Metallized Polypropylene Film Capacitor KYET KP684J2G1502 Featuring Plastic Case and UL V0 Flame Retardant Epoxy Resin
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This specification covers the requirements for CHIEFCON MPP (Metallized Polypropylene Film Capacitor, CBB22 Powder Type) from Dongguan City Keya Electronics Technology Co., Ltd. These capacitors are designed for general-purpose use and are suitable for various circuit applications. They are manufactured with a metallized polypropylene film dielectric and feature a special solder spray layer, copper-clad steel wire leads, and an epoxy resin encapsulation with UL V-0 flame retardant rating. The product is designed to operate within a wide temperature range and adhere to strict electrical and mechanical performance standards.
Product Attributes
- Brand: CHIEFCON
- Manufacturer: Dongguan City Keya Electronics Technology Co., Ltd.
- Origin: Dongguan, China
- Material: Metallized Polypropylene Film (Dielectric), Special Solder (Metal Spray), Copper-clad Steel Wire (Lead Wire), Epoxy Resin (Encapsulation), Plastic Case
- Certifications: UL V-0 (Flame Retardant Rating)
Technical Specifications
| Item | Description | Specification |
| Product Type | Metallized Polypropylene Film Capacitor (CBB22 Powder Type) | MPP / CBB22 |
| CHIEFCON P/N | KP684J2G1502 | |
| Capacitance | 0.68 uF (EIA Code: 684) | Tolerance: 5% (Code: J) |
| Rated Voltage | 400 VDC | |
| Dimensions (mm) | W: 17 1, H: 13.5 1, T: 7.0 1, P: 15 0.5, d: 0.8 0.05, L: 15 | |
| Operating Temperature Range | -40 to +100 | |
| Dielectric | Metallized Polypropylene Film | |
| Lead Wire | Copper-clad Steel Wire | Tinned |
| Encapsulation | Epoxy Resin | UL V-0 Flame Retardant |
| Plastic Case | UL V-0 Flame Retardant | |
| Withstand Voltage (Between Terminals) | 1.6 * Rated DC Voltage for 60 sec | No abnormality |
| Withstand Voltage (Between Terminals & Enclosure) | 2 * Rated Voltage + 500V for 2 to 5 sec (Min. 1000VDC) | No abnormality |
| Dissipation Factor (DF) | 0.001 (0.1%) at 1KHz, 25 | |
| Insulation Resistance (I.R.) | 10,000 M (C0.33uF) / 5,000 M*uF/C (C>0.33uF) at 100 VDC, 60 sec charge time | |
| Soldering Property | >90% circumferential surface of lead wire covered with solder | Soldering Temp: +260 5, Immersion: 2 0.5 sec |
| Terminal Strength (Tensile) | Apply 1.0Kg for 10 1 sec | No abnormality |
| Temperature Cycle Test | 5 cycles (-40 to +100) | Capacitance Change: 5%, DF: 0.002 (0.2%), IR: 50% of limit |
| Dry Heat Resistance Test | +100 2 for 16 1 hrs | Capacitance Change: 5%, DF: 0.002 (0.2%), IR: 50% of limit |
| Cold Resistance Test | -40 3 for 2 1 hrs | Capacitance Change: 5%, DF: 0.002 (0.2%), IR: 50% of limit |
| Damp Heat Test | +40 2, 90-95% RH for 2 1 hrs | Capacitance Change: 5%, DF: 0.002 (0.2%), IR: 50% of limit |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina