Mini Molded Chip Power Inductor MetalLions MTQH160808S4R7MBT Designed for Smart Phones Pads and Notebooks
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH1608 Series Mini Molded Chip Power Inductors are designed for high-current applications with low loss, featuring a closed magnetic circuit for reduced leakage flux. Constructed with metal material and a vinyl thermal spray for enhanced surface compactness, these RoHS-compliant inductors are suitable for a wide operating temperature range of -55 to +125. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by URL www.metal-lions.com)
- Series: MTQH1608
- Type: Mini Molded Chip Power Inductor
- Material: Metal material
- Coating: Vinyl thermal spray
- Magnetic Circuit: Closed magnetic circuit design
- Compliance: RoHS compliant
- Coating Color: Black (B)
- Internal Code: A, B
- Packing: Tape Carrier Package
Technical Specifications
Dimensions and Land Pattern
| Series | L (mm) | W (mm) | T (mm) | A (mm) | B (mm) | C (mm) |
|---|---|---|---|---|---|---|
| MTQH160865B | 1.6 0.1 | 0.5 0.2 | 0.8 0.1 | 0.65 Max. | 1.70 | 0.40 |
| MTQH160865S | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.65 Max. | 1.60 | 0.40 |
| MTQH160808S | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.80 Max. | 1.70 | 0.40 |
Electrical Properties & Part Number Explanation
| Part Number | Series Name | Size Code (L*W*T) | Material Code | Initial Inductance Value (L0 @ 1MHz, 0A) (H) | Tolerance (M) | Coating Color (B) | Internal Code | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current Irms (A) Typical | Heat Rating Current Irms (A) Max | Saturation Current Isat (A) Typical | Saturation Current Isat (A) Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTQH160865BR22MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.65mm | B | 0.22 | 20% | Black | A | 35 | 43 | 3.8 | 3.5 | 4.7 | 4.3 |
| MTQH160865SR47MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.65mm | S | 0.47 | 20% | Black | A | 66 | 82 | 2.3 | 2.0 | 3.3 | 3.0 |
| MTQH160808SR22MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.22 | 20% | Black | A | 33 | 40 | 3.4 | 3.0 | 5.5 | 5.0 |
| MTQH160808SR24MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.24 | 20% | Black | A | 34 | 41 | 3.3 | 2.9 | 5.3 | 4.8 |
| MTQH160808SR24MBTA | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.24 | 20% | Black | A | 22 | 26 | 3.9 | 3.5 | 4.9 | 4.4 |
| MTQH160808SR47MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.47 | 20% | Black | A | 80 | 100 | 2.6 | 2.3 | 4.1 | 3.7 |
| MTQH160808SR47MBTA | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.47 | 20% | Black | A | 38 | 45 | 3.8 | 3.4 | 4.0 | 3.5 |
| MTQH160808SR56MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.56 | 20% | Black | A | 85 | 110 | 2.2 | 1.9 | 4.0 | 3.5 |
| MTQH160808SR68MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.68 | 20% | Black | A | 110 | 130 | 2.1 | 1.9 | 3.3 | 3.0 |
| MTQH160808S1R0MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 1.0 | 20% | Black | A | 180 | 200 | 2.1 | 1.8 | 3.0 | 2.6 |
| MTQH160808S1R0MBTA | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 1.0 | 20% | Black | A | 105 | 115 | 2.1 | 1.8 | 2.3 | 2.1 |
| MTQH160808S2R2MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 2.2 | 20% | Black | A | 220 | 260 | 1.4 | 1.2 | 1.5 | 1.3 |
| MTQH160808S4R7MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 4.7 | 20% | Black | A | 585 | 700 | 1.0 | 0.8 | 1.2 | 1.0 |
Operating Conditions
| Parameter | Value |
|---|---|
| Operating Temperature Range | -55 to +125 (Including self temp. rise) |
| Test Condition (Electrical) | 1MHz, 1.0Vrms at 25 ambient |
| Irms Definition | DC current that will cause an approximate T of 40 |
| Isat Definition | DC current that will cause L0 to drop approximately 30% |
| Maximum Part Temperature | 125 (ambient + temp rise) |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605) for (205)s Soldering in the base with 0.3mm solder. And then apply electrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | Sample placed at (-553) and (1253) for (303)s, conversion time 2~3 minutes. 32 cycles. Placed at room temperature for 2 hours, tested within 484 hours. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 20%. | a+20 b: -40 c: +20 d: +125 e: +20 . Calculation: P = (Lb - Lc)/Lc * 100%; P = (Ld - Lc)/Lc * 100%. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, tested within 48 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. | Stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, tested within 48 hours. |
Soldering Condition (Recommendation)
| Profile Feature | Parameter | Value | Unit |
|---|---|---|---|
| Preheat | Temperature Min (Tsmin) | 150 | |
| Temperature Max (Tsmax) | 200 | ||
| Time (Tsmin to Tsmax) (ts) | 60 -120 | seconds | |
| Average ramp-up rate (Ts max to Tp) | Max | 3 | / second |
| Time maintained above | Temperature (TL) | 217 | |
| Time (tL) | 60 -150 | seconds | |
| Peak Temperature (Tp) | Temperature | 260 | |
| Time within 5 of actual peak Temperature (tp) | 2 | 10 seconds | |
| Ramp-down Rate | Max | 6 | /second |
| Time 25 to Peak Temperature | Max | 8 | minutes |
| Allowed Re-flow times: 2 times. Remark: To avoid discoloration, use N2 Re-flow furnace. | |||
Packing Dimensions
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | Packing Quantity |
|---|---|---|---|---|---|
| Reel | 178 | 60 | 12 | 1.5 | 3000pcs/Reel |
Plastic Taping Dimensions (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1608065 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 0.80 | 4.00 | 2.00 | 4.00 | 0.23 |
| 160808 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina