High Frequency Noise Prevention Wire Wound Chip Common Mode Filters MetalLions ACM2012-2P-901TF Features
Wire Wound Chip Common Mode Filters
These wire wound chip common mode filters are designed for high-frequency noise prevention, offering a small size and low profile due to their winding type. They provide excellent solderability and are suitable for a wide operating temperature range of -40 to +125. Applications include USB2.0 in PCs and peripheral equipment, small digital AV equipment, and LVDS lines in Note PCs and LCDs, as well as audio lines.
Product Attributes
- Brand: Metal-Lions (implied by www.metal-lions.com)
- Product Series: ACM2012 Series
- Hazardous Substance Free: Yes (indicated by 'F' in part number)
Technical Specifications
| Part Number | Common-Mode Impedance Z() at 100MHz | Rated Voltage Vdc(V) | DC Resistance Rdc() Max. | Rated Current Idc(mA) Max. | Insulation Resistance (M)Min. |
| ACM2012-2P-300TF | 30 25% | 450 | 0.20 | 50 | 10 |
| ACM2012-2P-670TF | 67 25% | 400 | 0.25 | 50 | 10 |
| ACM2012-2P-900TF | 90 25% | 400 | 0.30 | 50 | 10 |
| ACM2012-2P-121TF | 12025% | 370 | 0.30 | 50 | 10 |
| ACM2012-2P-161TF | 16025% | 350 | 0.35 | 50 | 10 |
| ACM2012-2P-181TF | 18025% | 330 | 0.35 | 50 | 10 |
| ACM2012-2P-201TF | 20025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-221TF | 22025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-261TF | 26025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-361TF | 36025% | 280 | 0.45 | 50 | 10 |
| ACM2012-2P-601TF | 60025% | 200 | 0.55 | 50 | 10 |
| ACM2012-2P-671TF | 67025% | 150 | 0.60 | 50 | 10 |
| ACM2012-2P-801TF | 80025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-901TF | 90025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-102TF | 100025% | 150 | 1.30 | 50 | 10 |
| ACM2012-2P-222TF | 220025% | 100 | 2.00 | 50 | 10 |
Dimensions
A: 2.0 0.2 mm
B: 1.2 0.2 mm
C: 1.2 0.2 mm
Land Pattern
Unit: mm
Dimensions: 0.4 (width) x 1.2 (length) for each terminal, with 0.8mm spacing between terminals and 2.6mm total width.
Soldering Specifications
Solder Pot: 96.5 Sn/3.5 Ag solder at 255C 5C.
Conditions: Dip pads in flux, then dip in solder pot. Terminal electrode and ferrite must not be damaged. Strength on pc board bending ability test: bend substrate by 2mm and return. Soldering iron: less than 30W, tip not to touch ferrite body outside terminal electrode, 5 seconds max. at 260C.
Packaging
Reel Dimensions (mm): A: 180, B: 60, C: 13, D: 14.4, E: 8.4
Carrier Tape Material: Polystyrene
Cover Tape Material: Polyester
Cover Tape Peel Strength: 0.1~0.69 N (at 5~35, 45~85% RH, 860~1060 hpa)
Packing Quantity: 2000 pcs./reel (180 mm reel)
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.