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Mini Molded Chip Power Inductor with Metal Material and Vinyl Coating MetalLions MTQH322512S1R0MBT

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Product Description

MTQH3225 Series Mini Molded Chip Power Inductors

Product Overview

The MTQH3225 Series Mini Molded Chip Power Inductors are designed for high-current and low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these RoHS-compliant inductors offer reliable performance across a wide operating temperature range of -55 to +125. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.

Product Attributes

  • Brand: Metal-Lions (implied by URL)
  • Series Name: MTQH3225 Series
  • Type: Mini Molding Chip type power inductor
  • Material: Metal
  • Coating: Vinyl thermal spray
  • Magnetic Circuit: Closed magnetic circuit design
  • Compliance: RoHS compliant
  • Coating Color: Black (B)

Technical Specifications

Dimensions and Land Pattern

Dimensions: [mm]
Land Pattern: [mm]

Series L (mm) G (mm) W (mm) T (mm) A (Max.) Land Pattern A (mm) Land Pattern B (mm) Land Pattern C (mm)
MTQH322512S 3.2 0.2 0.9 0.2 2.5 0.2 1.20 Max. 1.20 3.25 0.90 2.55
MTQH322510S 3.2 0.2 0.9 0.2 2.5 0.2 1.00 Max. 1.00 3.25 0.90 2.55
MTQH322520S 3.2 0.2 0.9 0.2 2.5 0.2 2.00 Max. 2.00 3.25 0.90 2.55

Electrical Properties

Test Condition: 1MHz, 1.0Vrms @ 25 ambient.

Note: Irms: DC current (A) that will cause an approximate T of 40 . Isat: DC current (A) that will cause L0 to drop approximately 30%.

P/N L0 (H) @ (0A) 1MHz Rdc (m) Heat Rating Current Irms (A) Saturation Current Isat (A)
Typical Max Typical Max Typical Max
MTQH322510S (3.2*2.5*1.0mm)
MTQH322510SR33MBT 0.33 11 15 8.3 7.8 8.3 7.8
MTQH322510SR47MBT 0.47 17 22 6.4 5.9 8.3 7.6
MTQH322510SR68MBT 0.68 22 28 6.2 5.7 7.5 7.0
MTQH322510S1R0MBT 1.0 25 30 5.4 4.9 6.0 5.3
MTQH322510S1R5MBT 1.5 34 42 4.0 3.6 5.0 4.4
MTQH322510S2R2MBT 2.2 55 66 3.7 3.4 4.0 3.5
MTQH322510S3R3MBT 3.3 105 120 2.7 2.3 3.7 3.3
MTQH322510S4R7MBT 4.7 125 140 2.3 1.9 2.8 2.5
MTQH322510S6R8MBT 6.8 290 320 1.9 1.6 2.4 2.0
MTQH322510S100MBT 10.0 325 365 2.2 1.8 2.2 1.8
MTQH322512S (3.2*2.5*1.2mm)
MTQH322512SR10MBT 0.10 5.2 7.0 12.0 11.0 18.0 16.5
MTQH322512SR22MBT 0.22 6.6 10 9.2 8.7 11.5 11.0
MTQH322512SR24MBT 0.24 7.0 12 9.0 8.5 11 10.5
MTQH322512SR33MBT 0.33 9.0 14 8.4 8.1 10 9.5
MTQH322512SR47MBT 0.47 14 19 7.5 7.2 8.6 8.2
MTQH322512SR47MBTA 0.47 11 14 7.5 7.2 8.6 8.2
MTQH322512SR68MBT 0.68 18 23 7.3 6.8 8.1 7.7
MTQH322512SR68MBTA 0.68 12 15 7.0 6.5 8.0 7.5
MTQH322512S1R0MBT 1.0 26 30 5.3 4.8 6.6 5.8
MTQH322512S1R0MBTA 1.0 18 21 5.5 5.0 7.7 7.0
MTQH322512S1R5MBT 1.5 37 44 4.7 4.3 5.1 4.7
MTQH322512S2R2MBT 2.2 58 70 3.6 3.0 4.6 4.2
MTQH322512S2R2MBTA 2.2 42 50 3.8 3.5 5.0 4.5
MTQH322512S3R3MBT 3.3 75 95 2.9 2.5 3.7 3.2
MTQH322512S4R7MBT 4.7 115 135 2.3 2.0 2.9 2.6
MTQH322512S6R8MBT 6.8 177 210 2.1 1.9 2.8 2.4
MTQH322512S100MBT 10.0 210 230 2.2 1.8 2.3 1.9
MTQH322520S (3.2*2.5*2.0mm)
MTQH322520SR33MBT 0.33 7.5 9 9.5 9 15.5 14
MTQH322520SR47MBT 0.47 9 10.5 9.5 8.5 15 13
MTQH322520SR68MBT 0.68 12.5 14.5 9.0 8.0 13 11
MTQH322520S1R0MBT 1.0 15 17.5 8.2 7.5 9.0 8.3
MTQH322520S2R2MBT 2.2 36 43 5.4 4.8 6.5 5.5
MTQH322520S3R3MBT 3.3 55 60 4.5 4.0 4.5 3.5
MTQH322520S4R7MBT 4.7 81 94 3.5 3.0 4.0 3.0

Operating Conditions

Parameter Value
Operating Temperature Range -55125 (Including self temp. rise)

Reliability

Item Requirements Test Methods and Remarks
Insulation Resistance 100M 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability 90% or more of electrode area shall be coated by new solder. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat No visible mechanical damage. Inductance change: Within 10%. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode Strong bond between the pad and the core, without come off PCB. Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds.
High temperature No case deformation or change in appearance. Inductance change: Within 10% Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature No visible mechanical damage. Inductance change: Within 10% Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock No visible mechanical damage. Inductance change: Within 10% The test sample shall be placed at (-553)and (1253)for (303) , different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic Inductance change Pc-b,Pc-d: Within 20% a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b c c P Lb L L c-d 100% c c P Ld L L
Static Humidity No visible mechanical damage. Inductance change: Within 10% Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
Load life No visible mechanical damage. Inductance change: Within 10% Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

Soldering Condition (Recommendation)

Profile Feature Lead (Pb)-Free solder
Preheat: Temperature Min (Tsmin) 150
Preheat: Temperature Max (Tsmax) 200
Preheat: Time (Tsmin to Tsmax ) (ts) 60 -120 seconds
Average ramp-up rate (Ts max to Tp) 3/ second max.
Time maintained above : Temperature (TL) 217
Time maintained above : Time (tL) 60-150 seconds
Peak Temperature (Tp) 260
Time within + 5 of actual peak Temperature (tp) 2 10 seconds
Ramp-down Rate 6/second max.
Time 25to Peak Temperature 8 minutes max.
Allowed Re-flow times 2 times
Remark To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.

Packing Dimension

Dimension of plastic taping: (Unit: mm)

Type A 0.5 B 0.5 C 0.5 D 1 All
178 60 12 1.5

Packing Quantity3000pcs/Reel

Dimension of Reel: (Unit: mm)

Series W 0.30 A0 0.05 B0 +0.1/-0 D +0.1/-0 D1 Min E 0.10 F 0.10 K0 0.05 P0 0.10 P2 0.10 P 0.10 T 0.05
322510 8.00 2.90 3.50 1.50 1.0 1.75 3.50 1.20 4.00 2.00 4.00 0.23
322512 8.00 2.90 3.50 1.50 1.0 1.75 3.50 1.40 4.00 2.00 4.00 0.23
322520 8.00 2.90 3.50 1.50 1.0 1.75 3.50 2.20 4.00 2.00 4.00 0.28

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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