High frequency noise suppression with MetalLions ACM2012-2P-671TF wire wound chip common mode filter solution
Wire Wound Chip Common Mode Filters
These wire wound chip common mode filters offer a compact and low-profile solution for preventing common mode noise in high-frequency applications. They are designed for excellent solderability and operate reliably in temperatures ranging from -40 to +125 (including self-temperature rise). Ideal for USB2.0 interfaces in PCs and peripheral equipment, small digital AV devices, and LVDS and audio lines in notebooks and LCDs.
Product Attributes
- Brand: Metal-Lions (derived from URL)
- Certifications: Hazardous Substance Free Products (F)
Technical Specifications
| Part Number | Common-Mode Impedance Z() at 100MHz | Rated Voltage Vdc(V) | DC Resistance Rdc() Max. | Rated Current Idc(mA) Max. | Insulation Resistance (M) Min. |
| ACM2012-2P-300TF | 30 25% | 450 | 0.20 | 50 | 10 |
| ACM2012-2P-670TF | 67 25% | 400 | 0.25 | 50 | 10 |
| ACM2012-2P-900TF | 90 25% | 400 | 0.30 | 50 | 10 |
| ACM2012-2P-121TF | 12025% | 370 | 0.30 | 50 | 10 |
| ACM2012-2P-161TF | 16025% | 350 | 0.35 | 50 | 10 |
| ACM2012-2P-181TF | 18025% | 330 | 0.35 | 50 | 10 |
| ACM2012-2P-201TF | 20025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-221TF | 22025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-261TF | 26025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-361TF | 36025% | 280 | 0.45 | 50 | 10 |
| ACM2012-2P-601TF | 60025% | 200 | 0.55 | 50 | 10 |
| ACM2012-2P-671TF | 67025% | 150 | 0.60 | 50 | 10 |
| ACM2012-2P-801TF | 80025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-901TF | 90025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-102TF | 100025% | 150 | 1.30 | 50 | 10 |
| ACM2012-2P-222TF | 220025% | 100 | 2.00 | 50 | 10 |
Dimensions
Shapes and Dimensions: A: 2.0 0.2, B: 1.2 0.2, C: 1.2 0.2 (Dimensions in mm)
Land Pattern: 0.4 (W) x 1.2 (L), 0.8 (W) x 2.6 (L), 1.0 (W) x 1.2 (L) (Unit:mm)
Explanation of Part Number
ACM 2012 -2P- 900 T F
- 1:Product Series: Wire Wound Chip Common Mode Filters
- 2:Dimensions: 2012
- 3: Number of Lines: 2P=2 lines
- 4:Common Mode Impedance(): e.g., 900
- 5:Packing(Tape & Reel: T
- 6:F: Hazardous Substance Free Products
Soldering Specifications
Solder Specifications: Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C. 5 seconds max. at 260C. Iron Soldering: Use a solder iron of less than 30W. Do not allow the soldering iron tip directly touch the ferrite body outside of the terminal electrode.
Recommended Reflow Pattern: Preheating: 60sec Min. 150sec Max. at 150. Reflow: 217, 10sec Max. Peak: 255. Cooling: Natural cooling.
Reliability Test Conditions
High temperature resistance: Temperature: +1252, Applied voltage: Rated voltage, Applied current: Rated current, Testing time: 50012 hours.
Low temperature resistance: Temperature: -402, Testing time: 50012 hours.
Thermal cycle: Temperature: -40,+125 (kept stabilized for 30 minutes each), Cycle: 100 cycles.
Humidity: Temperature: +852, Humidity: 90 to 95%RH, Applied current: Rated current, Applied voltage: Rated voltage, Testing time: 50012 hours.
Vibration: Frequency: 10 to 50 Hz, Amplitude: 1.52 mm, Dimension and times: X, Y and Z directions for 2 hours each.
Packaging
Packaging Form: Material of carrier tape: Polystyrene, Material of cover tape: Polyester. Cover Tape Peel Strength: 0.1~0.69(N) at 5 ~ 35, 45 ~ 85% Humidity.
Packing Quantity: 2000 pcs./reel (180 mm reel, T type).
Reel dimensions: A: 180 mm, B: 60 mm.
Tape dimensions: W: 8, P: 4, P0: 4, P1: 2, A0: 1.5, B0: 2.25, K0: 1.35, t: 0.24.
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