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Mini Molded Chip Power Inductor MetalLions MTQH322512S2R2MBT for High Current Low Loss Applications

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Product Description

Product Overview

The MTQH3225 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit to minimize leakage flux, these RoHS-compliant inductors are suitable for a wide range of electronic devices. Key applications include smartphones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules. They operate reliably within a temperature range of -55 to +125 (including self-temperature rise).

Product Attributes

  • Brand: Metal-Lions (implied by website URL)
  • Series: MTQH3225
  • Type: Mini Molded Chip Power Inductor
  • Material Code: S Type
  • Coating Color: Black (B)
  • Compliance: RoHS compliant

Technical Specifications

Explanation of Part Number:

  • 1: Series Name: Mini Molding Chip type power inductor
  • 2: Size Code: L*W*T
  • 3: Material Code: S Type
  • 4: Initial inductance value (e.g., 2R2 = 2.2uH)
  • 5: Tolerance of Inductance (e.g., M: 20%)
  • 6: Coating color (e.g., B = Black)
  • 7: Packing: Tape Carrier Package
  • 8: Internal Code: A, B

Dimensions:

Series L (mm) W (mm) T (mm) A (Max.) B C
MTQH322512S 3.2 0.2 0.9 0.2 2.5 0.2 1.20 3.25 0.90
MTQH322510S 3.2 0.2 0.9 0.2 2.5 0.2 1.00 3.25 0.90
MTQH322520S 3.2 0.2 0.9 0.2 2.5 0.2 2.00 3.25 0.90

Land Pattern:

Series A (mm) B (mm) C (mm)
MTQH322512S 3.25 0.90 2.55
MTQH322510S 3.25 0.90 2.55
MTQH322520S 3.25 0.90 2.55

Electrical Properties:

P/N L0 (H) @(0A) 1MHz Rdc (m) Heat rating current Irms (A) Saturation current Isat (A)
Typical Max Typical Max Typical Max
MTQH322512SR10MBT 0.10 5.2 7.0 12.0 11.0 18.0 16.5
MTQH322512SR22MBT 0.22 6.6 10 9.2 8.7 11.5 11.0
MTQH322512SR24MBT 0.24 7.0 12 9.0 8.5 11 10.5
MTQH322512SR33MBT 0.33 9.0 14 8.4 8.1 10 9.5
MTQH322512SR47MBT 0.47 14 19 7.5 7.2 8.6 8.2
MTQH322512SR47MBTA 0.47 11 14 7.5 7.2 8.6 8.2
MTQH322512SR68MBT 0.68 18 23 7.3 6.8 8.1 7.7
MTQH322512SR68MBTA 0.68 12 15 7.0 6.5 8.0 7.5
MTQH322512S1R0MBT 1.0 26 30 5.3 4.8 6.6 5.8
MTQH322512S1R0MBTA 1.0 18 21 5.5 5.0 7.7 7.0
MTQH322512S1R5MBT 1.5 37 44 4.7 4.3 5.1 4.7
MTQH322512S2R2MBT 2.2 58 70 3.6 3.0 4.6 4.2
MTQH322512S2R2MBTA 2.2 42 50 3.8 3.5 5.0 4.5
MTQH322512S3R3MBT 3.3 75 95 2.9 2.5 3.7 3.2
MTQH322512S4R7MBT 4.7 115 135 2.3 2.0 2.9 2.6
MTQH322512S6R8MBT 6.8 177 210 2.1 1.9 2.8 2.4
MTQH322512S100MBT 10.0 210 230 2.2 1.8 2.3 1.9
MTQH322510SR33MBT 0.33 11 15 8.3 7.8 8.3 7.8
MTQH322510SR47MBT 0.47 17 22 6.4 5.9 8.3 7.6
MTQH322510SR68MBT 0.68 22 28 6.2 5.7 7.5 7.0
MTQH322510S1R0MBT 1.0 25 30 5.4 4.9 6.0 5.3
MTQH322510S1R5MBT 1.5 34 42 4.0 3.6 5.0 4.4
MTQH322510S2R2MBT 2.2 55 66 3.7 3.4 4.0 3.5
MTQH322510S3R3MBT 3.3 105 120 2.7 2.3 3.7 3.3
MTQH322510S4R7MBT 4.7 125 140 2.3 1.9 2.8 2.5
MTQH322510S6R8MBT 6.8 290 320 1.9 1.6 2.4 2.0
MTQH322510S100MBT 10.0 325 365 2.2 1.8 2.2 1.8
MTQH322520SR33MBT 0.33 7.5 9 9.5 9 15.5 14
MTQH322520SR47MBT 0.47 9 10.5 9.5 8.5 15 13
MTQH322520SR68MBT 0.68 12.5 14.5 9.0 8.0 13 11
MTQH322520S1R0MBT 1.0 15 17.5 8.2 7.5 9.0 8.3
MTQH322520S2R2MBT 2.2 36 43 5.4 4.8 6.5 5.5
MTQH322520S3R3MBT 3.3 55 60 4.5 4.0 4.5 3.5
MTQH322520S4R7MBT 4.7 81 94 3.5 3.0 4.0 3.0

