Wire Wound Chip Ferrite Inductor MetalLions MLW1608RD-4R7MT Surface Mount Type for Compact Electronic Devices

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Product Description

Product Overview

The MLW1608RD Series Wire Wound Chip Ferrite Inductors are designed for surface mounting, offering large inductance values due to their ferrite material construction. These compact inductors are RoHS compliant and suitable for a wide operating temperature range of -40 to +85. They are ideal for use in mobile phones, other electronic devices, Bluetooth modules, and TWS earphones.

Product Attributes

Product Series: MLW1608RD Series
Type: Wire Wound Chip Ferrite Inductors
Material Code: RD Type
Compliance: RoHS compliant
Brand: Metal-Lions (implied by URL)

Technical Specifications

Part Number	Inductance (H)	Test Frequency (MHz)	Q (Typ)	SRF (MHz) Typ	Rdc () Typ	Isat (mA) Typ	Irms (mA) Typ
MLW1608RD-1R0MT	1.0	10	350.00	150.00	0.14	800.00	350.00
MLW1608RD-2R2MT	2.2	10	600.00	90.00	0.30	450.00	270.00
MLW1608RD-4R7MT	4.7	10	500.00	57.00	0.46	410.00	220.00
MLW1608RD-6R8MT	6.8	10	500.00	35.00	0.67	270.00	180.00
MLW1608RD-100MT	10.0	10	380.00	25.00	1.00	150.00	100.00
MLW1608RD-150MT	15.0	10	25.00	1.42	1.50	80.00	60.00
MLW1608RD-220MT	22.0	8	270.00	20.00	2.46	70.00	50.00

Dimensions [mm]

L(MAX)	W(MAX)	T(MAX)	E(Typ.)	F(Typ.)	D(Typ.)
1.80	1.60	1.00	0.64	1.02	1.25

Soldering Conditions

Re-flow Soldering (Lead Free)

Preheat circuit and products to 150
260 tip temperature (max)
Reflow times: no more than 2 times
Solder paste thickness: best 0.08mm, max 0.1mm

Temperature Profile:

PRE-HEATING	SOLDERING	COOL
150 (60~180s)	260 / 10s max. (TP)	NATURAL COOLING (Over 1 min.)
NATURAL PRE-HEATING (20~40s)
(217) (60~150s)

Hand Soldering

Use a 20 watt soldering iron with tip diameter of 1.0mm
Limit soldering time to 3 sec.

Temperature Profile:

PRE-HEATING	SOLDERING	COOLING
150 (10s max.)	330 / 3s(max.)	GRADUAL COOLING (Over 1 min.)
350 (25s)

Packaging

Packaging Quantity: 4000Pcs/Reel

A Typ	B Typ	T Typ	E Typ	W Typ	A Typ	B Typ	C Typ	D Typ
1.15	1.83	0.95	2	8.4	178	60	13	21

Reliability Test

TEST ITEM	SPECIFICATION	TEST CONDITION
Solderability	More than 90% of solder coverage on the metalized area	Soldering Temp: 2305, Dipping time: 51S
Resistance to soldering heat	No evidence of mechanical damage. More than 75% of solder coverage on the metalized area. Inductance change: 5%, Q change: 10%	Soldering Temp: 2605, Dipping time: 101S
Thermal Shock	No evidence of mechanical damage. Inductance change: 5%, Q change: 10%	Cycle: -40 (30Min) to 85 (30Min), 10 Cycles
High Temperature Storage	No evidence of mechanical damage. Inductance change: 5%, Q change: 10%	Test Temp: 1252 (Ceramic core) / 852 (Ferrite core), Test Time: 962Hours
Low Temperature Storage	No evidence of mechanical damage. Inductance change: 5%, Q change: 10%	Test Temp: -402, Test Time: 962Hours
Moisture Resistance	No evidence of mechanical damage. Inductance change: 5%, Q change: 10%	Test Temp: 502, Test Time: 100Hours, Relative humidity: 90~95%
Vibration	No evidence of mechanical damage. Inductance change: 5%, Q change: 10%	Amplitude: 1.5mm (X, Y, Z each direction for 1Hr 45min), Frequency range: 10~55~10Hz
Component Adhesion	No evidence of mechanical damage or peel off/broken. Keep continuity of soldering.	Force: 2Kg, Test Time: 51sec
Resistance to bend	No evidence of mechanical damage.	Camber: 20mm, Test Board: Glass-Epoxy, Thickness: 8mm
Life	No evidence of mechanical damage. Inductance change: 5%, Q change: 10%	Test Temp: 852, Test Time: 1000Hours at rated current