Low dcr molded power inductor MetalLions MMPC0402-1R2MT designed for high current and low acoustic noise in pc power systems
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Product Description
Product Overview
The MMPC0402-1R2MT is a high-current molded power inductor featuring a compact design with carbonyl powder core. It offers high current handling, low DCR, and high efficiency, making it suitable for applications requiring up to 5MHz. This inductor is designed for very low acoustic noise and leakage flux noise. Key applications include PC power systems, such as IMVP-6 DC/DC converters. It operates within a temperature range of -40 to +125 (including self-temperature rise) and is RoHS compliant.
Product Attributes
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Certifications: RoHS compliant
- Packing: Tape Carrier Package
Technical Specifications
| Series | Part Number | Inductance (uH) | Tolerance | Irms (A) Typ. | Isat (A) Typ. | DCR (m) Max. | Dimensions (mm) A | Dimensions (mm) A' | Dimensions (mm) B | Dimensions (mm) C | Dimensions (mm) D | Dimensions (mm) E | Dimensions (mm) L | Dimensions (mm) G | Dimensions (mm) H |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MMPC0402 | MMPC0402-1R2MT | 1.2 | 20% | 4.8 | 7.8 | 30.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| Item | Performance Test Condition |
|---|---|
| Operating Temperature | -40~+125 (Including self-temperature rise) |
| Storage Temperature | 1. -10~+40, 50~60%RH (Product without taping) 2. -40~+125 (on board) |
| Inductance Test | Refer to standard electrical characteristics list. HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. |
| DCR Test | CH16502,Agilent33420A Micro-Ohm Meter. |
| Saturation Current (Isat) | Approximately L30%. Saturation DC Current (Isat) will cause L0 to drop L(%) |
| Heat Rated Current (Irms) | Approximately T40. Heat Rated Current (Irms) will cause the coil temperature rise T(). 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer |
| Life Test | Preconditioning: Run through IR reflow for 3 times. (IPC/JEDEC J-STD-020E Classification Reflow Profiles) Temperature: 1252 (Inductor, ambient + temp rise) Applied current: rated current Duration: 100012hrs Measured at room temperature after placing for 242 hrs. |
| Load Humidity | Preconditioning: Run through IR reflow for 3 times. (IPC/JEDEC J-STD-020E Classification Reflow Profiles) Humidity: 852% RH, Temperature: 852 Duration: 1000hrs Min. Bead: with 100% rated current, Inductance: with 100% rated current Measured at room temperature after placing for 242 hrs. |
| Moisture Resistance | Preconditioning: Run through IR reflow for 3 times. (IPC/JEDEC J-STD-020E Classification Reflow Profiles) 1. Baked at 50 for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs. 3. Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs, keep at 25 for 2 hrs then keep at -10 for 3 hrs. 4. Keep at 25 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. |
| Thermal Shock | Preconditioning: Run through IR reflow for 3 times. (IPC/JEDEC J-STD-020E Classification Reflow Profiles) Condition for 1 cycle: Step1: -402 305min Step2: 1252 0.5min Step3: 1252 305min Number of cycles: 500 Measured at room temperature after placing for 242 hrs. |
| Vibration | Preconditioning: Run through IR reflow for 3 times. (IPC/JEDEC J-STD-020E Classification Reflow Profiles) Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes Equipment: Vibration checker Total Amplitude: 10g Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations). |
| Bending | Appearance: No damage. Inductance: within10% of initial value Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value. Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm): 40x100x1.2mm; Bending depth: >=0805 inch(2012mm): 1.2mm; |
| Shock | 3 shocks in each direction along 3 perpendicular axes (18 shocks). Type: SMD, Lead Peak value (gs): 50 Normal duration (D) (ms): 11 Wave form: Half-sine Velocity change (Vi) ft/sec: 11.3 |
| Soldering Iron | Preheat circuit and products to 150. Never contact the ceramic with the iron tip. Use a 20 watt soldering iron with tip diameter of 1.0mm. 355 tip temperature (max). 1.0mm tip diameter (max). Limit soldering time to 4~5sec. |
| Reflow Soldering | Recommended temperature profiles for re-flow soldering in Figure 1. |
| Solderability | More than 95% of the terminal electrode should be covered with solder. a. Method B1, 4 hrs @155C dry heat @255C5C Test time: 5 +0/-0.5 seconds. b. Method D category 3. (steam aging 8hours 15 min)@ 260C5C Test time: 30 +0/-0.5 seconds. |
| Resistance to Soldering Heat | Appearance: No damage. Inductance: within10% of initial value Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value. Depth: completely cover the termination. |
| Terminal Strength | Preconditioning: Run through IR reflow for 3 times. (IPC/JEDEC J-STD-020E Classification Reflow Profiles) With the component mounted on a PCB with the device to be tested, apply a force (>0805 inch(2012mm): 1kg, This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. |
| Reel Dimension | 13x12mm: A(mm) 12.4+2/-0, B(mm) 1002, C(mm) 13+0.5/-0, D(mm) 330 |
| Tape Dimension | Series: MMPC 0402 Bo(mm): 5.00.1, Ao(mm): 4.400.1, Ko(mm): 2.30.1, P(mm): 8.00.1, W(mm): 120.3, F(mm): 5.50.1, t(mm): 0.350.05 |
| Packaging Quantity | Chip / Reel: 3000 Inner box: 6000 Carton: 24000 |
| Tearing Off Force (Top cover tape) | 165 to 180 Force: 10 to 130 grams in the arrow direction. Room Temp. (): 5~35 Room Humidity (%): 45~85 Room atm (hPa): 860~1060 Tearing Speed (mm/min): 300 |
| Storage Conditions (component level) | MSL, level 1 (IPC/JEDEC J-STD-020D standard). Temperature and humidity conditions: Less than 40 and 60% RH. Recommended products should be used within 12 months from the time of delivery. The packaging material should be kept where no chlorine or sulfur exists in the air. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina