Compact ferrite wire wound chip inductor MetalLions MLW2012RF-100MT for Bluetooth and mobile devices

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Price: Negotiable

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Delivery Time: Negotiable

Product Description

Product Overview

The MLW-RF Series Wire Wound Chip Ferrite Inductors are compact, surface-mountable components designed for high-frequency applications. Featuring a ferrite material for large inductance in a small chip size, these RoHS compliant inductors are ideal for mobile phones, Bluetooth modules, TWS earphones, and other electronic devices. They offer a wide operating temperature range of -40 to +85.

Product Attributes

Series: MLW-RF
Material: Ferrite
Compliance: RoHS compliant
Operating Temperature Range: -4085 (Including self temp. rise)

Technical Specifications

Dimensions

Series	A (Max)	B (Max)	C (Max)	D (Typ.)	E (Typ.)
MLW1608RF	1.80 mm	1.25 mm	1.20 mm	1.02 mm	0.30 mm
MLW2012RF	2.29 mm	1.73 mm	1.52 mm	1.28 mm	0.48 mm

MLW1608RF Series Electrical Characteristics

Part Number	Inductance (H)	Tolerance	Test Freq. (MHz)	DC Resistance Typ. ()	Rated Current Typ. (mA)	Self-resonant Frequency (MHz)
MLW1608RF-1R5T	1.5	K,M	7.9	0.4030%	720	160
MLW1608RF-1R8T	1.8	K,M	7.9	0.4330%	640	121
MLW1608RF-2R2T	2.2	K,M	7.9	0.5630%	600	103
MLW1608RF-2R7T	2.7	K,M	7.9	0.6230%	540	72
MLW1608RF-3R3T	3.3	K,M	7.9	0.7030%	500	66
MLW1608RF-3R9T	3.9	K,M	7.9	0.8330%	460	61
MLW1608RF-4R7T	4.7	K,M	7.9	0.9730%	420	51
MLW1608RF-1R0T	1.0	K,M	7.9	0.3230%	860	390
MLW1608RF-6R8T	6.8	K,M	7.9	1.5030%	340	43
MLW1608RF-8R2T	8.2	K,M	7.9	1.6830%	300	40
MLW1608RF-100T	10	K,M	2.5	1.8530%	280	36
MLW1608RF-120T	12	K,M	2.5	2.2830%	260	32
MLW1608RF-150T	15	K,M	2.5	2.6030%	240	29
MLW1608RF-180T	18	K,M	2.5	2.9030%	220	28
MLW1608RF-220T	22	K,M	2.5	3.6130%	200	24
MLW1608RF-5R6T	5.6	K,M	7.9	1.1030%	380	47
MLW1608RF-270T	27	K,M	2.5	5.2030%	140	20
MLW1608RF-330T	33	K,M	2.5	6.6030%	120	15
MLW1608RF-470T	47	K,M	2.5	9.6530%	100	14

MLW2012RF Series Electrical Characteristics

Part Number	Inductance (H)	Tolerance	Test Freq. (MHz)	DC Resistance Typ. ()	Rated Current Typ. (mA)	Self-resonant Frequency (MHz)
MLW2012RF-R68T	0.68	K,M	7.9	0.1530%	1300	765
MLW2012RF-1R0T	1.0	K,M	7.9	0.1330%	1300	208
MLW2012RF-1R2T	1.2	K,M	7.9	0.1630%	1270	159
MLW2012RF-1R5T	1.5	K,M	7.9	0.1730%	1260	159
MLW2012RF-1R8T	1.8	K,M	7.9	0.2030%	1080	112
MLW2012RF-2R2T	2.2	K,M	7.9	0.2230%	1040	87
MLW2012RF-R47T	0.47	K,M	7.9	0.1230%	1500	850
MLW2012RF-3R3T	3.3	K,M	7.9	0.2830%	1020	70
MLW2012RF-3R9T	3.9	K,M	7.9	0.3830%	960	61
MLW2012RF-4R7T	4.7	K,M	7.9	0.4330%	840	51
MLW2012RF-5R6T	5.6	K,M	7.9	0.5030%	800	47
MLW2012RF-6R8T	6.8	K,M	7.9	0.6830%	700	46
MLW2012RF-8R2T	8.2	K,M	7.9	0.7330%	680	33
MLW2012RF-2R7T	2.7	K,M	7.9	0.2530%	1040	72
MLW2012RF-120T	12	K,M	2.5	0.9030%	460	30
MLW2012RF-150T	15	K,M	2.5	1.4030%	380	28
MLW2012RF-180T	18	K,M	2.5	1.5530%	360	27
MLW2012RF-220T	22	K,M	2.5	1.7629%	340	20
MLW2012RF-270T	27	K,M	2.5	2.0030%	300	17
MLW2012RF-330T	33	K,M	2.5	2.3530%	300	17
MLW2012RF-100T	10	K,M	2.5	0.8530%	560	31
MLW2012RF-560T	56	K,M	2.5	4.4230%	240	10
MLW2012RF-680T	68	K,M	2.5	4.4530%	240	10
MLW2012RF-820T	82	K,M	2.5	7.5030%	180	10
MLW2012RF-101T	100	K,M	1.0	7.5030%	180	9
MLW2012RF-470T	47	K,M	2.5	3.4030%	280	15

Packaging Quantity

Size	0402	0603	0805	1008	1210
Quantity (pcs)	10000	4000	2000	2000	2000

Soldering Conditions

Figure 1. Re-flow Soldering (Lead Free)

Pre-heating: 150 (circuit and products), 60~180s
Soldering: 260 / 10s max. (TP), 20~40s
Natural Cooling

Figure 2. Wave Soldering

Pre-heating: 150, 480s max.
Soldering: 245, 3s (max.)
Natural Cooling

Figure 3. Hand Soldering

Pre-heating: 150, Over 2 min.
Soldering: 330 (tip temp.), 10s (max.)
Gradual Cooling

Reliability Test

Test Item	Specification	Test Condition
Rating current	According to product specifications	Current sources:33010D
Inductance	According to product specifications	Test Frequency:0.252~250MHz, Test Equipment:HP4291A, HP4286A, HP4287A, HP4284A, Test Fixture:16193A or 16334A
Q	According to product specifications	Test Frequency:0.252~1500MHz, Test Equipment:HP4291A, HP4286A, HP4287A, Test Fixture:16193A or 16334A
RDC	According to product specifications	Test Equipment:HP4263B
SRF	According to product specifications	Test Equipment:HP4291A, Test Fixture:16193A
Solderability	More than 90% of solder coverage on the metalized area	Soldering Temp:2305, Dipping time:51S
Resistance to soldering heat	No mechanical damage; >75% solder coverage; Inductance change	Soldering Temp:2605, Dipping time:101S
Thermal Shock	No mechanical damage; Inductance change	Cycle: -40 (30Min) to 85 (30Min), 10 cycles
High Temperature Storage	No mechanical damage; Inductance change	Test Temp:1252 (Ceramic core) / 852 (Ferrite core), Test Time:962Hours
Low Temperature Storage	No mechanical damage; Inductance change	Test Temp:-402, Test Time:962Hours
Moisture Resistance	No mechanical damage; Inductance change	Test Temp:502, Test Time:100Hours, RH:90~95%
Vibration	No mechanical damage; Inductance change	Amplitude:1.5mm (X, Y, Z each direction for 1Hr 45min), Frequency range:10~55~10Hz (min)
Component Adhesion	No mechanical damage; No peel off or broken; Continuity of soldering	Force:2Kg, Test Time:51sec
Resistance to bend	No mechanical damage	Camber:20mm, Test Board:Glass-Epoxy, Thickness:8mm
Life	No mechanical damage; Inductance change	Test Temp:852, Test Time:1000Hours with rating current