Low Loss Mini Molded Chip Power Inductor MetalLions MTQH160808SR47MBT for WiFi Modules and Notebooks
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH1608 Series Mini Molded Chip Power Inductors are designed for high-current applications with low loss, featuring a closed magnetic circuit to minimize leakage flux. Constructed with metal material and a vinyl thermal spray for enhanced surface compactness, these RoHS-compliant inductors are suitable for a wide operating temperature range of -55 to +125. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by www.metal-lions.com)
- Series Name: MTQH Series Mini Molding Chip type power inductor
- Material Code: S, B Type
- Coating Color: Black (B)
- RoHS Compliant: Yes
- Internal Code: A, B
Technical Specifications
| Dimensions (mm) | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Series | L | G | W | T | A | B | C | P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Irms (A) | Isat (A) | |||
| 0.1 | 0.2 | 0.1 | Max. | Typical | Max | Typical | Max | Typical | Max | ||||||
| MTQH160865B | 1.6 | 0.5 | 0.8 | 0.65 | 1.70 | 0.40 | 0.90 | MTQH160865BR22MBT | 0.22 | 35 | 43 | 3.8 | 3.5 | 4.7 | 4.3 |
| MTQH160865S | 1.6 | 0.5 | 0.8 | 0.65 | 1.60 | 0.40 | 0.80 | MTQH160865SR47MBT | 0.47 | 66 | 82 | 2.3 | 2.0 | 3.3 | 3.0 |
| MTQH160808S | 1.6 | 0.5 | 0.8 | 0.80 | 1.70 | 0.40 | 0.90 | MTQH160808SR22MBT | 0.22 | 33 | 40 | 3.4 | 3.0 | 5.5 | 5.0 |
| MTQH160808SR24MBT | 0.24 | 34 | 41 | 3.3 | 2.9 | 5.3 | 4.8 | ||||||||
| MTQH160808SR24MBTA | 0.24 | 22 | 26 | 3.9 | 3.5 | 4.9 | 4.4 | ||||||||
| MTQH160808SR47MBT | 0.47 | 80 | 100 | 2.6 | 2.3 | 4.1 | 3.7 | ||||||||
| MTQH160808SR47MBTA | 0.47 | 38 | 45 | 3.8 | 3.4 | 4.0 | 3.5 | ||||||||
| MTQH160808SR56MBT | 0.56 | 85 | 110 | 2.2 | 1.9 | 4.0 | 3.5 | ||||||||
| MTQH160808SR68MBT | 0.68 | 110 | 130 | 2.1 | 1.9 | 3.3 | 3.0 | ||||||||
| MTQH160808S1R0MBT | 1.0 | 180 | 200 | 2.1 | 1.8 | 3.0 | 2.6 | ||||||||
| MTQH160808S1R0MBTA | 1.0 | 105 | 115 | 2.1 | 1.8 | 2.3 | 2.1 | ||||||||
| MTQH160808S2R2MBT | 2.2 | 220 | 260 | 1.4 | 1.2 | 1.5 | 1.3 | ||||||||
| MTQH160808S4R7MBT | 4.7 | 585 | 700 | 1.0 | 0.8 | 1.2 | 1.0 | ||||||||
Operating Conditions
- Operating Temperature Range: -55125 (Including self temp. rise)
- Rated current is either saturation current or heating current, whichever is lower.
- Part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions.
Reliability Test
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base with 0.3mm solder. And then apply electrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% P = (Lb - Lc)/Lc 100%; P = (Ld - Lc)/Lc 100%. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Heat Resistance | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be stored at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
| Profile Feature | Lead (Pb)-Free solder | |||||
|---|---|---|---|---|---|---|
| Min (Tsmin) | Max (Tsmax) | Time (Tsmin to Tsmax ) (ts) | Average ramp-up rate | Time maintained above : Temperature (TL) | Time (tL) | |
| Preheat | 150 | 200 | 60 -120 seconds | 3/ second max. (Ts max to Tp) | 217 | 60-150 seconds |
| Profile Feature | Peak Temperature (Tp) | Time within + 5 of actual peak Temperature (tp) | Ramp-down Rate | Time 25 to Peak Temperature | Allowed Re-flow times | Remark |
| 260 | 2 10 seconds | 6/second max. | 8 minutes max. | 2 times | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension
| Plastic Taping (Unit: mm) | Reel (Unit: mm) | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | All | 178 | 60 | 12 | 1.5 | |||
| Packing Quantity | 3000pcs/Reel | |||||||||||
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
| 1608065 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 0.80 | 4.00 | 2.00 | 4.00 | 0.23 |
| 160808 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina