RoHS Compliant Mini Molded Chip Power Inductor MetalLions MTQH303020B4R7MBT for VR AR and WiFi Modules
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MOQ:
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Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH3030 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a closed magnetic circuit design to minimize leakage flux and a vinyl thermal spray for improved surface compactness, these RoHS-compliant inductors are suitable for a wide range of electronic devices. Applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules. The operating temperature range is -55 to +125, including self-temperature rise.
Product Attributes
- Series Name: MTQH3030 Series
- Type: Mini Molding Chip type power inductor
- Material Code: B Type
- Coating Color: Black (B)
- Compliance: RoHS compliant
- Magnetic Circuit: Closed magnetic circuit design
- Surface Treatment: Vinyl thermal spray
Technical Specifications
Explanation of Part Number:
MTQH 3030 18 B 2R2 M B T
- 1: Series Name (Mini Molding Chip type power inductor)
- 2: Size Code (L*W*T)
- 3: Material Code (B Type)
- 4: Initial inductance value (e.g., 2R2 = 2.2uH)
- 5: Tolerance of Inductance (M: 20%)
- 6: Coating color (B=Black)
- 7: Packing (Tape Carrier Package)
Dimensions and Land Pattern
| Series | L [mm] | W [mm] | T [mm] | Land Pattern A [mm] | Land Pattern B [mm] | Land Pattern C [mm] |
|---|---|---|---|---|---|---|
| MTQH303012B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 1.2 Max. | 2.90 | 0.90 |
| MTQH303015B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 1.5 Max. | 2.90 | 0.90 |
| MTQH303018B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 1.8 Max. | 2.90 | 0.90 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 2.0 Max. | 2.90 | 0.90 |
Electrical Properties
| P/N | L0 (H) @ 1MHz (0A) | Rdc (m) | Irms (A) | Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH303012B100MBT | 10.0 | 192 | 220 | 2.3 | 1.9 | 2.3 | 2.0 |
| MTQH303015B220MBT | 22.0 | 580 | 700 | 1.2 | 1.0 | 1.6 | 1.2 |
| MTQH303018BR22MBT | 0.22 | 5.5 | 7.0 | 10.0 | 9.0 | 17 | 16 |
| MTQH303018B1R5MBT | 1.5 | 20 | 26 | 6.8 | 6.4 | 8.0 | 7.0 |
| MTQH303018B4R7MBT | 4.7 | 72 | 87 | 3.4 | 3.0 | 4.7 | 4.2 |
| MTQH303020BR33MBT | 0.33 | 7.5 | 9 | 10.0 | 9.0 | 17 | 15 |
| MTQH303020BR50MBT | 0.5 | 9.0 | 12 | 9.0 | 8.0 | 15 | 13 |
| MTQH303020BR68MBT | 0.68 | 13 | 16 | 8.5 | 7.8 | 13 | 11 |
| MTQH303020B1R0MBT | 1.0 | 14 | 20 | 6.5 | 6.0 | 8.0 | 7.3 |
| MTQH303020B1R5MBT | 1.5 | 19 | 25 | 6.3 | 5.8 | 7.0 | 6.5 |
| MTQH303020B2R2MBT | 2.2 | 37 | 45 | 4.7 | 4.3 | 6.0 | 5.5 |
| MTQH303020B3R3MBT | 3.3 | 52 | 63 | 4.5 | 4.0 | 5.9 | 5.4 |
| MTQH303020B4R7MBT | 4.7 | 60 | 73 | 4.2 | 3.8 | 4.8 | 4.0 |
| MTQH303020B6R8MBT | 6.8 | 107 | 135 | 3.2 | 3.0 | 4.5 | 3.8 |
| MTQH303020B100MBT | 10.0 | 135 | 160 | 2.5 | 2.2 | 3.8 | 3.3 |
Test Conditions and Remarks
- Ambient Temperature: 25
- Test Condition: 1MHz, 1.0Vrms
- Irms: DC current (A) that will cause an approximate T of 40.
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -55 to +125.
- Part temperature (ambient + temp rise) should not exceed 125 under worst-case operating conditions.
- Rated current is either saturation current or heating current, whichever is lower.
Reliability
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605) for (205)s Soldering in the base with 0.3mm solder. And then apply electrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 20%. | a+20 (30~45) b: -40 (30~45) c: +20 (30~45) d: +125 (30~45) e: +20 (30~45). P c-b = (Lb - Lc)/Lc * 100%. P c-d = (Ld - Lc)/Lc * 100%. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| (Humidity & Temperature) | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
| Profile Feature | Lead (Pb)-Free solder |
|---|---|
| Preheat: Temperature Min (Tsmin) | 150 |
| Preheat: Temperature Max (Tsmax) | 200 |
| Preheat: Time (Tsmin to Tsmax) (ts) | 60 -120 seconds |
| Average ramp-up rate: (Ts max to Tp) | 3/ second max. |
| Time maintained above: Temperature (TL) | 217 |
| Time maintained above: Time (tL) | 60-150 seconds |
| Peak Temperature (Tp) | 260 |
| Time within +5 of actual peak Temperature (tp) | 10 seconds |
| Ramp-down Rate | 6/second max. |
| Time 25 to Peak Temperature | 8 minutes max. |
| Allowed Re-flow times | 2 times |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension of Plastic Taping (Unit: mm)
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| Reel | 178 | 60 | 12 | 1.5 |
Packing Quantity
3000pcs/Reel
Taping Dimensions (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 303012 | 8.00 | 3.35 | 3.35 | 1.50 | 1.0 | 1.75 | 3.50 | 1.35 | 4.00 | 2.00 | 4.00 | 0.23 |
| 303015 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 1.70 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303018 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 2.00 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303020 | 12.0 | 3.40 | 3.40 | 1.50 | 1.0 | 1.75 | 5.50 | 2.20 | 4.00 | 2.00 | 8.00 | 0.35 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina