molded power inductors MetalLions MMPC0402-3R3MT designed for PC power systems and DC DC converters

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Product Description

Product Overview

The MMPC0402 Series High Current Molded Power Inductors are designed with carbonyl powder for a compact footprint, high current capability, low DCR, and high efficiency, operating up to 5MHz. These inductors offer very low acoustic and leakage flux noise, making them ideal for PC power systems, including IMVP-6 DC/DC converters. They are RoHS compliant and designed for a wide operating temperature range of -40 to +125 (including self-temperature rise).

Product Attributes

Brand: Metal-Lions (implied by website URL)
Core Material: Carbonyl Powder
Wire Material: Polyester Wire or equivalent
Clip Material: 100% Pb free solder (Ni+Sn---Plating)
Paint Material: Epoxy resin
Ink Material: Halogen-free ketone
Certifications: RoHS compliant
Packing: Tape Carrier Package

Technical Specifications

Series	Inductance (uH)	Tolerance	Irms (A) Typ	Isat (A) Typ	DCR (m) Max	Dimensions (mm) A	Dimensions (mm) A'	Dimensions (mm) B	Dimensions (mm) C	Dimensions (mm) D	Dimensions (mm) E	Dimensions (mm) L	Dimensions (mm) G	Dimensions (mm) H
MMPC0402-R10YT	0.10	30%	14.0	35.0	4.00	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R15YT	0.15	30%	14.0	31.0	5.00	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R22YT	0.22	30%	13.0	24.0	7.30	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R33MT	0.33	20%	10.0	18.0	8.60	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R47MT	0.47	20%	8.00	12.0	14.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R56MT	0.56	20%	7.30	10.0	16.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R68MT	0.68	20%	7.00	10.0	19.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-R82MT	0.82	20%	6.00	9.50	23.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-1R0MT	1.00	20%	5.00	8.50	27.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-1R5MT	1.50	20%	4.50	7.00	42.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-2R2MT	2.20	20%	4.00	6.00	61.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-3R3MT	3.30	20%	3.50	4.00	76.0	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-4R7MT	4.70	20%	2.60	3.50	105	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-5R6MT	5.60	20%	2.20	3.00	125	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-6R8MT	6.80	20%	2.10	2.80	172	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-8R2MT	8.20	20%	2.00	2.50	180	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-100MT	10.0	20%	1.80	2.30	243	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-150MT	15.0	20%	1.50	1.90	374	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3
MMPC0402-220MT	22.0	20%	1.20	1.40	500	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20	5.2	2.2	2.3

Dimensions (mm)
Series	A(mm)	A`(mm)	B(mm)	C(mm)	D(mm)	E(mm)
MMPC0402	4.450.25	3.950.20	4.060.25	1.80.2	0.760.30	2.00.20

Recommended PC Board Pattern Dimensions (mm)
L(mm)	G(mm)	H(mm)
5.2	2.2	2.3

Operating Temperature Range	Storage Temperature
-40125 (Including self temp. rise)	1. -10+40, 50~60%RH (Product without taping) 2. -40+125 (on board)

Item	Performance Test Condition
Life Test	Preconditioning: Run through IR reflow for 3 times. Temperature: 1252. Applied current: rated current. Duration: 100012hrs. Measured at room temperature after placing for 242 hrs.
Load Humidity	Preconditioning: Run through IR reflow for 3 times. Humidity: 852% RH, Temperature: 852. Duration: 1000hrs. Measured at room temperature after placing for 242 hrs.
Moisture Resistance	Preconditioning: Run through IR reflow for 3 times. Cycle: 1. Baked at 50 for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs. 3. Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs, keep at 25 for 2 hrs then keep at -10 for 3 hrs. 4. Keep at 25 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs.
Thermal shock	Preconditioning: Run through IR reflow for 3 times. Condition for 1 cycle: Step1: -402 305min. Step2: 1252 0.5min. Step3: 1252 305min. Number of cycles: 500. Measured at room temperature after placing for 242 hrs.
Vibration	Preconditioning: Run through IR reflow for 3 times. Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes. Total Amplitude: 10g. Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations).
Bending	Shall be mounted on a FR4 substrate. Bending depth: >=0805 inch(2012mm): 1.2mm,
Shock	3 shocks in each direction along 3 perpendicular axes (18 shocks).
Soldering Iron	Preheat circuit and products to 150. Never contact the ceramic with the iron tip. Use a 20 watt soldering iron with tip diameter of 1.0mm. 355 tip temperature (max). 1.0mm tip diameter (max). Limit soldering time to 4~5sec. Iron Soldering times: 1 times max.
Resistance to Soldering Heat	Preconditioning: Run through IR reflow for 3 times. Temperature: 260 5 (solder temp). Time: 10 1 sec. Temperature ramp/immersion and emersion rate: 25mm/s 6 mm/s. Number of heat cycles: 1.
Terminal Strength	Preconditioning: Run through IR reflow for 3 times. With the component mounted on a PCB, apply a force (>0805inch(2012mm): 1kg,

Packaging Information
Type	Chip / Reel	Inner box	Carton
MMPC 0402	3000	6000	24000

Tape Dimension
Series	Bo(mm)	Ao(mm)	Ko(mm)	P(mm)	W(mm)	F(mm)	t(mm)
MMPC 0402	5.00.1	4.400.1	2.30.1	8.00.1	120.3	5.50.1	0.350.05

Application Notice: Storage Conditions (component level)
To maintain the solderability of terminal electrodes: 1. Metal-lions products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40 and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air.

Application Notice: Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized.