Compact SMD Chip Common Mode Filter MetalLions ACM3216-2P-142TF for High Frequency Noise Suppression

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Product Description

SMD Chip Common Mode Filters - ACM3216 Series

These high-frequency common mode filters are designed with a winding type to achieve a small size and low profile, making them ideal for compact electronic devices. They effectively prevent common mode noise in high-frequency applications, offering excellent solderability and a wide operating temperature range of -40 to +125. Applications include USB2.0 interfaces for PCs and peripherals, small digital AV equipment, and LVDS and audio lines in notebook PCs and LCDs.

Product Attributes

Brand: Metal-Lions (implied by website URL)
Product Series: ACM3216 Series
Hazardous Substance Free: Yes (indicated by 'F' in part number)

Technical Specifications

Part Number	Dimensions (A x B x C) [mm]	Number of Lines	Common Mode Impedance (Ω) @ 100MHz (±25%)	DC Resistance (Ω) max.	Rated Current (mA) max.	Rated Voltage (Vdc) max.	Withstand Voltage (Vdc) max.	IR (Ω) min.
ACM3216-2P-900TF	3.2 x 1.6 x 1.9	2P	90	0.30	400	50	125	10M
ACM3216-2P-121TF	3.2 x 1.6 x 1.9	2P	120	0.30	350	50	125	10M
ACM3216-2P-161TF	3.2 x 1.6 x 1.9	2P	160	0.40	350	50	125	10M
ACM3216-2P-221TF	3.2 x 1.6 x 1.9	2P	220	0.45	300	50	125	10M
ACM3216-2P-261TF	3.2 x 1.6 x 1.9	2P	260	0.50	300	50	125	10M
ACM3216-2P-331TF	3.2 x 1.6 x 1.9	2P	330	0.60	300	50	125	10M
ACM3216-2P-361TF	3.2 x 1.6 x 1.9	2P	360	0.60	300	50	125	10M
ACM3216-2P-601TF	3.2 x 1.6 x 1.9	2P	600	0.80	300	50	125	10M
ACM3216-2P-801TF	3.2 x 1.6 x 1.9	2P	800	0.90	300	50	125	10M
ACM3216-2P-102TF	3.2 x 1.6 x 1.9	2P	1000	1.00	300	50	125	10M
ACM3216-2P-142TF	3.2 x 1.6 x 1.9	2P	1400	1.00	220	50	125	10M
ACM3216-2P-202TF	3.2 x 1.6 x 1.9	2P	2000	1.20	200	50	125	10M
ACM3216-2P-222TF	3.2 x 1.6 x 1.9	2P	2200	1.20	200	50	125	10M

Packaging

Reel Diameter (φ)	Quantity	Carrier Tape Material	Cover Tape Material	Cover Tape Peel Strength
180 mm	2000 pcs./reel (T type)	Polystyrene	Polyester	0.05~0.69 N (at 5~35, 45~85% RH, 860~1060 hpa)

Soldering and Reliability

Test Condition	Description
Solder Specifications	Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255°C ±5°C. Terminal electrode and ferrite strength must not be damaged.
Strength on pc board bending ability	Solder a chip to test substrate, then laterally apply a load 0.9Kg in the arrow direction. Terminal electrode and ferrite must not be damaged. Bend substrate by 2mm and return.
High temperature resistance	+125±2°C, Rated voltage, Rated current, 500±12 hours. Insulation resistance: >10(MΩ), DC resistance: standard value.
Low temperature resistance	-40±2°C, 500±12 hours.
Thermal cycle	-40°C, +125°C (30 min. each), 100 cycles.
Vibration	Frequency: 10 to 50 Hz, Amplitude: 1.52 mm. X, Y, Z directions for 2 hours each. Appearance: Ferrite shall not be damaged.
Recommended Reflow Pattern	Iron Soldering: Use a solder iron of less than 30W, do not allow tip directly touch ferrite body outside terminal electrode. 5 seconds max. at 260°C. Reflow: 60sec. Min. 150sec Max. @ 150°C, 217°C, 255°C (10sec. Max.). Natural cooling.