Mini Molded Chip Power Inductor MetalLions MTQH322512S4R7MBT for High Current Low Loss Applications
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Product Description
MTQH3225 Series Mini Molded Chip Power Inductors
Product Overview
The MTQH3225 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for enhanced surface compactness, and a closed magnetic circuit design to minimize leakage flux, these RoHS-compliant inductors offer reliable performance across a wide operating temperature range of -55 to +125. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Series Name: MTQH3225 Series
- Type: Mini Molding Chip type power inductor
- Material: Metal
- Coating Color: Black (B)
- Compliance: RoHS compliant
- Brand: Metal-Lions (implied by URL)
Technical Specifications
Dimensions and Land Pattern:
| Series | L (mm) | G (mm) | W (mm) | T (mm) | A (mm) | B (mm) | C (mm) |
|---|---|---|---|---|---|---|---|
| MTQH322512S | 3.2 0.2 | 0.9 0.2 | 2.5 0.2 | 1.20 Max. | 3.25 | 0.90 | 2.55 |
| MTQH322510S | 3.2 0.2 | 0.9 0.2 | 2.5 0.2 | 1.00 Max. | 3.25 | 0.90 | 2.55 |
| MTQH322520S | 3.2 0.2 | 0.9 0.2 | 2.5 0.2 | 2.00 Max. | 3.25 | 0.90 | 2.55 |
Electrical Properties:
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Heat rating current Irms (A) | Saturation current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH322512SR10MBT | 0.10 | 5.2 | 7.0 | 12.0 | 11.0 | 18.0 | 16.5 |
| MTQH322512SR22MBT | 0.22 | 6.6 | 10 | 9.2 | 8.7 | 11.5 | 11.0 |
| MTQH322512SR24MBT | 0.24 | 7.0 | 12 | 9.0 | 8.5 | 11 | 10.5 |
| MTQH322512SR33MBT | 0.33 | 9.0 | 14 | 8.4 | 8.1 | 10 | 9.5 |
| MTQH322512SR47MBT | 0.47 | 14 | 19 | 7.5 | 7.2 | 8.6 | 8.2 |
| MTQH322512SR47MBTA | 0.47 | 11 | 14 | 7.5 | 7.2 | 8.6 | 8.2 |
| MTQH322512SR68MBT | 0.68 | 18 | 23 | 7.3 | 6.8 | 8.1 | 7.7 |
| MTQH322512SR68MBTA | 0.68 | 12 | 15 | 7.0 | 6.5 | 8.0 | 7.5 |
| MTQH322512S1R0MBT | 1.0 | 26 | 30 | 5.3 | 4.8 | 6.6 | 5.8 |
| MTQH322512S1R0MBTA | 1.0 | 18 | 21 | 5.5 | 5.0 | 7.7 | 7.0 |
| MTQH322512S1R5MBT | 1.5 | 37 | 44 | 4.7 | 4.3 | 5.1 | 4.7 |
| MTQH322512S2R2MBT | 2.2 | 58 | 70 | 3.6 | 3.0 | 4.6 | 4.2 |
| MTQH322512S2R2MBTA | 2.2 | 42 | 50 | 3.8 | 3.5 | 5.0 | 4.5 |
| MTQH322512S3R3MBT | 3.3 | 75 | 95 | 2.9 | 2.5 | 3.7 | 3.2 |
| MTQH322512S4R7MBT | 4.7 | 115 | 135 | 2.3 | 2.0 | 2.9 | 2.6 |
| MTQH322512S6R8MBT | 6.8 | 177 | 210 | 2.1 | 1.9 | 2.8 | 2.4 |
| MTQH322512S100MBT | 10.0 | 210 | 230 | 2.2 | 1.8 | 2.3 | 1.9 |
| MTQH322510SR33MBT | 0.33 | 11 | 15 | 8.3 | 7.8 | 8.3 | 7.8 |
| MTQH322510SR47MBT | 0.47 | 17 | 22 | 6.4 | 5.9 | 8.3 | 7.6 |
| MTQH322510SR68MBT | 0.68 | 22 | 28 | 6.2 | 5.7 | 7.5 | 7.0 |
