Mini Molded Chip Power Inductor MetalLions MTQH303020B1R0MBT with RoHS Compliance and High Temperature Range
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Product Description
Product Overview
The MTQH3030 Series Mini Molded Chip Power Inductors are designed for high current and low loss applications. Featuring a closed magnetic circuit design to minimize leakage flux and a vinyl thermal spray for improved surface compactness, these RoHS-compliant inductors are suitable for a wide range of electronic devices. Key applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Series Name: MTQH3030 Series
- Type: Mini Molding Chip type power inductor
- Material: Metal material
- Coating: Vinyl thermal spray
- Magnetic Circuit: Closed magnetic circuit design
- Compliance: RoHS compliant
- Operating Temperature Range: -55 to +125 (Including self temp. rise)
- Coating Color: Black (B)
Technical Specifications
| Part Number | Dimensions (L*W*T) [mm] | Inductance L0 (H) @ 1MHz (0A) | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current Irms (A) Typical | Heat Rating Current Irms (A) Max | Saturation Current Isat (A) Typical | Saturation Current Isat (A) Max |
|---|---|---|---|---|---|---|---|---|
| MTQH303012B | 3.00.1 * 1.00.2 * 1.2Max. | 10.0 | 192 | 220 | 2.3 | 1.9 | 2.3 | 2.0 |
| MTQH303015B | 3.00.1 * 1.00.2 * 1.5Max. | 22.0 | 580 | 700 | 1.2 | 1.0 | 1.6 | 1.2 |
| MTQH303018BR22MBT | 3.00.1 * 1.00.2 * 1.8Max. | 0.22 | 5.5 | 7.0 | 10.0 | 9.0 | 17 | 16 |
| MTQH303018B1R5MBT | 3.00.1 * 1.00.2 * 1.8Max. | 1.5 | 20 | 26 | 6.8 | 6.4 | 8.0 | 7.0 |
| MTQH303018B4R7MBT | 3.00.1 * 1.00.2 * 1.8Max. | 4.7 | 72 | 87 | 3.4 | 3.0 | 4.7 | 4.2 |
| MTQH303020BR33MBT | 3.00.1 * 1.00.2 * 2.0Max. | 0.33 | 7.5 | 9 | 10.0 | 9.0 | 17 | 15 |
| MTQH303020BR50MBT | 3.00.1 * 1.00.2 * 2.0Max. | 0.5 | 9.0 | 12 | 9.0 | 8.0 | 15 | 13 |
| MTQH303020BR68MBT | 3.00.1 * 1.00.2 * 2.0Max. | 0.68 | 13 | 16 | 8.5 | 7.8 | 13 | 11 |
| MTQH303020B1R0MBT | 3.00.1 * 1.00.2 * 2.0Max. | 1.0 | 14 | 20 | 6.5 | 6.0 | 8.0 | 7.3 |
| MTQH303020B1R5MBT | 3.00.1 * 1.00.2 * 2.0Max. | 1.5 | 19 | 25 | 6.3 | 5.8 | 7.0 | 6.5 |
| MTQH303020B2R2MBT | 3.00.1 * 1.00.2 * 2.0Max. | 2.2 | 37 | 45 | 4.7 | 4.3 | 6.0 | 5.5 |
| MTQH303020B3R3MBT | 3.00.1 * 1.00.2 * 2.0Max. | 3.3 | 52 | 63 | 4.5 | 4.0 | 5.9 | 5.4 |
| MTQH303020B4R7MBT | 3.00.1 * 1.00.2 * 2.0Max. | 4.7 | 60 | 73 | 4.2 | 3.8 | 4.8 | 4.0 |
| MTQH303020B6R8MBT | 3.00.1 * 1.00.2 * 2.0Max. | 6.8 | 107 | 135 | 3.2 | 3.0 | 4.5 | 3.8 |
| MTQH303020B100MBT | 3.00.1 * 1.00.2 * 2.0Max. | 10.0 | 135 | 160 | 2.5 | 2.2 | 3.8 | 3.3 |
Test Conditions:
- Ambient Temperature: 25
- Test Frequency: 1MHz, 1.0Vrms
- Irms: DC current causing approx. 40 temp. rise.
- Isat: DC current causing approx. 30% inductance drop.
- Rated current is the lower of saturation or heating current.
Reliability Test Summary:
| Item | Requirements | Test Method & Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between coil and body for 60s. |
| Solderability | 90% coated area | Dip pads in flux, Sn/Ag3.0/Cu0.5 solder at 2455 for (51)s. |
| Resistance to Soldering Heat | No visible damage, Inductance change within 10% | Dip pads in flux, Sn/Ag3.0/Cu0.5 solder at 2605 for 101s. |
| Adhesion of teral electrode | Strong bond, no come off | Subjected to (2605) for (205)s, then 10 N for (101)s. |
| High temperature | No deformation, Inductance change within 10% | 1252 for 1000 hours. |
| Low temperature | No visible damage, Inductance change within 10% | -402 for 1000 hours. |
| Thermal shock | No visible damage, Inductance change within 10% | (-553) to (1253), 32 cycles. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | Tests at +20, -40, +125. |
| Static Humidity | No visible damage, Inductance change within 10% | (953)%RH at (602) for 1000 hours. |
| Storage Test | No visible damage, Inductance change within 10% | (852) for 1000 hours with Irms applied. |
Recommended Soldering Conditions (Reflow):
- Solder: Sn96.5 / Ag3 / Cu0.5 (Pb-Free)
- Preheat: 150 to 200, 60-120 seconds
- Ramp-up rate: 3/second max.
- Time maintained above 217: 60-150 seconds
- Peak Temperature: 260
- Time within 5 of peak: 10 seconds
- Ramp-down rate: 6/second max.
- Max Re-flow times: 2
- Remark: Use N2 Re-flow furnace to avoid discoloration.
Packing Information:
| Series | Packing Quantity | Reel Dimension (D) [mm] | Reel Dimension (A) [mm] | Reel Dimension (B) [mm] | Reel Dimension (C) [mm] |
|---|---|---|---|---|---|
| MTQH303012 | 3000pcs/Reel | 178 | 0.5 | 0.5 | 0.5 |
| MTQH303015 | 3000pcs/Reel | 178 | 0.5 | 0.5 | 0.5 |
| MTQH303018 | 3000pcs/Reel | 178 | 0.5 | 0.5 | 0.5 |
| MTQH303020 | 3000pcs/Reel | 178 | 0.5 | 0.5 | 0.5 |
Plastic Taping Dimensions (Unit: mm):
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 303012 | 8.00 | 3.35 | 3.40 | 1.50 | 1.0 | 1.75 | 3.50 | 1.35 | 4.00 | 2.00 | 4.00 | 0.23 |
| 303015 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 1.70 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303018 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 2.00 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303020 | 12.0 | 3.40 | 3.40 | 1.50 | 1.0 | 1.75 | 5.50 | 2.20 | 4.00 | 2.00 | 8.00 | 0.35 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina