Metal Material Molded Power Inductors MetalLions MTQH404030S2R2MBT RoHS Compliant for VR and AR Devices
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The MTQH404030S Series Molded Power Inductors are designed for high-performance applications requiring large current handling and low loss. Featuring a metal material construction, vinyl thermal spray for enhanced surface compactness, and a closed magnetic circuit design to minimize leakage flux, these RoHS-compliant inductors are suitable for a wide range of electronic devices. Key applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules, particularly in baseband power supplies, amplifiers, power management, and camera power management systems.
Product Attributes
- Series Name: Molding power inductors
- Material: Metal
- Coating Color: Black (B), Gray (G)
- Certifications: RoHS compliant, AEC-Q200
- Operating Temperature Range: -55 to +125 (Including self temp. rise)
- Packing: Tape Carrier Package
Technical Specifications
| Part Number | L0 (H) @ (0A) 1MHz | Rdc (m) Typical | Rdc (m) Max | Irms (A) Typical | Irms (A) Max | Isat (A) Typical | Isat (A) Max |
|---|---|---|---|---|---|---|---|
| MTQH404030SR33MT | 0.33 | 4.5 | 6.0 | 16 | 15 | 25 | 23 |
| MTQH404030SR47MT | 0.47 | 5.5 | 7.0 | 15 | 14 | 23 | 21 |
| MTQH404030SR56MT | 0.56 | 6.0 | 7.5 | 15 | 14 | 22 | 20 |
| MTQH404030SR68MT | 0.68 | 8.3 | 10 | 9.5 | 8.0 | 17 | 15 |
| MTQH404030S1R0MT | 1.0 | 10 | 12 | 10 | 9.0 | 15.5 | 14 |
| MTQH404030S1R5MT | 1.5 | 15 | 18 | 6.5 | 6.0 | 12.5 | 11 |
| MTQH404030S2R2MT | 2.2 | 19 | 22 | 9.0 | 8.5 | 10.5 | 9.5 |
| MTQH404030S2R2MTA | 2.2 | 22 | 25 | 9.2 | 8.6 | 11 | 10 |
| MTQH404030S3R3MT | 3.3 | 30 | 35 | 5.3 | 4.8 | 8.5 | 7.5 |
| MTQH404030S4R7MT | 4.7 | 41 | 46 | 4.3 | 4.0 | 7.0 | 6.0 |
| MTQH404030S4R7MTA | 4.7 | 36 | 42 | 6.0 | 5.5 | 7.8 | 6.8 |
| MTQH404030S5R6MT | 5.6 | 41 | 48 | 5.5 | 5.0 | 7.0 | 6.2 |
| MTQH404030S6R8MT | 6.8 | 51 | 62 | 4.2 | 3.8 | 6.3 | 5.1 |
| MTQH404030S8R2MT | 8.2 | 90 | 102 | 3.9 | 3.5 | 5.2 | 4.8 |
| MTQH404030S100MT | 10.0 | 92 | 110 | 3.7 | 3.3 | 4.9 | 4.5 |
| MTQH404030S220MT | 22.0 | 190 | 220 | 2.5 | 2.2 | 3.4 | 3.0 |
| Series | L | G/Typ | W | E | T | A/Typ | B/Typ | C/Typ |
|---|---|---|---|---|---|---|---|---|
| MTQH404030S | 4.10.2 | 1.4 | 4.10.2 | 1.350.2 | 3.00Max. | 4.10 | 1.30 | 4.10 |
| No. | Item | Requirements | Test Methods and Remarks | Reference Sample Size |
|---|---|---|---|---|
| 1 | Solderability | (1) No case deformation or change in appearance. (2) Terminal area must have 95% min. Solder coverage. | Temperature:245 5. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Sample immersion tin furnace 5 0.5s. AEC-Q200 (J-STD 002) | 32 |
| 2 | Adhesion of teral electrode | (1)Strong bond between the pad and the core, without come off PCB. | Preconditioning245Reflow 3 times Inductors shall be subjected to (260+0/-5.) for (105)s Soldering in the base whit 0.3mm solder. Aplombelectrode way plus tax 12 N for (101) seconds. AEC-Q200 (AEC-Q200- 006) | 32 |
| 3 | Reflow test | (1) No physical damage. (2)L0/L010% | The peak temperature: 260+0/-5. Reflow:3times. Temperature curve is as below AEC-Q200 (MIL-STD-202 Method 210) | 32 |
| 4 | High temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| 5 | Low temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion JESD22-A119A | 77 |
| 6 | Thermal shock | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Repeat 500 cycle as follow : (-552 ,303minutes) (Room temperature, 5 minutes)(+1252 ,303minutes)(Room temperature, 5 minutes) Measurement at 244 hours after test conclusion MIL-STD -202 Method 107 | 77 |
| 7 | Resistance to Soldering Heat | (1) No physical damage. (2)L0/L010% | Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. AEC-Q200 MIL-STD- 202 Method 210 | 32 |
| 8 | Static Humidity | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times 1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion AEC-Q200 (MIL-STD-202 Method 103) | 77 |
| 9 | Board Flex | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. AEC-Q200 (AEC-Q200- 005) | 30 |
| 10 | Vibration | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Frequency range : 10~2000Hz. Amplitude: 1.5mm or 20g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours in X,Y,Z direction, 12hours in total. AEC-Q200 (MIL-STD-202 Method 204) | 32 |
| 11 | Mechanical Shock | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Peak acceleration:100G/S Duration of pulse:6ms 3times in each of 6(X, Y, Z) axes. AEC-Q200 (MIL-STD-202 Method 213) | 32 |
| 12 | Loading at High Temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion AEC-Q200 (MIL-STD-202 Method 108) | 77 |
| Series | W | A0 0.30 | B0 0.10 | D0 0.10 | D1 +0.1/-0 | E 0.20 | F 0.10 | K0 0.10 | P0 0.10 | P2 0.10 | P1 0.10 | T 0.05 | Packaging Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 404030 | 12.0 | 4.40 | 4.40 | 1.5 | 1.5 | 1.75 | 5.5 | 3.10 | 4.0 | 2.0 | 8.0 | 0.30 | 2K |
| Profile Feature | Temperature | Time |
|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 - 200 | 60 -120 seconds |
| Time maintained above (TL) | 217 | 60-150 seconds |
| Peak Temperature (Tp) | 260 | 10 seconds |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina