Mini Molded Chip Power Inductor MetalLions MTQH201265S1R0MBT Featuring Low Loss and RoHS Compliance
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Product Description
Product Overview
The MTQH2012 Series Mini Molded Chip Power Inductors are designed for high-performance applications requiring large current handling and low loss. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these RoHS-compliant inductors are suitable for a wide range of electronic devices. Applications include smartphones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules. They operate within a temperature range of -55 to +125 (including self-temperature rise).
Product Attributes
- Brand: Metal-Lions (inferred from URL)
- Series: MTQH2012
- Type: Mini Molded Chip Power Inductor
- Material: Metal material, Vinyl thermal spray
- Magnetic Circuit: Closed magnetic circuit design
- Compliance: RoHS compliant
- Operating Temperature Range: -55 to +125 (Including self-temperature rise)
Technical Specifications
| Dimensions (mm) | L*W*T | A (Max) | B (Max) | C (Max) | |||||
|---|---|---|---|---|---|---|---|---|---|
| Series | L | G | W | T | |||||
| MTQH201265S | 2.00.2 | 0.50.2 | 1.20.2 | 0.65 | 65S | 2.0*1.2*0.65mm | 2.10 | 0.50 | 1.30 |
| MTQH201208S | 2.00.2 | 0.50.2 | 1.20.2 | 0.80 | 08S | 2.0*1.2*0.8mm | 2.10 | 0.50 | 1.30 |
| MTQH201210S | 2.00.2 | 0.50.2 | 1.20.2 | 1.00 | 10S | 2.0*1.2*1.0mm | 2.10 | 0.50 | 1.30 |
Electrical Properties
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Heat Rating Current Irms (A) | Saturation Current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH201265S1R0MBT | 1.0 | 78 | 86 | 2.6 | 2.3 | 2.8 | 2.5 |
| MTQH201265B1R0MBT | 1.0 | 95 | 110 | 2.5 | 2.2 | 2.7 | 2.4 |
| MTQH201265S2R2MBT | 2.2 | 215 | 230 | 1.7 | 1.4 | 1.8 | 1.5 |
| MTQH201208SR24MBT | 0.24 | 17 | 20 | 6.0 | 5.5 | 7.0 | 6.6 |
| MTQH201208SR33MBT | 0.33 | 33 | 45 | 4.3 | 4.0 | 5.2 | 4.8 |
| MTQH201208SR47MBT | 0.47 | 34 | 50 | 3.5 | 3.3 | 5.0 | 4.6 |
| MTQH201208SR47MBTA | 0.47 | 24 | 28 | 4.7 | 4.5 | 5.2 | 4.8 |
| MTQH201208DR47MBT | 0.47 | 34 | 42 | 4.3 | 3.9 | 5.2 | 4.8 |
| MTQH201208SR68MBT | 0.68 | 50 | 60 | 3.7 | 3.3 | 4.2 | 3.7 |
| MTQH201208S1R0MBT | 1.0 | 55 | 70 | 3.3 | 2.9 | 4.0 | 3.5 |
| MTQH201208S1R0MBTA | 1.0 | 48 | 55 | 3.2 | 2.8 | 3.2 | 2.8 |
| MTQH201208S1R5MBT | 1.5 | 118 | 135 | 2.2 | 1.9 | 3.0 | 2.5 |
| MTQH201208S2R2MBT | 2.2 | 160 | 185 | 2.2 | 1.8 | 2.6 | 2.3 |
| MTQH201208S3R3MBT | 3.3 | 253 | 300 | 1.8 | 1.5 | 1.9 | 1.6 |
| MTQH201208S4R7MBT | 4.7 | 285 | 325 | 1.7 | 1.5 | 1.6 | 1.4 |
| MTQH201208SR24MBT | 0.24 | 18 | 23 | 6.5 | 5.9 | 6.5 | 6.0 |
| MTQH201210SR10MBT | 0.1 | 8.0 | 13 | 7.5 | 7.0 | 8.5 | 8.0 |
| MTQH201210SR22MBT | 0.22 | 16 | 22 | 7.1 | 6.5 | 7.3 | 6.8 |
| MTQH201210SR24MBT | 0.24 | 17 | 23 | 7.0 | 6.4 | 7.2 | 6.7 |
| MTQH201210SR24MBTA | 0.24 | 13 | 17 | 7.0 | 6.4 | 7.2 | 6.7 |
| MTQH201210SR33MBT | 0.33 | 24 | 32 | 5.5 | 5.0 | 6.5 | 6.0 |
| MTQH201210SR33MBTB | 0.33 | 18 | 22 | 5.7 | 5.2 | 6.7 | 6.3 |
| MTQH201210SR47MBT | 0.47 | 29 | 36 | 4.7 | 4.3 | 5.5 | 5.0 |
| MTQH201210SR47MBTB | 0.47 | 22 | 26 | 5.0 | 4.5 | 6.0 | 5.5 |
| MTQH201210SR68MBT | 0.68 | 37 | 43 | 4.3 | 4.0 | 5.0 | 4.5 |
| MTQH201210S1R0MBT | 1.0 | 55 | 63 | 3.9 | 3.5 | 4.0 | 3.5 |
| MTQH201210S1R5MBT | 1.5 | 76 | 85 | 3.1 | 2.6 | 3.2 | 2.7 |
| MTQH201210S2R2MBT | 2.2 | 135 | 150 | 2.0 | 1.7 | 2.7 | 2.4 |
| MTQH201210S6R8MBT | 6.8 | 440 | 520 | 1.5 | 1.3 | 1.45 | 1.2 |
| MTQH201210S100MBT | 10.0 | 600 | 660 | 1.1 | 1.0 | 1.2 | 1.0 |
Test Remarks
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Irms: DC current (A) that will cause an approximate T of 40.
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -55 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605) for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 20% | a: +20 b: -40 c: +20 d: +125 e: +20 . Formula: 100% * (Lb - Lc) / Lc; 100% * (Ld - Lc) / Lc. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| High Temp. Storage | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
| Profile Feature | Temperature | Time |
|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 - 200 | 60 -120 seconds |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. | |
| Time maintained above TL | 217 | 60-150 seconds |
| Peak Temperature (Tp) | 260 | Time within 5 of actual peak Temperature (tp): 10 seconds |
| Ramp-down Rate | 6/second max. | |
| Time 25 to Peak Temperature | 8 minutes max. | |
| Allowed Re-flow times | 2 times | |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. | |
Packing Dimension of Plastic Taping (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 201265 | 8.00 | 1.50 | 2.30 | 1.50 | 1.0 | 1.75 | 3.50 | 0.8 | 4.00 | 2.00 | 4.00 | 0.23 |
| 201208 | 8.00 | 1.50 | 2.30 | 1.50 | 1.0 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
| 201210 | 8.00 | 1.50 | 2.30 | 1.50 | 1.0 | 1.75 | 3.50 | 1.20 | 4.00 | 2.00 | 4.00 | 0.23 |
Packing Quantity: 3000pcs/Reel
Dimension of Reel (Unit: mm)
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| All | 178 | 60 | 12 | 1.5 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina