Mini Molded Chip Power Inductor MetalLions MTQH 141208SR24MBT with RoHS Compliance and Metal Material
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH1412 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit to minimize leakage flux, these RoHS-compliant inductors are suitable for a wide range of electronic devices. They are ideal for use in smartphones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by website URL)
- Series: MTQH1412 Series
- Type: Mini Molding Chip type power inductor
- Material: Metal material, Vinyl thermal spray coating
- Magnetic Circuit: Closed magnetic circuit design
- Certification: RoHS compliant
- Operating Temperature Range: -55 to +125 (Including self temp. rise)
- Coating Color: Black (for specific models)
- Packing: Tape Carrier Package (3000pcs/Reel)
Technical Specifications
| Series | Model | L*W*T (mm) | L0 (H) @ 1MHz (Typical) | Rdc (m) (Typical) | Irms (A) (Typical) | Isat (A) (Typical) |
|---|---|---|---|---|---|---|
| MTQH1412 Series | MTQH141265S | 1.40.2 * 0.50.2 * 1.20.2 | - | - | - | - |
| MTQH141208S | 1.40.2 * 0.50.2 * 1.20.2 | - | - | - | - | |
| MTQH141207S | 1.40.2 * 0.50.2 * 1.20.2 | - | - | - | - | |
| Dimensions (Max) | L: 0.65 Max. (for 141265S) L: 0.80 Max. (for 141208S) L: 0.70 Max. (for 141207S) | - | - | - | - | |
| MTQH141265SR33MBT | (1.4*1.2*0.65mm) | 0.33 | 26 | 4.4 | 4.4 | |
| MTQH141265SR47MBT | (1.4*1.2*0.65mm) | 0.47 | 37 | 3.0 | 3.4 | |
| MTQH141207SR24MBT | (1.4*1.2*0.7mm) | 0.24 | 22 | 4.0 | 4.6 | |
| MTQH141207SR47MBT | (1.4*1.2*0.7mm) | 0.47 | 34 | 3.8 | 3.8 | |
| MTQH141208SR24MBT | (1.4*1.2*0.8mm) | 0.24 | 22 | 4.1 | 6.0 | |
| MTQH141208SR33MBT | (1.4*1.2*0.8mm) | 0.33 | 23 | 4.0 | 5.3 | |
| MTQH41265SR47MBTB | - | 0.47 | 35 | 2.9 | 3.9 | |
| MTQH141208SR47MBT | (1.4*1.2*0.8mm) | 0.47 | 29 | 3.8 | 4.6 | |
| MTQH141208SR24MBTB | - | 0.24 | 21 | 6.6 | 7.2 | |
Reliability & Soldering
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base with 0.3mm solder. And then aplomb electrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) , different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% c-b P = (Lb -Lc)/Lc 100%; c-d P = (Ld -Lc)/Lc 100% |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Storage Test | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Packing & Soldering Conditions
Packing Quantity: 3000pcs/Reel
Recommended Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
- Preheat: Tsmin 150, Tsmax 200, ts 60 -120 seconds
- Average ramp-up rate: 3/ second max.
- Time maintained above: TL 217, tL 60-150 seconds
- Peak Temperature (Tp): 260
- Time within 5 of actual peak Temperature (tp): 2 - 10 seconds
- Ramp-down Rate: 6/second max.
- Time 25 to Peak Temperature: 8 minutes max.
- Allowed Re-flow times: 2 times
- Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing Dimension of plastic taping (Unit: mm):
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 141265 | 8.00 | 1.50 | 1.70 | 1.50 | 1.0 | 1.75 | 3.50 | 0.80 | 4.00 | 2.00 | 4.00 | 0.23 |
| 141208 | 8.00 | 1.50 | 1.70 | 1.50 | 1.0 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
Dimension of Reel (Unit: mm):
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| All | 178 | 60 | 12 | 1.5 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina