molded power inductors MetalLions MMPC0402-2R2MT designed for high current applications and low DCR
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MMPC0402 Series High Current Molded Power Inductors are designed with carbonyl powder for compact, high-current applications requiring low DCR and high efficiency. These inductors operate effectively in frequency ranges up to 5MHz and are suitable for PC power systems, including IMVP-6 DC/DC converters. They offer very low acoustic and leakage flux noise, ensuring a quiet operating environment. The series is RoHS compliant and operates within a temperature range of -40 to +125 (including self-temperature rise).
Product Attributes
- Brand: Metal-Lions (implied by website URL)
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Compliance: RoHS compliant
- Packing: Tape Carrier Package
Technical Specifications
| Series | Inductance (uH) | Tolerance | Irms (A) Typ | Isat (A) Typ | DCR (m) Max | Dimensions (mm) A(mm) | Dimensions (mm) A'(mm) | Dimensions (mm) B(mm) | Dimensions (mm) C(mm) | Dimensions (mm) D(mm) | Dimensions (mm) E(mm) | Dimensions (mm) L(mm) | Dimensions (mm) G(mm) | Dimensions (mm) H(mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MMPC0402 | 0.10 | 30% | 14.0 | 35.0 | 4.00 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.15 | 30% | 14.0 | 31.0 | 5.00 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.22 | 30% | 13.0 | 24.0 | 7.30 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.33 | 20% | 10.0 | 18.0 | 8.60 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.47 | 20% | 8.00 | 12.0 | 14.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.56 | 20% | 7.30 | 10.0 | 16.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.68 | 20% | 7.00 | 10.0 | 19.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 0.82 | 20% | 6.00 | 9.50 | 23.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 1.00 | 20% | 5.00 | 8.50 | 27.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 1.50 | 20% | 4.50 | 7.00 | 42.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 2.20 | 20% | 4.00 | 6.00 | 61.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 3.30 | 20% | 3.50 | 4.00 | 76.0 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 4.70 | 20% | 2.60 | 3.50 | 105 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 5.60 | 20% | 2.20 | 3.00 | 125 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 6.80 | 20% | 2.10 | 2.80 | 172 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 8.20 | 20% | 2.00 | 2.50 | 180 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 10.0 | 20% | 1.80 | 2.30 | 243 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 15.0 | 20% | 1.50 | 1.90 | 374 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| MMPC0402 | 22.0 | 20% | 1.20 | 1.40 | 500 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 | 2.2 | 2.3 |
| Operating Temperature Range | Storage Temperature | Test Frequency (L/Q) | Test Ambient | Heat Rated Current (Irms) Condition | Saturation Current (Isat) Condition | Part Temperature Limit |
|---|---|---|---|---|---|---|
| -40+125 (Including self temp. rise) | -10+40, 50~60%RH (Product without taping); -40+125 (on board) | 100KHz /1.0V | 25 | Causes coil temperature rise approximately t of 40 (keep 1min.) | Causes L0 to drop 30% typical (keep quickly). | Should not exceed 125 under worst case operating conditions. |
| Reliability Test Item | Performance Test Condition |
|---|---|
| Life Test | Preconditioning: IR reflow x3. Temperature: 1252. Applied current: rated current. Duration: 100012hrs. Measured at room temp after 242 hrs recovery. |
| Load Humidity | Preconditioning: IR reflow x3. Humidity: 852%RH, Temperature: 852. Duration: 1000hrs. Measured at room temp after 242 hrs recovery. |
| Moisture Resistance | Preconditioning: IR reflow x3. Cycle: Baked at 50 for 25hrs, then 652 90-100%RH (2.5hrs ramp, 3hrs hold, 2.5hrs cool), repeated. Final step: 25 80-100%RH for 15min with vibration (10-55Hz to 10Hz). Measured at room temp after 1~2 hrs recovery. |
| Thermal Shock | Preconditioning: IR reflow x3. Cycles: 500 cycles of -402 (305min) to 1252 (0.5min), then 1252 (305min). Measured at room temp after 242 hrs recovery. |
| Vibration | Preconditioning: IR reflow x3. Oscillation Frequency: 10Hz2KHz10Hz (20 min). Total Amplitude: 10g. Testing Time: 12 hours (20 min per orientation x 3 orientations). |
| Bending | Component mounted on FR4 substrate. Bending depth: >=0805 inch(2012mm):1.2mm, |
| Shock | 3 shocks in each direction along 3 perpendicular axes (18 shocks total). Peak value: 50g's, Normal duration: 11ms (Half-sine). Velocity change: 11.3 ft/sec. |
| Soldering Method | Preheat | Soldering Temperature | Soldering Time | Reflow Times Max | Iron Soldering Times Max |
|---|---|---|---|---|---|
| Solder re-flow | 150 | TP(260 / 10s max.) | tp(245C / 20~40s.) | 3 | N/A |
| Soldering Iron | 150 | 355 (tip temp max) | 4~5 sec. | N/A | 1 |
| Packaging Type | Quantity per Reel | Quantity per Inner Box | Quantity per Carton |
|---|---|---|---|
| Chip / Reel | 3000 | 6000 | 24000 |
| Application Notice | Details |
|---|---|
| Storage Conditions (component level) | Maintain solderability: MSL level 1 (IPC/JEDEC J-STD-020D). Temperature & Humidity: |
| Transportation | Handle with care to avoid damage/contamination. Use tweezers or vacuum pick up. Minimize abrasion and mechanical shock for bulk handling. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina