Durable Chip Resistors Thick Film Type LIZ CR2010F22203G with Nickel Barrier Layer and Epoxy Marking

Name: Durable Chip Resistors Thick Film Type LIZ CR2010F22203G with Nickel Barrier Layer and Epoxy Marking
Brand: Beijing Silk Road Enterprise Management Services Co., Ltd.

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Thick Film Chip Resistors - Type CR

This specification prescribes lead-free thick film chip resistors for use in electronic systems.

Product Attributes

Brand: (Not specified)
Origin: (Not specified)
Material: Ceramic Substrate (Al2O3), Conductive layer (Ag), Side conductive layer (NiCr), Resistive layer (RuO2 + glass), Inner protective layer (Glass), Protective layer (Epoxy), Marking (Epoxy), Termination barrier layer (Ni), Termination layer (Matte Tin)
Color: (Not specified)
Certifications: (Not specified)

Technical Specifications

Type	Rated Power at 70	Max. Working Voltage	Max. Overload Voltage	Resistance Range (ohm)	Tolerance (%)	T.C.R (ppm/)	Max. Rated Current	Dimensions (mm) L x W x T	Construction Materials
CR0201	1/20W	25V	50V	1~10M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	250 (for >25), +500-250 (for 1~25)	0.5A	0.600.03 x 0.300.03 x 0.230.03	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR0402	1/16W	50V	100V	1~22M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	250 (for >25), +500-250 (for 1~25)	1A	1.000.05 x 0.500.05 x 0.350.05	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR0603	1/10W	50V	100V	10~22M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	200 (for >10), +500-250 (for 1~10)	1A	1.600.15 x 0.800.10 x 0.450.10	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR0805	1/8W	150V	300V	10~22M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	200 (for >10), +500-250 (for 1~10)	1.5A	2.000.15 x 1.250.15 x 0.500.10	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR1206	1/4W	200V	400V	10~22M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	200 (for >10), +500-250 (for 1~10)	1.9A	3.100.15 x 1.600.15 x 0.550.10	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR1210	1/3W	200V	400V	10~22M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	200 (for >10), +500-250 (for 1~10)	2.2A	3.100.15 x 2.500.15 x 0.550.15	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR2010	1/2W	200V	400V	10~22M (E96/E24)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	200 (for >10), +500-250 (for 1~10)	3A	5.000.20 x 2.500.20 x 0.550.15	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
CR2512	1W	200V	400V	10~10M (E96)	0.5% (D), 1% (F), 2% (G), 5% (J), 10% (K), 20% (M)	100 (for >10), +500-250 (for 1~10)	3A	6.250.20 x 3.100.20 x 0.550.15	Ceramic substrate, Conductive layer, Side conductive layer, Resistive layer, Inner protective layer, Protective layer, Marking, Termination barrier layer, Termination layer
Jumper	(See specific type)	(See specific type)	(See specific type)	1~25	(See specific type)	(See specific type)	(See specific type)	(See specific type)	(See specific type)