| MTQH322510S1R0MBT | 1.0 | 25 | 30 | 5.4 | 4.9 | 6.0 | 5.3 |
| MTQH322510S1R5MBT | 1.5 | 34 | 42 | 4.0 | 3.6 | 5.0 | 4.4 |
| MTQH322510S2R2MBT | 2.2 | 55 | 66 | 3.7 | 3.4 | 4.0 | 3.5 |
| MTQH322510S3R3MBT | 3.3 | 105 | 120 | 2.7 | 2.3 | 3.7 | 3.3 |
| MTQH322510S4R7MBT | 4.7 | 125 | 140 | 2.3 | 1.9 | 2.8 | 2.5 |
| MTQH322510S6R8MBT | 6.8 | 290 | 320 | 1.9 | 1.6 | 2.4 | 2.0 |
| MTQH322510S100MBT | 10.0 | 325 | 365 | 2.2 | 1.8 | 2.2 | 1.8 |
| MTQH322520SR33MBT | 0.33 | 7.5 | 9 | 9.5 | 9 | 15.5 | 14 |
| MTQH322520SR47MBT | 0.47 | 9 | 10.5 | 9.5 | 8.5 | 15 | 13 |
| MTQH322520SR68MBT | 0.68 | 12.5 | 14.5 | 9.0 | 8.0 | 13 | 11 |
| MTQH322520S1R0MBT | 1.0 | 15 | 17.5 | 8.2 | 7.5 | 9.0 | 8.3 |
| MTQH322520S2R2MBT | 2.2 | 36 | 43 | 5.4 | 4.8 | 6.5 | 5.5 |
| MTQH322520S3R3MBT | 3.3 | 55 | 60 | 4.5 | 4.0 | 4.5 | 3.5 |
| MTQH322520S4R7MBT | 4.7 | 81 | 94 | 3.5 | 3.0 | 4.0 | 3.0 |
Test Conditions:
- Ambient Temperature: 25
- Test Frequency: 1MHz, 1.0Vrms
- Irms: DC current causing approx. T of 40
- Isat: DC current causing L0 drop of approx. 30%
Operating Conditions:
- Operating Temperature Range: -55 to +125 (including self-temp rise)
- Maximum Part Temperature: 125 (ambient + temp rise)
Reliability:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% P = (Lb-Lc)/Lc * 100%; P = (Ld-Lc)/Lc * 100% |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Load life | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation):
| Profile Feature | Temperature | Time |
|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 - 200 | 60 -120 seconds (ts) |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. | |
| Time maintained above (TL) | 217 | 60-150 seconds (tL) |
| Peak Temperature (Tp) | 260 | Time within 5 of actual peak Temperature (tp) 2-10 seconds |
| Ramp-down Rate | 6/second max. | |
| Time 25 to Peak Temperature | 8 minutes max. | |
| Allowed Re-flow times | 2 times |
Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing Dimension of plastic taping:
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | All |
|---|---|---|---|---|---|
| Reel Dimension | 178 | 60 | 12 | 1.5 | |
| Packing Quantity | 3000pcs/Reel |
Reel Dimensions:
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 322510 | 8.00 | 2.90 | 3.50 | 1.50 | 1.0 | 1.75 | 3.50 | 1.20 | 4.00 | 2.00 | 4.00 | 0.23 |
| 322512 | 8.00 | 2.90 | 3.50 | 1.50 | 1.0 | 1.75 | 3.50 | 1.40 | 4.00 | 2.00 | 4.00 | 0.23 |
| 322520 | 8.00 | 2.90 | 3.50 | 1.50 | 1.0 | 1.75 | 3.50 | 2.20 | 4.00 | 2.00 | 4.00 | 0.28 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina