Mini Molded Chip Power Inductors MetalLions MTQH322510S100MBT for High Current Low Loss Applications
MTQH3225 Series Mini Molded Chip Power Inductors
The MTQH3225 Series Mini Molded Chip Power Inductors are designed for high-current and low-loss applications. Featuring a metal material construction for enhanced performance, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors offer reliable operation. They are RoHS compliant and suitable for a wide operating temperature range of -55 to +125 (including self-temperature rise).
Key Applications:
- Smartphones and tablets
- Notebooks, VR, and AR devices
- Portable gaming devices, smart wearables
- Wi-Fi modules
Product Attributes:
- Series Name: MTQH (Mini Molding Chip type power inductor)
- Material Code: S Type
- Coating Color: B (Black)
- Compliance: RoHS compliant
Explanation of Part Number:
MTQH 322510 S 2R2 M B T
- 1: Series Name (MTQH)
- 2: Size Code (e.g., 322510 for 3.2*2.5*1.0mm)
- 3: Material Code (S)
- 4: Initial Inductance Value (e.g., 2R2 = 2.2uH)
- 5: Tolerance of Inductance (M: 20%)
- 6: Coating Color (B: Black)
- 7: Packing (T: Tape Carrier Package)
- 8: Internal Code (A, B)
Technical Specifications:
Dimensions: [mm]
Land Pattern: [mm]
Series Overview:
| Series | L [mm] | G [mm] | W [mm] | T [mm] | A [mm] | B [mm] | C [mm] | A [mm] |
|---|---|---|---|---|---|---|---|---|
| MTQH322512S | 3.20.2 | 0.90.2 | 2.50.2 | 1.20Max. | 3.25 | 0.90 | 2.55 | 1.20Max. |
| MTQH322510S | 3.20.2 | 0.90.2 | 2.50.2 | 1.00Max. | 3.25 | 0.90 | 2.55 | 1.00Max. |
| MTQH322520S | 3.20.2 | 0.90.2 | 2.50.2 | 2.00Max. | 3.25 | 0.90 | 2.55 | 2.00Max. |
Electrical Properties:
| P/N | L0(H) @(0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH322512SR10MBT | 0.10 | 5.2 | 7.0 | 12.0 | 11.0 | 18.0 | 16.5 |
| MTQH322512SR22MBT | 0.22 | 6.6 | 10 | 9.2 | 8.7 | 11.5 | 11.0 |
| MTQH322512SR24MBT | 0.24 | 7.0 | 12 | 9.0 | 8.5 | 11 | 10.5 |
| MTQH322512SR33MBT | 0.33 | 9.0 | 14 | 8.4 | 8.1 | 10 | 9.5 |
| MTQH322512SR47MBT | 0.47 | 14 | 19 | 7.5 | 7.2 | 8.6 | 8.2 |
| MTQH322512SR47MBTA | 0.47 | 11 | 14 | 7.5 | 7.2 | 8.6 | 8.2 |
| MTQH322512SR68MBT | 0.68 | 18 | 23 | 7.3 | 6.8 | 8.1 | 7.7 |
| MTQH322512SR68MBTA | 0.68 | 12 | 15 | 7.0 | 6.5 | 8.0 | 7.5 |
| MTQH322512S1R0MBT | 1.0 | 26 | 30 | 5.3 | 4.8 | 6.6 | 5.8 |
| MTQH322512S1R0MBTA | 1.0 | 18 | 21 | 5.5 | 5.0 | 7.7 | 7.0 |
| MTQH322512S1R5MBT | 1.5 | 37 | 44 | 4.7 | 4.3 | 5.1 | 4.7 |
| MTQH322512S2R2MBT | 2.2 | 58 | 70 | 3.6 | 3.0 | 4.6 | 4.2 |
| MTQH322512S2R2MBTA | 2.2 | 42 | 50 | 3.8 | 3.5 | 5.0 | 4.5 |
| MTQH322512S3R3MBT | 3.3 | 75 | 95 | 2.9 | 2.5 | 3.7 | 3.2 |
| MTQH322512S4R7MBT | 4.7 | 115 | 135 | 2.3 | 2.0 | 2.9 | 2.6 |
| MTQH322512S6R8MBT | 6.8 | 177 | 210 | 2.1 | 1.9 | 2.8 | 2.4 |
| MTQH322512S100MBT | 10.0 | 210 | 230 | 2.2 | 1.8 | 2.3 | 1.9 |
| MTQH322510SR33MBT | 0.33 | 11 | 15 | 8.3 | 7.8 | 8.3 | 7.8 |
