Mini Molded Chip Power Inductor MetalLions MTQH322512SR22MBTA for High Current Low Loss Applications
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Product Description
Product Overview
The MTQH322512S Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for enhanced surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors offer reliable performance. They are RoHS compliant and operate within a wide temperature range of -55 to +125. Ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by URL)
- Series: MTQH322512S
- Type: Mini Molding Chip type power inductor
- Material Code: S Type
- Coating Color: Black (B), Gray (G)
- Packing: Tape Carrier Package (T)
- Certifications: RoHS compliant
Technical Specifications
| Series | L (mm) | G/Typ (mm) | W (mm) | E (mm) | T (mm) | A/Typ (mm) | B/Typ (mm) | C/Typ (mm) |
|---|---|---|---|---|---|---|---|---|
| MTQH322512S | 3.2 0.2 | 1.1 | 2.5 0.2 | 1.05 0.2 | 1.20 Max. | 3.20 | 1.00 | 2.50 |
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) Typical | Rdc (m) Max | Heat rating current Irms (A) Typical | Heat rating current Irms (A) Max | Saturation current Isat (A) Typical | Saturation current Isat (A) Max |
|---|---|---|---|---|---|---|---|
| MTQH322512SR10MT | 0.10 | 5.2 | 7.0 | 12.0 | 11.0 | 18.0 | 16.5 |
| MTQH322512SR11MT | 0.11 | 4.5 | 6.0 | 13.0 | 12.0 | 17.0 | 15.5 |
| MTQH322512SR11MTA | 0.11 | 5.5 | 7.0 | 12.0 | 11.0 | 18.5 | 18.0 |
| MTQH322512SR22MT | 0.22 | 6.6 | 10 | 9.2 | 8.7 | 11.5 | 11.0 |
| MTQH322512SR22MTA | 0.22 | 6.2 | 8.0 | 11.0 | 10.0 | 12.0 | 11.0 |
| MTQH322512SR24MT | 0.24 | 7.0 | 12 | 9.0 | 8.5 | 11.0 | 10.5 |
| MTQH322512SR33MT | 0.33 | 9.0 | 14 | 8.4 | 8.1 | 10.0 | 9.5 |
| MTQH322512SR47MT | 0.47 | 14 | 19 | 7.5 | 7.2 | 8.6 | 8.2 |
| MTQH322512SR47MTA | 0.47 | 11 | 14 | 7.5 | 7.2 | 8.6 | 8.2 |
| MTQH322512SR47MTB | 0.47 | 10 | 11 | 8.5 | 8.0 | 8.5 | 8.0 |
| MTQH322512SR56MT | 0.56 | 15 | 19 | 8.0 | 7.5 | 8.4 | 8.0 |
| MTQH322512SR68MT | 0.68 | 18 | 23 | 7.3 | 6.8 | 8.1 | 7.7 |
| MTQH322512SR68MTA | 0.68 | 12 | 15 | 7.0 | 6.5 | 8.0 | 7.5 |
| MTQH322512S1R0MT | 1.0 | 26 | 30 | 5.3 | 4.8 | 6.6 | 5.8 |
| MTQH322512S1R0MTA | 1.0 | 18 | 21 | 6.5 | 6.0 | 7.7 | 7.0 |
| MTQH322512S1R0MTB | 1.0 | 26 | 32 | 6.0 | 5.5 | 8.3 | 8.0 |
| MTQH322512S1R2MT | 1.2 | 26 | 32 | 5.7 | 5.2 | 5.9 | 5.4 |
| MTQH322512S1R5MT | 1.5 | 37 | 44 | 4.7 | 4.3 | 5.1 | 4.7 |
| MTQH322512S2R2MT | 2.2 | 58 | 70 | 3.6 | 3.0 | 4.6 | 4.2 |
| MTQH322512S2R2MTA | 2.2 | 42 | 50 | 4.2 | 3.7 | 5.0 | 4.5 |
| MTQH322512S3R3MT | 3.3 | 75 | 95 | 2.9 | 2.5 | 3.7 | 3.2 |
| MTQH322512S3R3MTA | 3.3 | 62 | 67 | 2.9 | 2.5 | 3.7 | 3.2 |
| MTQH322512S4R7MT | 4.7 | 115 | 135 | 3.0 | 2.8 | 2.9 | 2.6 |
| MTQH322512S4R7MTA | 4.7 | 105 | 120 | 3.0 | 2.8 | 3.0 | 2.6 |
| MTQH322512S4R7MTB | 4.7 | 115 | 135 | 3.0 | 2.8 | 3.2 | 2.8 |
| MTQH322512S4R7MTC | 4.7 | 105 | 115 | 3.0 | 2.6 | 3.0 | 2.7 |
| MTQH322512S6R8MT | 6.8 | 177 | 210 | 2.1 | 1.9 | 2.8 | 2.4 |
| MTQH322512S100MT | 10.0 | 210 | 230 | 2.2 | 1.8 | 2.3 | 1.9 |
Test Remarks:
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Irms: DC current (A) that will cause an approximate T of 40.
