metal Current Sensing Chip Resistors LIZ RM2512FBR080GM Pb Free Halogen Free AEC Q200 Compliant
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Negotiable
MOQ:
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Delivery Time:
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Product Description
Metal Current Sensing Chip Resistors - RM Series
This specification applies to Pb-free and halogen-free Metal Current Sensing Chip Resistors, RM Series, which comply with AEC-Q200 standards. These resistors are designed for current sensing applications.
Product Attributes
- Manufacturer: (LIZHI ELECTRON CO., LTD.)
- Material: Metal Alloy
- Certifications: AEC-Q200
- Lead Free: Yes
- Halogen Free: Yes
Technical Specifications
| Part Number Example | Type | Size | Rated Power | Tolerance | Resistance Value | Packing Code | Material | Dimensions (mm) | Operating Temperature Range | Storage Condition | Shelf Life |
|---|---|---|---|---|---|---|---|---|---|---|---|
| RM2512FBR010GM | RM (Metal current sensing chip resistors) | 2512 | 2W | 1% | 10m | G (reel) | M (MnCu) | L: 6.40.2, W: 3.20.2, T: 0.600.20 (R2m) / 0.90.2 (R>2m) | -55~+170 | 535, 4075%RH | 2 years |
| (Example for RM1206) | RM (Metal current sensing chip resistors) | 1206 | 1/2W | 1% | 3m~30m | G (reel) | M (MnCu) | L: 3.20.20, W: 1.60.20, T: 0.600.20 (3mR30m) | -55~+170 | 535, 4075%RH | 2 years |
Resistance Range and Electrical Characteristics
| Type | Rated Power | Resistance Range | TCR (ppm/) | Insulation Resistance |
|---|---|---|---|---|
| RM1206 | 1/2W, 1W | 3m~30m | +25~+125: 50 +25~+155: 65 | >100M |
| RM2512 | 1W, 1.5W, 2W | 1m~50m | +25~+125: 50 +25~+155: 65 | >100M |
| RM2512 | 3W | 1m~3 m | +25~+125: 50 +25~+155: 65 | >100M |
Performance Specifications
| Item | Specification Limits | Test Methods |
|---|---|---|
| Temperature Coefficient | As Spec. | +25~+125: 50ppm/ +25~+155: 65 ppm/ |
| High Temperature Exposure | MIL-STD-202 Method 108 | |
| Low Temperature operation | IEC60115-1 4.23.4 | |
| Temperature cycling | JESD22 Method JA-104 | |
| Short-time overload | IEC60115-1 4.13 | |
| Biased Humidity | MIL-STD-202 METHOD 103 | |
| Operational life | MIL-STD-202 METHOD 108 | |
| Solderability | Min 95% coverage | J-STD-002B test B |
| Resistance to soldering heat | IEC60115-1 4.18 | |
| Mechanical Shock | MIL-STD-202 METHOD 213 | |
| Resistance to vibration | MIL-STD-202 METHOD 204 | |
| Board Flex | AEC-Q200-005 | |
| Terminal Strength | AEC-Q200-006 | |
| Thermal shock | MIL-STD-202 METHOD 107 | |
| Flammability | V-0 or V-1 acceptable | UL-94 |
| ESD test | AEC-Q200-002 |
Packaging Specifications
Reel Dimensions
| Size | Dimension | A (mm/inch) | B (mm/inch) | C (mm/inch) | F (mm/inch) | W (mm/inch) | Quantity per Reel |
|---|---|---|---|---|---|---|---|
| RM1206 | mm | 1782.00 | 60.001.00 | 13.500.50 | 11.400.10 | 9.000.30 | 5,000 pcs |
| RM1206 | Inch | 7.0080.079 | 2.3620.039 | 0.5310.020 | 0.4490.039 | 0.3540.012 | |
| RM2512 | mm | 1782.00 | 60.001.00 | 13.500.50 | 15.401.00 | 13.000.3 | 4,000 pcs |
| RM2512 | Inch | 7.0080.079 | 2.3620.039 | 0.5310.020 | 0.6060.039 | 0.5120.012 |
Packing Dimensions
| Packing Type | Size | A (mm) | B (mm) | W (mm) | F (mm) | E (mm) | P1 (mm) | P2 (mm) | P0 (mm) | D0 (mm) | T (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Paper Tape | RM1206 | 2.00.15 | 3.60.2 | 8.00.2 | 3.50.05 | 1.750.1 | 4.00.1 | 2.00.05 | 4.00.1 | 1.500.1 | 0.840.1 |
| Emboss Tape | RM2512 | 3.60.2 | 18.00.2 | 12.00.2 | 5.50.05 | 1.750.1 | 4.00.1 | 2.00.05 | 4.00.05 | 1.500.1 | 1.000.15 |
Reliability Test Methods
| Item | Test Conditions |
|---|---|
| Temperature Coefficient | TCR=(R-R0)/(t-t0)R0 106 (ppm) |
| High Temperature Exposure | 1000 hrs. @T=125. Measure the variation of resistance at 244 hours after test conclusion. |
| Low Temperature operation | 45 min. @T=-55. Measure the variation of resistance after test conclusion. |
| Temperature cycling | 1000 Cycles (-55 to +125). Measurement at 244 hours after test conclusion. |
| Short-time overload | Applied 5.0 times of rated power for 5 second. Measure the variation of resistance. |
| Biased Humidity | 1000 hours 85/85%RH. Note: Specified conditions: 10% of operating power. Measurement at 244 hours after test conclusion. |
| Operational life | Put the specimen in a chamber at 702 temperature, and applied rated Current for 1.5H and rested for 0.5H repeatedly till total test time is 1000 +48/-0 hrs. Measure the variation of resistance. |
| Solder ability | Dip the terminal in a flux and then dip into a soldering bath at 2455 for 2~3sec. |
| Resistance to soldering heat | Dip the terminal in a flux and then dip into a soldering bath at 2605 for 101sec. Measure the variation of resistance. |
| Mechanical Shock | 100g's, Normal duration is 6ms, half sine shock pulse. Measure the variation of resistance. |
| Resistance to vibration | 5g's for 20min. 12 cycles, 10-2000Hz. Measure the variation of resistance. |
| Board Flex | Min 2mm deflection, 60sec. Measure the variation of resistance. |
| Terminal Strength | Applied a 17.7N (1.8Kg) for 601seconds. |
| Thermal shock | Use -55/+125, Number of cycles is 300. Devices mounted. Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air Air. Measure the variation of resistance. |
| Flammability | V-0 or V-1 are acceptable. Electrical test not required. |
| ESD test | Other: 2KV, 2 times/1s. |
Peel Force of Top Cover Tape
The top cover tape is pulled at a speed of 300 mm/min with the angle between the tape during peel and the direction of unreeling maintained at 165 to 180 degrees. The peel force of paper carrier tape shall be 0.1N to 0.7N (10 to 70 g), the peel force of plastic carrier tape shall be 0.3N to 1N (30 to 100 g).
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina