Flame resistant polypropylene film capacitor KYET MMKP154J3F2701 ideal for snubber and SCR commutating circuit
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MMKP82 is a double-sided metallized polypropylene film capacitor (box-type) designed for high voltage and high-frequency pulse circuits. It features low loss, small internal temperature rise, a negative temperature coefficient of capacitance, and excellent flame resistance. Applications include electronic ballasts, compact fluorescent lamps, and snubber and SCR commutating circuits.
Product Attributes
- Brand: KYET (Dongguan Keya Electronic Technology Co., LTD)
- Origin: China (Dongguan)
- Material: Polypropylene film dielectric, double-sided metallized polyester film electrodes, tin-plated copper wire leads, flame retardant epoxy resin encapsulation.
- Color: Gray shell ()
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Applicable Temperature Range | -40 — +105℃ | GB/T 10190 (IEC 60384-16) |
| Rated Voltage (UR) | 400VDC / 630VDC / 1000VDC / 1250VDC / 1600VDC / 2000VDC / 3000VDC | |
| Capacitance Range | 0.0022 – 1.8µF | |
| Capacitance Tolerance | ±2% (G), ±3% (H), ±5% (J), ±10% (K) | Ref. item 4.2.2 |
| Dissipation Factor (tgδ) | ≤ 0.0010 (20℃, 1KHz, 0.1V) | Ref. item 4.2.3 |
| Dielectric Strength | 1.6UR, 5s (No breakdown or arcing) | Ref. item 4.2.1 |
| Insulation Resistance (IR) | ≥50000MΩ, C≤0.33µF; IR≥30000, C>0.33µF; (100V, 20℃, 1min) | Ref. item 4.3 |
| Solderability | Good tin plating | Ref. item 4.5 (Soldering bath method Tb, Method 1A) |
| Lead Strength (Tensile) | 0.5 ≤ φd ≤ 0.8mm, 10N; 1.0 ≤ φd ≤ 1.2mm, 20N | Ref. item 4.3 |
| Lead Strength (Bending) | 0.5 ≤ φd ≤ 0.8mm, 5N; 1.0 ≤ φd ≤ 1.2mm, 10N (Two consecutive bends in each direction) | Ref. item 4.3 |
| Resistance to Soldering Heat | No visible damage, clear marking | Ref. item 4.4 (Soldering bath method Tb, Method 1A) |
| Capacitance Change (after soldering heat) | ≤ ±2% of initial measurement | |
| Dissipation Factor Increase (after soldering heat) | ≤ 0.0020 (10kHz, C≤1.0µF) / ≤ 0.0020 (1kHz, C>1µF) | |
| Insulation Resistance (after soldering heat) | ≥ 50% of rated value | |
| Rapid Temperature Cycling | No visible damage, clear marking | Ref. item 4.6 |
| Capacitance Change (after temp. cycling) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after temp. cycling) | ≤ 0.0020 (10kHz, C≤1.0µF) / ≤ 0.0020 (1kHz, C>1µF) | |
| Insulation Resistance (after temp. cycling) | ≥ 50% of rated value | |
| Climatic Sequence (Dry Heat, Damp Heat, Cold) | No visible damage, clear marking | Ref. item 4.10.2, 4.10.3, 4.10.4 |
| Capacitance Change (after climatic sequence) | ≤ ±3% of initial measurement | |
| Dissipation Factor Increase (after climatic sequence) | ≤ 0.0030 (10kHz, C≤1.0µF) / ≤ 0.0030 (1kHz, C>1µF) | |
| Insulation Resistance (after climatic sequence) | ≥ 50% of rated value | |
| Damp Heat (Steady State) | No obvious bulging, clear marking | Ref. item 4.11 |
| Capacitance Change (after damp heat) | ≤ ±2% of initial measurement | |
| Dissipation Factor Increase (after damp heat) | ≤ 0.0010 (1kHz) | |
| Insulation Resistance (after damp heat) | ≥ 90% of rated value | |
| Endurance | No visible damage, clear marking | Ref. item 4.12 |
| Capacitance Change (after endurance) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after endurance) | ≤ 0.0020 (10kHz) | |
| Insulation Resistance (after endurance) | ≥ 50% of rated value | |
| Characteristics Dependent on Temperature | Capacitance measurement at points b, d, f | Ref. item 4.2.6 |
| Charging and Discharging | No cracking or burning | Ref. item 4.13 |
| Capacitance Change (after charge/discharge) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after charge/discharge) | ≤ 0.0030 (10KHz, 0.1V) | |
| Dielectric Strength (after charge/discharge) | 1.6UR | |
| Insulation Resistance (after charge/discharge) | ≥ 50% of rated value | |
| Pulse Voltage | No cracking or burning | |
| Capacitance Change (after pulse voltage) | ≤ ±5% of initial measurement | |
| Dissipation Factor Increase (after pulse voltage) | ≤ 0.0020 (10kHz) | |
| Insulation Resistance (after pulse voltage) | ≥ 50% of rated value | |
| Ripple Current | No cracking or burning | |
| Capacitance Change (after ripple current) | ≤ ±10% of initial measurement | |
| Dissipation Factor Increase (after ripple current) | ≤ 0.0030 (10kHz, 0.1V) / ≤ 0.0030 (1kHz, 1V) | |
| Insulation Resistance (after ripple current) | ≥ 50% of rated value | |
| Flame Retardancy Test | No continued burning for >30S after flame removal, no ignition of cotton paper by dripping | IEC695-2-2 (Needle flame test) |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina