Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Mini Molded Chip Power Inductor MetalLions MTQH303018B4R7MBT for High Current Low Loss Applications

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Price: Negotiable
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Delivery Time: Negotiable
Product Description

Product Overview

The MTQH3030 Series Mini Molded Chip Power Inductors are designed for high current and low loss applications, featuring a closed magnetic circuit to minimize leakage flux. These RoHS-compliant inductors utilize a vinyl thermal spray for enhanced surface compactness. They are ideal for a wide range of electronic devices including smartphones, tablets, notebooks, VR/AR systems, portable gaming devices, smart wearables, and Wi-Fi modules.

Product Attributes

  • Series Name: MTQH3030 Series
  • Type: Mini Molding Chip type power inductor
  • Material Code: B Type
  • Coating Color: Black (B)
  • Compliance: RoHS compliant
  • Operating Temperature Range: -55125 (Including self-temp. rise)

Technical Specifications

Dimensions and Land Pattern

Series L [mm] W [mm] T [mm] A [mm] B [mm] C [mm]
MTQH303012B 3.00.1 1.00.2 3.00.1 1.2Max. 2.90 0.90
MTQH303015B 3.00.1 1.00.2 3.00.1 1.5Max. 2.90 0.90
MTQH303018B 3.00.1 1.00.2 3.00.1 1.8Max. 2.90 0.90
MTQH303020B 3.00.1 1.00.2 3.00.1 2.0Max. 2.90 0.90

Electrical Properties (Sample Data)

P/N L0 (H) @ 1MHz (0A) Rdc (m) Typical Rdc (m) Max Irms (A) Typical Irms (A) Max Isat (A) Typical Isat (A) Max
MTQH303012B100MBT 10.0 192 220 2.3 2.0 2.3 2.0
MTQH303015B220MBT 22.0 580 700 1.2 1.0 1.6 1.2
MTQH303018BR22MBT 0.22 5.5 7.0 10.0 9.0 17 16
MTQH303018B1R5MBT 1.5 20 26 6.8 6.4 8.0 7.0
MTQH303018B4R7MBT 4.7 72 87 3.4 3.0 4.7 4.2
MTQH303020BR33MBT 0.33 7.5 9 10.0 9.0 17 15
MTQH303020BR50MBT 0.5 9.0 12 9.0 8.0 15 13
MTQH303020BR68MBT 0.68 13 16 8.5 7.8 13 11
MTQH303020B1R0MBT 1.0 14 20 6.5 6.0 8.0 7.3
MTQH303020B1R5MBT 1.5 19 25 6.3 5.8 7.0 6.5
MTQH303020B2R2MBT 2.2 37 45 4.7 4.3 6.0 5.5
MTQH303020B3R3MBT 3.3 52 63 4.5 4.0 5.9 5.4
MTQH303020B4R7MBT 4.7 60 73 4.2 3.8 4.8 4.0
MTQH303020B6R8MBT 6.8 107 135 3.2 3.0 4.5 3.8
MTQH303020B100MBT 10.0 135 160 2.5 2.2 3.8 3.3

Test Conditions

  • All test data is referenced to 25 ambient.
  • Test Condition: 1MHz, 1.0Vrms.
  • Irms: DC current (A) that will cause an approximate T of 40.
  • Isat: DC current (A) that will cause L0 to drop approximately 30%.
  • Operating Temperature Range: -55 to +125.
  • The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions. Part temperature should be verified in the end application.
  • The rated current as listed is either the saturation current or the heating current depending on which value is lower.

Reliability

Item Requirements Test Methods and Remarks
Insulation Resistance 100M 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability 90% or more of electrode area shall be coated by new solder. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat No visible mechanical damage. Inductance change: Within 10%. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode Strong bond between the pad and the core, without come off PCB. Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds.
High temperature No case deformation or change in appearance. Inductance change: Within 10% Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature No visible mechanical damage. Inductance change: Within 10% Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock No visible mechanical damage. Inductance change: Within 10% The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic Inductance change Pc-b,Pc-d: Within 20% a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b c c P Lb L L c-d 100% c c P Ld L L
Static Humidity No visible mechanical damage. Inductance change: Within 10% Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
Storage Test No visible mechanical damage. Inductance change: Within 10% Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

Recommended Soldering Condition (Reflow Soldering Profile)

Profile Feature Lead (Pb)-Free solder (Sn96.5 / Ag3 / Cu0.5)
Preheat: Temperature Min (Tsmin) 150
Preheat: Temperature Max (Tsmax) 200
Preheat: Time (tsmin to tsmax) 60 -120 seconds
Average ramp-up rate (Tsmax to Tp) 3/ second max.
Time maintained above TL (217) 60-150 seconds
Peak Temperature (Tp) 260
Time within +5 of actual peak Temperature (tp) 10 seconds
Ramp-down Rate 6/second max.
Time 25 to Peak Temperature 8 minutes
Allowed Re-flow times 2 times
Remark To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.

Packing Dimension of Plastic Taping (Unit: mm)

Type A 0.5 B 0.5 C 0.5 D 1
All 178 60 12 1.5

Reel Dimensions (Unit: mm)

Series W 0.30 A0 0.05 B0 +0.1/-0 D +0.1/-0 D1 Min E 0.10 F 0.10 K0 0.05 P0 0.10 P2 0.10 P 0.10 T 0.05
303012 12.0 3.35 3.40 1.50 1.0 1.75 3.50 1.35 4.00 2.00 4.00 0.23
303015 12.0 3.35 3.45 1.50 1.0 1.75 5.50 1.70 4.00 2.00 8.00 0.35
303018 12.0 3.35 3.45 1.50 1.0 1.75 5.50 2.00 4.00 2.00 8.00 0.35
303020 12.0 3.40 3.40 1.50 1.0 1.75 5.50 2.20 4.00 2.00 8.00 0.35

Packing Quantity: 3000pcs/Reel


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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