Test Remarks:

  • Note 1: All test data is referenced to 25 ambient.
  • Note 2: Test Condition: 1MHz, 1.0Vrms.
  • Note 3: Irms: DC current (A) that will cause an approximate T of 40.
  • Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
  • Note 5: Operating Temperature Range -55 to +125.
  • Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions. Part temperature should be verified in the end application.
  • Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.

Reliability:

Item Requirements Test Methods and Remarks
Insulation Resistance 100M 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability 90% or more of electrode area shall be coated by new solder. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat No visible mechanical damage. Inductance change: Within 10%. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode Strong bond between the pad and the core, without come off PCB. Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds.
High temperature No case deformation or change in appearance. Inductance change: Within 10% Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature No visible mechanical damage. Inductance change: Within 10% Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock No visible mechanical damage. Inductance change: Within 10% The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic Inductance change Pc-b,Pc-d: Within 20% a+20 b: -40 c: +20 d: +125 e: +20 . 100% P = (Lb -L) / L 100% (c-b) ; P = (Ld -L) / L 100% (c-d)
Static Humidity No visible mechanical damage. Inductance change: Within 10% Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
Load life No visible mechanical damage. Inductance change: Within 10% Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

Soldering Condition (Recommendation):

Profile Feature Lead (Pb)-Free solder
Preheat: Tsmin Tsmax Time (ts) Average ramp-up rate Time maintained above: TL Time (tL) Peak Temperature (Tp) Time within 5 of actual peak Temperature (tp) Ramp-down Rate Time 25 to Peak Temperature
(solder : Sn96.5 / Ag3 / Cu0.5) 150 200 60 -120 seconds 3/ second max. 217 60-150 seconds 260 10 seconds 6/second max. 8 minutes max.

Allowed Re-flow times: 2 times. Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.

Packing Dimension of plastic taping:

Type A 0.5 B 0.5 C 0.5 D 1 All
Reel 178 60 12 1.5 3000pcs/Reel

Dimension of Reel:

Series W 0.30 A0 0.05 B0 +0.1/-0 D +0.1/-0 D1 Min E 0.10 F 0.10 K0 0.05 P0 0.10 P2 0.10 P 0.10 T 0.05
322510 8.00 2.90 3.50 1.50 1.0 1.75 3.50 1.20 4.00 2.00 4.00 0.23
322512 8.00 2.90 3.50 1.50 1.0 1.75 3.50 1.40 4.00 2.00 4.00 0.23
322520 8.00 2.90 3.50 1.50 1.0 1.75 3.50 2.20 4.00 2.00 4.00 0.28

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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