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Mini Molded Chip Power Inductor MetalLions MTQH404020S2R2MBT with Low Leakage Flux and RoHS Compliance

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Price: Negotiable
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Delivery Time: Negotiable
Product Description

Product Overview

The MTQH4040 Series Mini Molded Chip Power Inductors are designed for high-performance applications requiring large current handling and low loss. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors are RoHS compliant. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.

Product Attributes

  • Series Name: MTQH4040 Series
  • Type: Mini Molding Chip type power inductor
  • Material: Metal material
  • Coating: Vinyl thermal spray
  • Magnetic Circuit: Closed magnetic circuit design
  • Compliance: RoHS compliant
  • Operating Temperature Range: -55125 (Including self temp. rise)
  • Coating Color: Black (B)

Technical Specifications

Series L (mm) G (mm) W (mm) T (mm) Part Number L0 (H) @ (0A) 1MHz Rdc (m) Typical Rdc (m) Max Irms (A) Typical Irms (A) Max Isat (A) Typical Isat (A) Max
MTQH404010S 4.10.2 1.20.2 4.10.2 1.00Max. MTQH404010S100MBT 10 220 280 2.5 2.0 2.2 2.0
MTQH404012S 4.10.2 1.20.2 4.10.2 2.00Max. MTQH404012S1R0MBT 1.0 21 25 6.3 5.5 11 10
MTQH404012S1R5MBT 1.5 29 34.5 6.0 5.0 8.0 7.0
MTQH404020S 4.10.2 1.20.2 4.10.2 3.00Max. MTQH404020S2R2MBT 2.2 30 36 6.5 6.0 9.5 8.5
MTQH404020S4R7MBT 4.7 47 58 5.0 4.0 6.3 5.5
MTQH404020S100MBT 10 113 135 3.7 3.0 4.9 4.0
MTQH404020S150MBT 15 210 250 2.3 1.7 3.5 3.0
MTQH404020S220MBT 22 275 330 1.8 1.3 2.9 2.3
MTQH404030S 4.10.2 1.20.2 4.10.2 MTQH404030SR68MBT 0.68 8.3 10 9.5 8.0 17 15
MTQH404030S1R5MBT 1.5 15 18 6.5 6.0 12.5 11
MTQH404030S4R7MBT 4.7 41 46 4.3 4.0 7.0 6.0
MTQH404030S6R8MBT 6.8 51 62 4.2 3.8 6.3 5.1

Test Remarks:

  • All test data is referenced to 25 ambient.
  • Test Condition: 1MHz, 1.0Vrms.
  • Irms: DC current (A) that will cause an approximate T of 40 .
  • Isat: DC current (A) that will cause L0 to drop approximately 30%.
  • Operating Temperature Range: -55 to +125.
  • The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions.
  • The rated current as listed is either the saturation current or the heating current depending on which value is lower.

Reliability Item Requirements:

Item Requirements Test Methods and Remarks
Insulation Resistance 100M 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability 90% or more of electrode area shall be coated by new solder. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat No visible mechanical damage. Inductance change: Within 10. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode Strong bond between the pad and the core, without come off PCB. Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds.
High temperature No case deformation or change in appearance. Inductance change: Within 10%. Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature No visible mechanical damage. Inductance change: Within 10%. Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock No visible mechanical damage. Inductance change: Within 10%. The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic Inductance change Pc-b,Pc-d: Within 20%. a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b c c P Lb L L c-d 100% c c P Ld L L
Static Humidity No visible mechanical damage. Inductance change: Within 10%. Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
No visible mechanical damage. Inductance change: Within 10%. Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

Soldering Condition (Recommendation):

Recommend Reflow Soldering Profile (solder: Sn96.5 / Ag3 / Cu0.5)

Profile Feature Lead (Pb)-Free solder
Preheat: Temperature Min (Tsmin) 150
Preheat: Temperature Max (Tsmax) 200
Preheat: Time (Tsmin to Tsmax) (ts) 60 -120 seconds
Average ramp-up rate: (Ts max to Tp) 3/ second max.
Time maintained above: Temperature (TL) 217
Time maintained above: Time (tL) 60-150 seconds
Peak Temperature (Tp) 260
Time within +/5 of actual peak Temperature (tp) 10 seconds
Ramp-down Rate 6/second max.
Time 25 to Peak Temperature 8 minutes max.
Allowed Re-flow times 2 times
Remark To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.

Packing Dimension of plastic taping:

Type A 0.5 B 0.5 C 0.5 D 1 All Reel Dimension (Unit: mm)
178 60 12 1.5
Series W 0.30 A0 0.05 B0 +0.1/-0 D +0.1/-0 D1 Min E 0.10 F 0.10 K0 0.05 P0 0.10 P2 0.10 P 0.10 T 0.05 Packing Quantity
404012 12.0 4.40 4.40 1.50 1.0 1.75 5.50 1.40 4.00 2.00 8.00 0.35 3000pcs/Reel
404020 12.0 4.50.1 4.50.1 1.5 1.5 1.75 5.5 2.40.1 4.00 2.00 8.00 0.30 3000pcs/Reel
404030 12.0 4.40 4.40 1.50 1.0 1.75 5.50 3.40 4.00 2.00 8.00 0.35 3000pcs/Reel

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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