molded power inductors MetalLions MMPC0503H-100MT featuring lead free solder clip and halogen free ink
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MMPC0503H Series High Current Molded Power Inductors are designed for high-current applications, offering a compact form factor with excellent efficiency. Utilizing carbonyl powder and a polyester wire, these inductors provide high current capability and low DCR. They are suitable for DC/DC converters and PC power systems, including IMVP-6, and operate effectively in a frequency range up to 5MHz. Key features include very low acoustic noise and minimal leakage flux noise, making them ideal for demanding electronic designs.
Product Attributes
- Brand: Metal-Lions (implied by website mentions)
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Certifications: RoHS compliant
- Operating Temperature Range: -40125 (Including self temp. rise)
- Storage Temperature: -1040, 50~60%RH (Product without taping); -40125 (on board)
Technical Specifications
| Part Number | Inductance (uH) | Tolerance | Irms (A) Typ | Isat (A) Typ | DCR (m) Max |
|---|---|---|---|---|---|
| MMPC0503H-R10YT | 0.10 | 30% | 23.0 | 27.0 | 3.00 |
| MMPC0503H-R15YT | 0.15 | 30% | 18.0 | 30.0 | 2.70 |
| MMPC0503H-R22MT | 0.22 | 20% | 15.5 | 21.0 | 4.40 |
| MMPC0503H-R33MT | 0.33 | 20% | 14.0 | 18.0 | 5.00 |
| MMPC0503H-R47MT | 0.47 | 20% | 12.0 | 16.0 | 7.40 |
| MMPC0503H-R56MT | 0.56 | 20% | 10.0 | 15.0 | 10.0 |
| MMPC0503H-R68MT | 0.68 | 20% | 8.50 | 14.0 | 12.0 |
| MMPC0503H-R82MT | 0.82 | 20% | 8.00 | 12.5 | 13.0 |
| MMPC0503H-1R0MT | 1.00 | 20% | 7.00 | 11.0 | 14.0 |
| MMPC0503H-1R5MT | 1.50 | 20% | 6.00 | 10.0 | 25.0 |
| MMPC0503H-2R2MT | 2.20 | 20% | 5.50 | 9.00 | 35.0 |
| MMPC0503H-3R3MT | 3.30 | 20% | 5.00 | 8.00 | 38.0 |
| MMPC0503H-4R7MT | 4.70 | 20% | 4.60 | 6.00 | 53.0 |
| MMPC0503H-5R6MT | 5.60 | 20% | 4.25 | 4.50 | 63.0 |
| MMPC0503H-6R8MT | 6.80 | 20% | 4.00 | 4.30 | 76.2 |
| MMPC0503H-100MT | 10.0 | 20% | 2.75 | 3.50 | 128 |
| MMPC0503H-150MT | 15.0 | 20% | 2.10 | 2.60 | 190 |
| MMPC0503H-220MT | 22.0 | 20% | 1.90 | 1.70 | 250 |
| MMPC0503H-330MT | 33.0 | 20% | 1.60 | 1.60 | 440 |
| Dimensions (mm) | L | G | H | A | B | C | D | E |
|---|---|---|---|---|---|---|---|---|
| Value | 6.2 | 2.2 | 2.8 | 5.70.3 | 5.20.2 | 2.80.2 | 1.10.3 | 1.50.3 |
| Reliability Test Item | Performance Test Condition |
|---|---|
| Life Test | Temperature: 1252 (Inductor, ambient + temp rise); Applied current: rated current; Duration: 100012hrs; Measured at room temperature after placing for 242 hrs. |
| Load Humidity | Humidity: 852% RH, Temperature: 852; Duration: 1000hrs; Measured at room temperature after placing for 242 hrs. |
| Moisture Resistance | Multiple steps involving baking, humidity exposure, and temperature cycling. Detailed conditions in source document. |
| Thermal shock | Condition for 1 cycle: Step1: -402 305min; Step2: 1252 0.5min; Step3: 1252 305min. Number of cycles: 500. Measured at room temperature after placing for 242 hrs. |
| Vibration | Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes; Total Amplitude: 10g; Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations). |
| Bending | Component mounted on FR4 substrate. Bending depth: >=0805 inch(2012mm): 1.2mm, |
| Shock | 3 shocks in each direction along 3 perpendicular axes (18 shocks). Type: SMD, Peak value: 50g's, Normal duration (D): 11ms, Wave form: Half-sine, Velocity change (Vi): 11.3 ft/sec. |
| Resistance to Soldering Heat | Test time: 5 +0/-0.5 seconds @ 255C5C (Method B1, 4 hrs @155C dry heat) OR Test time: 30 +0/-0.5 seconds @ 260C5C (Method D category 3, steam aging 8hours 15 min). |
| Terminal Strength | With component mounted on PCB, apply a force (>0805inch(2012mm): 1kg, |
| Packaging Information | Dimension | Quantity per Reel |
|---|---|---|
| Reel Dimension | 13x12mm | 2000 |
| Tape Dimension (mm) | A: 6.20.1, B: 5.50.1, C: 3.30.1, D: 8.00.1, W: 12.00.3, F: 5.50.1, T: 0.350.05, K0: 1.50.1 | - |
| Tearing Off Force (Top cover tape) | 165 to 180 | - |
| Application Notice | Condition |
|---|---|
| Storage Conditions (component level) | MSL Level 1 (IPC/JEDEC J-STD-020D); Temperature: Less than 40; Humidity: Less than 60% RH; Recommended use within 12 months from delivery; Packaging material free from chlorine or sulfur. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina