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mini molded chip power inductors MetalLions MTQH201210S100MBT for high current electronic device applications

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Product Description

Product Overview

The MTQH2012 Series Mini Molded Chip Power Inductors are designed for high-performance applications requiring large current handling and low loss. Featuring a closed magnetic circuit design to minimize leakage flux and a vinyl thermal spray for improved surface compactness, these RoHS-compliant inductors are suitable for a wide range of electronic devices. Applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.

Product Attributes

  • Brand: Metal-Lions (implied by URL)
  • Series Name: MTQH2012 Series
  • Type: Mini Molding Chip type power inductor
  • Material: Metal material
  • Coating: Vinyl thermal spray
  • Compliance: RoHS compliant
  • Operating Temperature Range: -55125 (Including self temp. rise)
  • Coating Color: Black (for 'B' in part number)
  • Internal Code: A, B

Technical Specifications

Dimensions and Land Pattern

Series L (mm) G (mm) W (mm) T (mm) A (mm) B (mm) C (mm)
MTQH201265 2.00.2 0.50.2 1.20.2 0.65Max. 2.10 0.50 1.30
MTQH201208 2.00.2 0.50.2 1.20.2 0.80Max. 2.10 0.50 1.30
MTQH201210 2.00.2 0.50.2 1.20.2 1.00Max. 2.10 0.50 1.30

Electrical Properties - MTQH201265 Series (2.0*1.2*0.65mm)

P/N L0(H) @ (0A) 1MHz Rdc(m Heat rating current Irms(A) Saturation current Isat(A)
Typical Max Typical Max Typical Max
MTQH201265S1R0MBT 1.0 78 86 2.6 2.3 2.8 2.5
MTQH201265B1R0MBT 1.0 95 110 2.5 2.2 2.7 2.4
MTQH201265S2R2MBT 2.2 215 230 1.7 1.4 1.8 1.5

Electrical Properties - MTQH201208 Series (2.0*1.2*0.8mm)

P/N L0(H) @ (0A) 1MHz Rdc(m Heat rating current Irms(A) Saturation current Isat(A)
Typical Max Typical Max Typical Max
MTQH201208SR24MBT 0.24 17 20 6.0 5.5 7.0 6.6
MTQH201208SR33MBT 0.33 33 45 4.3 4.0 5.2 4.8
MTQH201208SR47MBT 0.47 34 50 3.5 3.3 5.0 4.6
MTQH201208SR47MBTA 0.47 24 28 4.7 4.5 5.2 4.8
MTQH201208DR47MBT 0.47 34 42 4.3 3.9 5.2 4.8
MTQH201208SR68MBT 0.68 50 60 3.7 3.3 4.2 3.7
MTQH201208S1R0MBT 1.0 55 70 3.3 2.9 4.0 3.5
MTQH201208S1R0MBTA 1.0 48 55 3.2 2.8 3.2 2.8
MTQH201208S1R5MBT 1.5 118 135 2.2 1.9 3.0 2.5
MTQH201208S2R2MBT 2.2 160 185 2.2 1.8 2.6 2.3
MTQH201208S3R3MBT 3.3 253 300 1.8 1.5 1.9 1.6
MTQH201208S4R7MBT 4.7 285 325 1.7 1.5 1.6 1.4
MTQH201208SR24MBT 0.24 18 23 6.5 5.9 6.5 6.0

Electrical Properties - MTQH201210 Series (2.0*1.2*1.0mm)

P/N L0(H) @ (0A) 1MHz Rdc(m Heat rating current Irms(A) Saturation current Isat(A)
Typical Max Typical Max Typical Max
MTQH201210SR10MBT 0.1 8.0 13 7.5 7.0 8.5 8.0
MTQH201210SR22MBT 0.22 16 22 7.1 6.5 7.3 6.8
MTQH201210SR24MBT 0.24 17 23 7.0 6.4 7.2 6.7
MTQH201210SR24MBTA 0.24 13 17 7.0 6.4 7.2 6.7
MTQH201210SR33MBT 0.33 24 32 5.5 5.0 6.5 6.0
MTQH201210SR33MBTB 0.33 18 22 5.7 5.2 6.7 6.3
MTQH201210SR47MBT 0.47 29 36 4.7 4.3 5.5 5.0
MTQH201210SR47MBTB 0.47 22 26 5.0 4.5 6.0 5.5
MTQH201210SR68MBT 0.68 37 43 4.3 4.0 5.0 4.5
MTQH201210S1R0MBT 1.0 55 63 3.9 3.5 4.0 3.5
MTQH201210S1R5MBT 1.5 76 85 3.1 2.6 3.2 2.7
MTQH201210S2R2MBT 2.2 135 150 2.0 1.7 2.7 2.4
MTQH201210S6R8MBT 6.8 440 520 1.5 1.3 1.45 1.2
MTQH201210S100MBT 10.0 600 660 1.1 1.0 1.2 1.0

Test Remarks

  • Note 1: All test data is referenced to 25 ambient.
  • Note 2: Test Condition: 1MHz, 1.0Vrms.
  • Note 3: Irms: DC current (A) that will cause an approximate T of 40 .
  • Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
  • Note 5: Operating Temperature Range -55 to +125.
  • Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
  • Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.

Reliability

Item Requirements Test Methods and Remarks
Insulation Resistance 100M 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability 90% or more of electrode area shall be coated by new solder. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat No visible mechanical damage. Inductance change: Within 10%. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode Strong bond between the pad and the core, without come off PCB. Inductors shall be subjected to (2605) for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds.
High temperature No case deformation or change in appearance. Inductance change: Within 10% Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature No visible mechanical damage. Inductance change: Within 10% Temperature: -402. Time: 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock No visible mechanical damage. Inductance change: Within 10% The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic Inductance change Pc-b, Pc-d: Within 20% a: +20 b: -40 c: +20 d: +125 e: +20 . 100% P_c-b = (Lb - Lc)/Lc * 100%; 100% P_c-d = (Ld - Lc)/Lc * 100%
Static Humidity No visible mechanical damage. Inductance change: Within 10% Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
High Temp. Storage No visible mechanical damage. Inductance change: Within 10% Inductors shall be stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

Soldering Condition (Recommendation)

Recommend Reflow Soldering Profile: (solder: Sn96.5 / Ag3 / Cu0.5) (Pb-Free solder)

Profile Feature Temperature Time Remarks
Preheat (Tsmin to Tsmax) 150 to 200 60 - 120 seconds Average ramp-up rate: 3/ second max. (Ts max to Tp)
Time maintained above TL 217 60 - 150 seconds
Peak Temperature (Tp) 260 10 seconds Time within +/5 of actual peak Temperature (tp) 10 seconds
Ramp-down Rate 6/second max. Time 25 to Peak Temperature 8 minutes max. Allowed Re-flow times: 2 times

Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.

Packing Dimension of Plastic Taping (Unit: mm)

Series W 0.30 A0 0.05 B0 +0.1/-0 D +0.1/-0 D1 Min E 0.10 F 0.10 K0 0.05 P0 0.10 P2 0.10 P 0.10 T 0.05
201265 8.00 1.50 2.30 1.50 1.0 1.75 3.50 0.8 4.00 2.00 4.00 0.23
201208 8.00 1.50 2.30 1.50 1.0 1.75 3.50 1.00 4.00 2.00 4.00 0.23
201210 8.00 1.50 2.30 1.50 1.0 1.75 3.50 1.20 4.00 2.00 4.00 0.23

Packing Quantity: 3000pcs/Reel

Dimension of Reel (Unit: mm)

Type A 0.5 B 0.5 C 0.5 D 1
All 178 60 12 1.5

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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