| MTQH322510SR47MBT | 0.47 | 17 | 22 | 6.4 | 5.9 | 8.3 | 7.6 |
| MTQH322510SR68MBT | 0.68 | 22 | 28 | 6.2 | 5.7 | 7.5 | 7.0 |
| MTQH322510S1R0MBT | 1.0 | 25 | 30 | 5.4 | 4.9 | 6.0 | 5.3 |
| MTQH322510S1R5MBT | 1.5 | 34 | 42 | 4.0 | 3.6 | 5.0 | 4.4 |
| MTQH322510S2R2MBT | 2.2 | 55 | 66 | 3.7 | 3.4 | 4.0 | 3.5 |
| MTQH322510S3R3MBT | 3.3 | 105 | 120 | 2.7 | 2.3 | 3.7 | 3.3 |
| MTQH322510S4R7MBT | 4.7 | 125 | 140 | 2.3 | 1.9 | 2.8 | 2.5 |
| MTQH322510S6R8MBT | 6.8 | 290 | 320 | 1.9 | 1.6 | 2.4 | 2.0 |
| MTQH322510S100MBT | 10.0 | 325 | 365 | 2.2 | 1.8 | 2.2 | 1.8 |
| MTQH322520SR33MBT | 0.33 | 7.5 | 9 | 9.5 | 9 | 15.5 | 14 |
| MTQH322520SR47MBT | 0.47 | 9 | 10.5 | 9.5 | 8.5 | 15 | 13 |
| MTQH322520SR68MBT | 0.68 | 12.5 | 14.5 | 9.0 | 8.0 | 13 | 11 |
| MTQH322520S1R0MBT | 1.0 | 15 | 17.5 | 8.2 | 7.5 | 9.0 | 8.3 |
| MTQH322520S2R2MBT | 2.2 | 36 | 43 | 5.4 | 4.8 | 6.5 | 5.5 |
| MTQH322520S3R3MBT | 3.3 | 55 | 60 | 4.5 | 4.0 | 4.5 | 3.5 |
| MTQH322520S4R7MBT | 4.7 | 81 | 94 | 3.5 | 3.0 | 4.0 | 3.0 |
Test Remarks:
- Note 1: All test data is referenced to 25 ambient.
- Note 2: Test Condition: 1MHz, 1.0Vrms.
- Note 3: Irms: DC current (A) that will cause an approximate T of 40.
- Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Note 5: Operating Temperature Range -55 to +125.
- Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions. Part temperature should be verified in the end application.
- Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605) for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% P c-b = (Lb - Lc)/Lc 100%; 100% P c-d = (Ld - Lc)/Lc 100% |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Load life | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation):
Solder: Sn96.5 / Ag3 / Cu0.5
| Profile Feature | Temperature | Time |
|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 - 200 | 60 -120 seconds (ts) |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. | |
| Time maintained above TL (217) | 217 | 60-150 seconds (tL) |
| Peak Temperature (Tp) | 260 | Time within 5 of actual peak Temperature (tp): 10 seconds |
| Ramp-down Rate | 6/second max. | |
| Time 25 to Peak Temperature | 8 minutes max. |
Allowed Re-flow times: 2 times
Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing Dimension of plastic taping:
Quantity: 3000pcs/Reel
| Dimension | A 0.5 | B 0.5 | C 0.5 | D 1 | All |
|---|---|---|---|---|---|
| Reel Dimension | 178 | 60 | 12 | 1.5 |
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 322510 | 8.00 | 2.90 | 3.50 | 1.50 | 1.0 | 1.75 | 3.50 | 1.20 | 4.00 | 2.00 | 4.00 | 0.23 |
| 322512 | 8.00 | 2.90 | 3.50 | 1.50 | 1.0 | 1.75 | 3.50 | 1.40 | 4.00 | 2.00 | 4.00 | 0.23 |
| 322520 | 8.00 | 2.90 | 3.50 | 1.50 | 1.0 | 1.75 | 3.50 | 2.20 | 4.00 | 2.00 | 4.00 | 0.28 |
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