SAMXON Aluminum Electrolytic Capacitors

Product Overview

SAMXON Aluminum Electrolytic Capacitors offer a comprehensive range of miniature, large can, and V-chip solutions designed for various electronic and industrial applications. With features like high ripple current, low impedance, and extended load life, these capacitors are suitable for power supplies, audio equipment, and high-density circuit applications. They are manufactured with a focus on quality assurance and environmental compliance, adhering to RoHS directives and offering halogen-free options.

Product Attributes

• Brand: SAMXON
• Origin: PRC (Manufacturing Plants in Dongguan and Wuxi)
• Certifications/Compliance: RoHS Directive, EIAJ RCR-2367B, IEC 60384-4, JIS C - 5101-4

Technical Specifications

Miniature Aluminum Electrolytic Capacitors:

Large Can Aluminum Electrolytic Capacitors:

Screw Terminal Type Aluminum Electrolytic Capacitors:

V-Chip Aluminum Electrolytic Capacitors:

Application Guidelines

Circuit Design Considerations:

• Ensure operating environment and conditions are within catalog specifications.
• Operating temperature and ripple current must not exceed specified limits.
• Select capacitors that comply with the product's life requirements.
• Aluminum electrolytic capacitors are polarized; avoid reverse or AC voltage. Use non-polar types for circuits with potential reversed polarity.
• Avoid circuits requiring rapid and frequent charge/discharge; use special design capacitors for such applications.
• Do not apply excess voltage; ensure peak voltage (DC + ripple) does not exceed rated voltage. For series connections, use balancing resistors.
• Outer sleeve is not guaranteed as electrical insulator. Contact sales for applications requiring special insulation.
• Do not connect blank terminals (reinforcing terminals) of snap-in type products to other circuits to prevent short circuits.
• Avoid using capacitors in environments with water, brine, oil, toxic gases (HS, SO, NO, Cl, NH), ozone, UV, radiation, or severe vibration/shock exceeding specifications.
• Ensure PC board hole spacing matches lead spacing.
• Keep circuit patterns clear of the capacitor safety vent. Maintain specified clearance above the vent based on case diameter.
• For end-seal vented parts, create a hole on the PC board for gas release.
• Do not install screw terminal capacitors with the end seal side down. For horizontal mounting, the positive terminal must be upward.
• Electrolyte and separator paper are combustible; electrolyte is conductive. Avoid circuit patterns beneath the end seal to prevent corrosion or short circuits.
• Do not place heat-generating components near aluminum capacitors or on the reverse side of the PC board beneath the capacitor.
• Consider variations in electrical characteristics due to temperature and frequency.
• On double-sided PC boards, do not place capacitors over circuit patterns or unused holes.
• Ensure terminal screw torque is within specified values.
• When paralleling capacitors, consider current balance.

Mounting Precautions:

• Do not reuse a capacitor in other circuits after assembly and power application.
• Discharge capacitors using a 1k resistor before handling.
• Leakage current may increase after storage exceeding 6 months; perform voltage treatment with a 1k resistor if necessary.
• Confirm ratings and polarity before installation.
• Do not drop or use dropped capacitors.
• Be careful not to deform capacitors during installation.
• Ensure lead spacing matches PC board hole spacing.
• Snap-in type capacitors should be installed tightly to the PC board.
• Avoid excessive clinch force during automatic insertion.
• Be cautious of mechanical shock from automatic insertion machines or product checkers.
• Soldering conditions must be within SAMXON's specifications (Pb/Sn: 2355C 10s; Pb-free: 2605C 10s for flow soldering; Hand soldering: 35010C 3s for Pb/Sn, 40010C 3s for Pb-free).
• Do not tilt, lay down, or twist the capacitor body after soldering.
• Do not carry PC boards by grasping soldered capacitors.
• Prevent anything from touching the capacitor after soldering; ensure stacked boards do not cause contact. Avoid radiated heat effects.
• Do not clean capacitors with halogenated cleaning agents.
• When fixing or coating, avoid halogen-containing ingredients. Remove flux and contamination from the end seal gap and dry thoroughly before coating. Apply coating material partially, not around the entire body. Consult sales office regarding curing conditions.
• Do not install screw terminal capacitors with end seal side down. For horizontal mounting, the positive terminal must be upward.

Storage:

• Capacitor characteristics degrade with long-term static storage; deterioration rate depends on temperature and humidity.
• Store capacitors at 5C to 35C, with humidity less than 75% RH, out of direct sunlight.
• Capacitors stored for over one year should undergo voltage aging treatment before use to reform the oxide dielectric. Gradually apply rated voltage for 30-60 minutes. If leakage current exceeds specified values, do not use.

Disposal:

• Dispose of capacitors as industrial waste through professional waste disposal specialists.

Printed Circuit Board Cleaning:

• Halogen type organic solvents can permeate capacitors and cause corrosion due to chlorine ions.
• Recommended measures: Use non-hazardous cleaning agents (water, alcohol), mount on boards cleaned beforehand, or use epoxy end seals.
• Solvent penetration channels: clearance between rubber and case, clearance between rubber and lead wires, permeation through rubber end seal. Tight sealing and solvent-resistant rubber are crucial.

Basic Electrical Characteristics:

• Capacitance: Measured as AC capacitance at 120Hz, 0.5Vrms AC, with 1.5-2.0V DC bias. Capacitance decreases with increasing frequency and decreasing temperature.
• Tan (Dissipation Factor): Ratio of resistive to capacitive reactance. Increases with frequency and decreases with temperature.
• ESR (Equivalent Series Resistance): Composed of oxide layer and electrolyte/separator resistance. Increases as temperature decreases. Decreases with increasing frequency, stabilizing at a value mainly due to electrolyte/separator combination.
• Impedance (Z): Opposes AC current. Predominantly capacitive reactance at low frequencies, ESR at mid-frequencies, and inductive reactance at high frequencies. Varies with electrolyte temperature.
• Leakage Current: Small DC current that flows to reform the oxide layer. High initially, then stabilizes. Increases with temperature and voltage. Measured at 20C with rated voltage through a 1,000 resistor.

Part Number System

The part number system follows a structure: Series - Capacitance Code - Tolerance Code - Voltage Code - Case Size Code - Feature Code - Taping Code.

Taping Specifications

Detailed dimensions for taping specifications are provided, including diameter (D), height (A), lead diameter (d), component spacing (P), carrier tape width (W), and other relevant measurements for automated assembly.

Packing Specifications

Packing quantities are specified for both taping and bulk types, with inner and outer box quantities listed for various capacitor sizes.

Lead Forming Specifications

Specifications for lead forming (shape codes CB, HE, FD, KD, EC, PC) are provided with dimensions (F, H, H1, H2) and lead diameter (d).