Wire Wound Chip Common Mode Filters

These wire wound chip common mode filters offer a compact and low-profile solution for preventing common mode noise at high frequencies. They are designed for excellent solderability and can operate in temperatures ranging from -40 to +125. Applications include USB2.0 interfaces in PCs and peripheral equipment, small digital AV equipment, and LVDS lines in Note PCs and LCDs, as well as audio lines.

Product Attributes

• Brand: Metal-Lions (inferred from URL)
• Certifications: Hazardous Substance Free Products (F)

Technical Specifications

Dimensions

A: 2.0 0.2 mm
B: 1.2 0.2 mm
C: 1.2 0.2 mm

Land Pattern

Unit: mm
0.4 0.8 1.0 0.4 1.2 2.6

Soldering Specifications

Solder Specifications: Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C. The terminal electrode and the ferrite must not be damaged.
Strength on pc board bending ability: Solder a chip to test substrate, and then laterally apply a strength load 0.5Kg in the arrow direction. The terminal electrode and the ferrite must not be damaged.
Soldering condition: Solder a chip to a test substrate, bend the substrate by 2mm and then return.
Recommendation soldering condition: Apply cream solder to the test circuit board. It is mounted on the recommendation soldering condition.

Reliability Test

High temperature resistance: Temperature: +1252, Applied voltage: Rated voltage, Applied current: Rated current, Testing time: 50012 hours. Measurement: After placing for 24 hours min. insulation resistance: >10(M), DC resistance: standard value inside.
Low temperature resistance: Temperature: -402, Testing time: 50012 hours. Measurement: After placing for 24 hours min.
Thermal cycle: Temperature: -40,+125 kept stabilized for 30 minutes each. Cycle: 100 cycle. Measurement: After placing for 24 hours min.
Humidity: Temperature: +852, Humidity: 90 to 95%RH, Applied current: Rated current, Applied voltage: Rated voltage, Testing time: 50012 hours. Measurement: After placing for 24 hours min.
Vibration: Frequency: 10 to 50 Hz, Amplitude: 1.52 mm, Dimension and times: X, Y and Z directions for 2 hours each.

Packaging

Packaging Form: Material of carrier tape: Polystyrene, Material of cover tape: Polyester. There shall not continuation more than two vacancies of the product.
Cover Tape Peel Strength: The force for tearing off cover tape is 0.1~0.69(N) in the arrow direction at the following conditions: Temperature: 5 ~ 35, Humidity: 45 ~ 85%, Atmospheric pressure: 860 ~ 1060 hpa.
Packing Quantity: 2000 pcs./reel (180 mm reel T type).

Recommended Reflow Pattern

Reflow: until two times. 150 (60sec. Min. 150sec Max.), 217 (10sec. Max.), 255 (5 seconds max. at 260). Natural cooling.
Iron Soldering: Use a solder iron of less than 30W when soldering, do not allow the soldering iron tip directly touch the ferrite body outside of terminal electrode.