Low dcr molded power inductors MetalLions MMPC0402-1R8MT suitable for pc power systems and imvp 6 converters
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MOQ:
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Delivery Time:
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Product Description
Product Overview
MMPC0402-1R8MT High Current Molded Power Inductors are designed with carbonyl powder for a compact form factor, offering high current capability, low DCR, and high efficiency. These inductors operate effectively in frequency ranges up to 5MHz and are suitable for PC power systems, including IMVP-6 DC/DC converters. They are characterized by very low acoustic noise and very low leakage flux noise, and are RoHS compliant. The operating temperature range is -40 to +125 (including self-temperature rise).Product Attributes
- Brand: Metal-Lions (implied from website URL)
- Product Series: Carbonyl Molding Power Inductor (MMPC)
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Certifications: RoHS compliant
- Packing: Tape Carrier Package
Technical Specifications
| Part Number | Inductance (uH) | Tolerance | Irms (A) | Isat (A) | DCR (m) | Dimensions (mm) | Operating Temperature Range |
|---|---|---|---|---|---|---|---|
| MMPC0402-1R8MT | 1.8 (Typ.) | 20% (M) | 4.3 (Max.) | 6.5 (Typ.) | 3.8 (Max.) | A: 4.450.25, A': 3.950.20, B: 4.060.25, C: 1.80.2, D: 0.760.30, E: 2.00.20 | -40125 (Including self temp. rise) |
| Dimensions (mm) | |||||||
| Series | A(mm) | A`(mm) | B(mm) | C(mm) | D(mm) | E(mm) | L(mm) |
| MMPC0402 | 4.450.25 | 3.950.20 | 4.060.25 | 1.80.2 | 0.760.30 | 2.00.20 | 5.2 |
| Series | G(mm) | H(mm) | |||||
| MMPC0402 | 2.2 | 2.3 | |||||
| Electrical Properties | |||||||
| Part Number | Inductance (uH) 20% | I rmsA Max. | I satA Typ | DCRm Typ | |||
| MMPC0402-1R8MT | 1.8 | 4.3 | 6.5 | 3.8 | |||
| Reliability and Test Condition | |||||||
| Item | Performance Test Condition | ||||||
| Operating temperature | -40~+125 (Including self-temperature rise) | ||||||
| Storage temperature | 1. -10~+40, 50~60%RH (Product without taping) 2. -40~+125 (on board) | ||||||
| Electrical Performance Test | Inductance: Refer to standard electrical characteristics list. DCR: Refer to standard electrical characteristics list. Saturation Current (Isat): Approximately L30%. Heat Rated Current (Irms): Approximately T40. | ||||||
| Life Test | Preconditioning: IR reflow for 3 times. Temperature: 1252. Applied current: rated current. Duration: 100012hrs. Measured at room temperature after placing for 242 hrs. | ||||||
| Load Humidity | Preconditioning: IR reflow for 3 times. Humidity: 852%RH, Temperature: 852. Duration: 1000hrs. Measured at room temperature after placing for 242 hrs. | ||||||
| Moisture Resistance | Preconditioning: IR reflow for 3 times. Step 1: Baked at 50 for 25hrs. Step 2: Raise temperature to 652 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs. Step 3: Repeat Step 2. Step 4: Keep at 25 80-100%RH for 15min and vibrate at 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. | ||||||
| Thermal shock | Preconditioning: IR reflow for 3 times. Condition for 1 cycle: Step1: -402 305min, Step2: 1252 0.5min, Step3: 1252 305min. Number of cycles: 500. Measured at room temperature after placing for 242 hrs. | ||||||
| Vibration | Preconditioning: IR reflow for 3 times. Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes. Total Amplitude: 10g. Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations). | ||||||
| Bending | Preconditioning: IR reflow for 3 times. Mounted on FR4 substrate. Bending depth: >=0805 inch(2012mm):1.2mm, Duration: 10 sec. | ||||||
| Shock | Preconditioning: IR reflow for 3 times. 3 shocks in each direction along 3 perpendicular axes (18 shocks). Type: SMD, Peak value: 50g, Normal duration (D): 11ms, Wave form: Half-sine, Velocity change (Vi): 11.3 ft/sec. | ||||||
| Resistance to Soldering Heat | Preconditioning: IR reflow for 3 times. Method B1, 4 hrs @155C dry heat. Method D category 3. (steam aging 8hours 15 min)@ 260C5C. Test time: 5 +0/-0.5 seconds (Method B1), 30 +0/-0.5 seconds (Method D). | ||||||
| Terminal Strength | Preconditioning: IR reflow for 3 times. Apply a force (>0805inch(2012mm):1kg, | ||||||
| Soldering and Mounting | |||||||
| Soldering Iron | Preheat circuit and products to 150. Never contact the ceramic with the iron tip. Use a 20 watt soldering iron with tip diameter of 1.0mm. 355 tip temperature (max). Limit soldering time to 4~5sec. | ||||||
| Reflow Soldering | Recommended temperature profiles in Figure 1. Reflow times: 3 times max. | ||||||
| Packaging Information | |||||||
| Product | Reel Quantity | Inner Box Quantity | Carton Quantity | ||||
| MMPC 0402 Chip | 3000 | 6000 | 24000 | ||||
| Application Notice | |||||||
| Storage Conditions | Less than 40 and 60% RH. Recommended to be used within 12 months from delivery. | ||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina