Mini molded chip power inductor with metal material vinyl thermal spray and rohs compliance MetalLions MTQH404030S6R8MBT
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH4040 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors are RoHS compliant. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal Lions (implied by website URL)
- Series Name: MTQH4040 Series
- Type: Mini Molding Chip type power inductor
- Material: Metal
- Coating: Vinyl thermal spray
- Compliance: RoHS compliant
- Operating Temperature Range: -55125 (Including self temp. rise)
- Coating Color: Black (for specific models)
Technical Specifications
| Series | Part Number | Dimensions (L*W*T) [mm] | Inductance (L0) [H] @ 1MHz, 0A | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current (Irms) [A] Typical | Heat Rating Current (Irms) [A] Max | Saturation Current (Isat) [A] Typical | Saturation Current (Isat) [A] Max |
|---|---|---|---|---|---|---|---|---|---|
| MTQH404010S | 4.0*4.0*1.0 | MTQH404010S100MBT | 10 | 220 | 280 | 2.5 | 2.0 | 2.2 | 2.0 |
| MTQH404012S | 4.0*4.0*1.2 | MTQH404012S1R0MBT | 1.0 | 21 | 25 | 6.3 | 5.5 | 11 | 10 |
| MTQH404012S | 4.0*4.0*1.2 | MTQH404012S1R5MBT | 1.5 | 29 | 34.5 | 6.0 | 5.0 | 8.0 | 7.0 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S2R2MBT | 2.2 | 30 | 36 | 6.5 | 6.0 | 9.5 | 8.5 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S4R7MBT | 4.7 | 47 | 58 | 5.0 | 4.0 | 6.3 | 5.5 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S100MBT | 10 | 113 | 135 | 3.7 | 3.0 | 4.9 | 4.0 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S150MBT | 15 | 210 | 250 | 2.3 | 1.7 | 3.5 | 3.0 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S220MBT | 22 | 275 | 330 | 1.8 | 1.3 | 2.9 | 2.3 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030SR68MBT | 0.68 | 8.3 | 10 | 9.5 | 8.0 | 17 | 15 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030S1R5MBT | 1.5 | 15 | 18 | 6.5 | 6.0 | 12.5 | 11 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030S4R7MBT | 4.7 | 41 | 46 | 4.3 | 4.0 | 7.0 | 6.0 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030S6R8MBT | 6.8 | 51 | 62 | 4.2 | 3.8 | 6.3 | 5.1 |
Land Pattern Dimensions [mm]
| Series | L | G | W | T |
|---|---|---|---|---|
| MTQH404010S | 4.10.2 | 1.20.2 | 4.10.2 | 1.00Max. |
| MTQH404012S | 4.10.2 | 1.20.2 | 4.10.2 | 2.00Max. |
| MTQH404020S | 4.10.2 | 1.20.2 | 4.10.2 | 3.00Max. |
| MTQH404030S | 4.10.2 | 1.20.2 | 4.10.2 | 3.90 |
Explanation of Part Number
MTQH 4040 10 S 2R2 M B T
- MTQH: Series Name (Mini Molding Chip type power inductor)
- 4040: Size Code (L*W)
- 10, 12, 20, 30: Thickness (T)
- S: Material Code (D Type)
- 2R2 (e.g.): Initial inductance value (2.2uH)
- M: Tolerance of Inductance (20%)
- B: Coating color (Black)
- T: Packing (Tape Carrier Package)
Test Remarks
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Irms: DC current (A) that will cause an approximate T of 40 .
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -55 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Item Requirements
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% Pc-b = (Lb-Lc)/Lc * 100%; Pc-d = (Ld-Lc)/Lc * 100%. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| High temp. load life | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be store at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Recommended Reflow Soldering Profile
Solder: Sn96.5 / Ag3 / Cu0.5 (Lead-Free)
| Profile Feature | Temperature | Time |
|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 to 200 | 60 -120 seconds |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. | - |
| Time maintained above TL | 217 | 60-150 seconds |
| Peak Temperature (Tp) | 260 | Time within 5 of actual peak Temperature (tp): 10 seconds |
| Ramp-down Rate | 6/second max. | - |
| Time 25 to Peak Temperature | - | 8 minutes max. |
Allowed Re-flow times: 2 times
Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing Dimension of Plastic Taping [mm]
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | All |
|---|---|---|---|---|---|
| Reel | 178 | 60 | 12 | 1.5 | - |
Packing Quantity:
3000pcs/Reel
Taping Dimensions [mm]
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 404012 | 12.0 | 4.40 | 4.40 | 1.50 | 1.0 | 1.75 | 5.50 | 1.40 | 4.00 | 2.00 | 8.00 | 0.35 |
| 404020 | 12.0 | 4.50.1 | 4.50.1 | 1.5 | 1.5 | 1.75 | 5.5 | 2.40.1 | 4.00 | 2.00 | 8.00 | 0.30 |
| 404030 | 12.0 | 4.40 | 4.40 | 1.50 | 1.0 | 1.75 | 5.50 | 3.40 | 4.00 | 2.00 | 8.00 | 0.35 |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina