Pb Free Halogen Free Thick Film Chip Array Resistors LIZ CA034AJA0000G for Electronic Applications
Product Overview
The CA Series Thick Film Chip Array Resistors are Pb-free and halogen-free components designed for various electronic applications. These resistors offer a wide resistance range and are available in different sizes and tolerances. They are constructed with a ceramic substrate, silver electrodes, a ruthenium oxide resistive layer, and protected by glass and epoxy resin, ensuring reliable performance. The CA series is suitable for applications requiring precise resistance values and robust construction, with specific models designed for different power ratings and sizes.
Product Attributes
- Manufacturer: Lizhi Electronics (Kunshan) Co., Ltd.
- Customer: Lizhi Electronics (Nantong) Co., Ltd.
- Type: Thick Film Chip Array Resistors (CA Series)
- Compliance: Pb-free, Halogen-free (RoHS exemption for lead in glass)
Technical Specifications
| Model/Type | Size | Rated Power | Tolerance | Resistance Value | Packing Code | Dimensions (mm) L x W x H | Max Working Voltage | Max Overload Voltage | Dielectric Withstanding Voltage | Resistance of Jumper | Rated Current of Jumper | Operating Temperature Range | Storage Condition |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CA034AJA0102G | 8P4R (0603) | 1/10W | 5% | 1K | G (reel) | 3.200.20 x 1.500.20 x 0.550.05 | 50V | 100V | 430V | <50m | 1A | -55~+155 | 530, 3075%RH |
| CA Series | 8P4R (0402) | 1/16W | 1% | 1~1M | V (bulk) | 2.000.10 x 1.000.10 x 0.400.05 | 50V | 100V | 220V | <50m | 1A | -55~+155 | 530, 3075%RH |
| CA Series | 8P4R (0603) | 1/10W | 2% | 1~1M | S (Double Standard Quantity) | 3.200.20 x 1.500.20 x 0.550.05 | 50V | 100V | 430V | <50m | 1A | -55~+155 | 530, 3075%RH |
| CA Series | 8P4R (0603) | 1/10W | 5% | 1~1M | G (reel) | 3.200.20 x 1.500.20 x 0.550.05 | 50V | 100V | 430V | <50m | 1A | -55~+155 | 530, 3075%RH |
| Construction Materials: Ceramic substrate (Al2O3), Silver electrodes (Ag), Resistive layer (RuO2 + glass), Inner protective layer (Glass), Outer protective layer (Epoxy resin), Marking (Epoxy resin), Nickel plating layer (Ni), Tin plating layer (Matte Tin). | |||||||||||||
| Marking: 3-digit code for 2%, 5% tolerance; 4-digit code for 1% tolerance; '000' for 0. | |||||||||||||
| Reel Dimensions: CA024A: 1782.0mm (Diameter), 10,000 pcs/Reel; CA034A: 1782.0mm (Diameter), 5,000 pcs/Reel. | |||||||||||||
| Peel Force (Top Cover Tape): Paper carrier tape: 0.1N to 0.7N (10 to 70 g); Plastic carrier tape: 0.15N to 0.80N (15 to 80 g) at 200 mm/min, 165-180 degree angle. | |||||||||||||
Performance Specifications
| Item | Test Method | Test Conditions | Specification |
|---|---|---|---|
| Temperature Coefficient | JIS C 5201 4.8 | TCR=(R-R0)/(t-t0)R0 10^6 (ppm) | 200 PPM/ |
| Solderability | JIS C 5201 4.17 | Soldering bath at 2455 for 30.5 sec. | Min 95% coverage |
| Insulation Resistance | JIS C 5201 4.6 | Applied dielectric withstanding voltage for 605 sec. | >10G |
| Dielectric Withstanding Voltage | JIS C 5201 4.7 | Applied dielectric withstanding voltage for 605 sec. | No evidence of flashover, arcing or insulation breakdown |
| Short-time Overload | JIS C 5201 4.13 | Applied 2.5 times rated voltage for 5 sec. | (1.0% +0.05) Max |
| Temperature Cycling | JIS C 5201 4.19 | 1552 to -553, 5 cycles. | (2.0%+0.05) Max |
| Humidity | JIS C 5201 4.24 | 402, 90~95% RH, rated voltage applied for 1.5h, rest for 0.5h, repeated for 1000 +48/-0 hours. | (2.0%+0.05) Max |
| Load Life | JIS C 5201 4.25.1 | 702, ON TIME:1.5H, OFF TIME:0.5H, rated voltage applied for 1000 +24/-0 hours. | (2.0%+0.05) Max |
| Terminal Bending | JIS C 5201 4.33 | Bend maintained for 201 sec, bending distance 1 +0.2/0 mm. | (1.0%+0.05) Max |
| Moisture Resistance | MIL-STD-202 METHOD 106 | Cycles of temperature and humidity variation for 10 cycles, measurement after 244 hours. | (2.0% +0.05) Max |
Soldering Recommendations
Reflow Soldering Profile: (Refer to document page 12 for detailed curve)
Wave Soldering Profile: (Refer to document page 12 for detailed curve)
Hand Soldering: Iron temperature 35010, time less than 3 seconds. Avoid direct contact of solder iron tip to the component body.
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