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -55 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Test Summary:
| No. | Item | Requirements | Test Methods and Remarks | Reference Sample Size |
|---|---|---|---|---|
| 1 | Solderability | (1) No case deformation or change in appearance. (2) Terminal area must have 95% min. Solder coverage. | Temperature: 2455. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Sample immersion tin furnace 5 0.5s. | 32 |
| 2 | Adhesion of teral electrode | (1) Strong bond between the pad and the core, without come off PCB. | Preconditioning245Reflow 3 times Inductors shall be subjected to (260+0/-5) for (105)s Soldering in the base whit 0.3mm solder. Aplombelectrode way plus tax 12 N for (101) seconds. | 32 |
| 3 | Reflow test | (1) No physical damage. (2) L0/L010% | The peak temperature: 260+0/-5. Reflow:3times. Temperature curve is as below | 32 |
| 4 | High temperature | (1) No physical damage. (2) L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion | 77 |
| 5 | Low temperature | (1) No physical damage. (2) L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion | 77 |
| 6 | Thermal shock | (1) No physical damage. (2) L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Repeat 500 cycle as follow : (-552 ,303minutes) (Room temperature, 5 minutes)(+1252 ,303minutes)(Room temperature, 5 minutes) Measurement at 244 hours after test conclusion | 77 |
| 7 | Resistance to Soldering Heat | (1) No physical damage. (2) L0/L010% | Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. | 32 |
| 8 | Static Humidity | (1) No physical damage. (2) L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times 1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion | 77 |
| 9 | Board Flex | (1) No physical damage. (2) L0/L010% | Preconditioning245Reflow 3 times Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. | 30 |
| 10 | Vibration | (1) No physical damage. (2) L0/L010% | Preconditioning245Reflow 3 times Frequency range : 10~2000Hz. Amplitude: 1.5mm or 20g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours in X,Y,Z direction, 12hours in total. | 32 |
| 11 | Mechanical Shock | (1) No physical damage. (2) L0/L010% | Preconditioning245Reflow 3 times Peak acceleration:100G/S Duration of pulse:6ms 3times in each of 6(X, Y, Z) axes. | 32 |
| 12 | Loading at High Temperature | (1) No physical damage. (2) L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion | 77 |
Soldering Condition (Recommendation):
Recommend Reflow Soldering Profile: (solder: Sn96.5 / Ag3 / Cu0.5)
- Preheat: Tsmin 150, Tsmax 200, Time (ts) 60 -120 seconds
- Average ramp-up rate: (Ts max to Tp) 3 / second max.
- Time maintained above: TL 217, Time (tL) 60-150 seconds
- Peak Temperature (Tp): 260
- Time within +/ 0 5 of actual peak Temperature (tp): 2 10 seconds
- Ramp-down Rate: 6/second max.
- Time 25 to Peak Temperature: 8 minutes max.
- Allowed Re-flow times: 2 times
- Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing Information:
Dimension of plastic taping: (Unit: mm)
| Series | W | A0 | B0 | D0 | D1 | E | Tolerance |
|---|---|---|---|---|---|---|---|
| 322512 | 8.0 | 2.90 | 3.50 | 1.5 | 1.0 | 1.75 | 0.10, +0.10/-0.05, +0.1/-0, 0.20, 0.10 |
Dimension of Reel: (Unit: mm)
| Series | F | K0 | P0 | P2 | P1 | T | Tolerance | |
|---|---|---|---|---|---|---|---|---|
| 322512 | 3.5 | 1.35 | 4.0 | 2.0 | 4.0 | 0.25 | 3K | 0.10, 0.10, 0.10, 0.10, 0.10, 0.05 |
Reel Dimensions:
| Type | A 2.0 | B 2.0 | C 2.0 | All |
|---|---|---|---|---|
| 178 | 60 | 13 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina