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SMD chip common mode filter MetalLions ACM3216-2P-221TF ideal for USB2 point zero and LVDS audio line noise reduction

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Product Description

SMD Chip Common Mode Filters - ACM3216 Series

These winding type common mode filters offer a compact and low-profile solution for preventing common mode noise at high frequencies. They are designed for excellent solderability and operate within a temperature range of -40 to +125. Ideal for applications such as USB2.0 in PCs and peripherals, small digital AV equipment, and LVDS/Audio lines in notebooks and LCDs.

Product Attributes

  • Brand: Metal-Lions (implied by website URL)
  • Product Series: ACM3216
  • Certifications: Hazardous Substance Free Products (F)
  • Polarity: No Polarity

Technical Specifications

Part Number Dimensions (A x B x C) [mm] Number of Lines Common Mode Impedance () @ 100MHz DC Resistance () max. Rated Current (mA) max. Rated Voltage (Vdc) max. Withstand Voltage (Vdc) max. Insulation Resistance () min.
ACM3216-2P-900TF 3.2 x 1.6 x 1.9 2P 90 25% 0.30 400 50 125 10M
ACM3216-2P-121TF 3.2 x 1.6 x 1.9 2P 120 25% 0.30 350 50 125 10M
ACM3216-2P-161TF 3.2 x 1.6 x 1.9 2P 160 25% 0.40 350 50 125 10M
ACM3216-2P-221TF 3.2 x 1.6 x 1.9 2P 220 25% 0.45 300 50 125 10M
ACM3216-2P-261TF 3.2 x 1.6 x 1.9 2P 260 25% 0.50 300 50 125 10M
ACM3216-2P-331TF 3.2 x 1.6 x 1.9 2P 330 25% 0.60 300 50 125 10M
ACM3216-2P-361TF 3.2 x 1.6 x 1.9 2P 360 25% 0.60 300 50 125 10M
ACM3216-2P-601TF 3.2 x 1.6 x 1.9 2P 600 25% 0.80 300 50 125 10M
ACM3216-2P-801TF 3.2 x 1.6 x 1.9 2P 800 25% 0.90 300 50 125 10M
ACM3216-2P-102TF 3.2 x 1.6 x 1.9 2P 1000 25% 1.00 300 50 125 10M
ACM3216-2P-142TF 3.2 x 1.6 x 1.9 2P 1400 25% 1.00 220 50 125 10M
ACM3216-2P-202TF 3.2 x 1.6 x 1.9 2P 2000 25% 1.20 200 50 125 10M
ACM3216-2P-222TF 3.2 x 1.6 x 1.9 2P 2200 25% 1.20 200 50 125 10M

Dimensions

ACM3216 Series:

Dimensions in mm: A: 3.2 0.2, B: 1.6 0.2, C: 1.9 0.2

Recommended Footprint

(Diagram not provided in text, only dimensions)

Soldering Specifications

Solder Specifications: Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C.

Strength on pc board bending ability: Terminal electrode and ferrite strength must not be damaged. Apply a load of 0.9Kg in the arrow direction. Bend the substrate by 2mm and return.

Recommended PC board pattern: (Diagram not provided in text)

Reliability Test Conditions

High temperature resistance: Temp: +1252, Humidity: 60%RH max., Applied current: Rated current, Testing time: 50012 hours.

Thermal cycle: Temp: -40,+125 (stabilized for 30 min each), Cycle: 100 cycles.

Vibration: Frequency: 10 to 50 Hz, Amplitude: 1.52 mm, Dimension and times: X, Y, Z directions for 2 hours each.

Low temperature resistance: Temp: -402, Testing time: 50012 hours.

Packaging

Reel dimensions (mm): A: 180, B: 60, C: 13, D: 14.4, E: 8.4

Tape dimensions (mm; Tolerance: 0.1): W: 8, P: 4, P0: 4, P1: 2, A0: 1.75, B0: 3.45, K0: 2.05, t: 0.23

Packaging Form: Material of carrier tape: Polystyrene, Material of cover tape: Polyester. No continuation of more than two vacancies of the product.

Cover Tape Peel Strength: 0.05~0.69(N) at 5 ~ 35, 45 ~ 85% Humidity, 860 ~ 1060 hpa.

Packing Quantity: 180 mm reel T type: 2000 pcs./reel

Recommended Reflow Pattern

Reflow: Until two times. Use a solder iron of less than 30W. Do not allow the soldering iron tip to directly touch the ferrite body outside of the terminal electrode. 5 seconds max. at 260.

Iron Soldering: 60sec. Min. 150sec Max. 150 217 255 10sec. Max. Natural cooling.


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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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