Mini Molded Chip Power Inductor MetalLions MTQH303020BR33MBT with Black Coating and RoHS Compliance
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The MTQH3030 Series Mini Molded Chip Power Inductors are designed for high current and low loss applications, featuring a closed magnetic circuit design that minimizes leakage flux. These RoHS-compliant inductors are suitable for a wide operating temperature range of -55 to +125. Key applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Series Name: MTQH3030 Series
- Type: Mini Molding Chip type power inductor
- Material Code: B Type
- Coating Color: Black (B)
- Compliance: RoHS compliant
- Magnetic Circuit: Closed magnetic circuit design
- Construction: Metal material for large current and low loss, Vinyl thermal spray for better surface compactness
Technical Specifications
Dimensions and Land Pattern
| Series | L [mm] | W [mm] | T [mm] | Land Pattern A [mm] | Land Pattern B [mm] | Land Pattern C [mm] |
|---|---|---|---|---|---|---|
| MTQH303012B | 3.00.1 | 3.00.1 | 1.2Max. | 2.90 | 0.90 | 2.90 |
| MTQH303015B | 3.00.1 | 3.00.1 | 1.5Max. | 2.90 | 0.90 | 2.90 |
| MTQH303018B | 3.00.1 | 3.00.1 | 1.8Max. | 2.90 | 0.90 | 2.90 |
| MTQH303020B | 3.00.1 | 3.00.1 | 2.0Max. | 2.90 | 0.90 | 2.90 |
Electrical Properties
| Part Number | Inductance L0 (H) @ 1MHz (0A) | Rdc (m) | Heat Rating Current Irms (A) | Saturation Current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH303012B100MBT | 10.0 | 192 | 220 | 2.3 | 2.0 | 2.3 | 2.0 |
| MTQH303015B220MBT | 22.0 | 580 | 700 | 1.2 | 1.0 | 1.6 | 1.2 |
| MTQH303018BR22MBT | 0.22 | 5.5 | 7.0 | 10.0 | 9.0 | 17 | 16 |
| MTQH303018B1R5MBT | 1.5 | 20 | 26 | 6.8 | 6.4 | 8.0 | 7.0 |
| MTQH303018B4R7MBT | 4.7 | 72 | 87 | 3.4 | 3.0 | 4.7 | 4.2 |
| MTQH303020BR33MBT | 0.33 | 7.5 | 9 | 10.0 | 9.0 | 17 | 15 |
| MTQH303020BR50MBT | 0.5 | 9.0 | 12 | 9.0 | 8.0 | 15 | 13 |
| MTQH303020BR68MBT | 0.68 | 13 | 16 | 8.5 | 7.8 | 13 | 11 |
| MTQH303020B1R0MBT | 1.0 | 14 | 20 | 6.5 | 6.0 | 8.0 | 7.3 |
| MTQH303020B1R5MBT | 1.5 | 19 | 25 | 6.3 | 5.8 | 7.0 | 6.5 |
| MTQH303020B2R2MBT | 2.2 | 37 | 45 | 4.7 | 4.3 | 6.0 | 5.5 |
| MTQH303020B3R3MBT | 3.3 | 52 | 63 | 4.5 | 4.0 | 5.9 | 5.4 |
| MTQH303020B4R7MBT | 4.7 | 60 | 73 | 4.2 | 3.8 | 4.8 | 4.0 |
| MTQH303020B6R8MBT | 6.8 | 107 | 135 | 3.2 | 3.0 | 4.5 | 3.8 |
| MTQH303020B100MBT | 10.0 | 135 | 160 | 2.5 | 2.2 | 3.8 | 3.3 |
Operating Conditions and Notes
| Parameter | Value | Remarks |
|---|---|---|
| Operate Temperature Range | -55125 | Including self temperature rise |
| Ambient Temperature for Testing | 25 | All test data referenced |
| Test Condition | 1MHz, 1.0Vrms | |
| Irms Definition | DC current (A) | Causes approx. T of 40 |
| Isat Definition | DC current (A) | Causes L0 to drop approx. 30% |
| Maximum Part Temperature | 125 | Ambient + temp rise under worst-case conditions. Verification in end application is required. |
| Rated Current | Lower of saturation current or heating current |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and body (60s) |
| Solderability | 90% electrode area coated | Dip pads in flux, Sn/Ag3.0/Cu0.5 solder, 2455, (51)s |
| Resistance to Soldering Heat | No visible mechanical damage; Inductance change: 10% | Dip pads in flux, Sn/Ag3.0/Cu0.5 solder, 2605, 101s |
| Adhesion of teral electrode | Strong bond, no come off | (2605) for (205)s, 0.3mm solder, 10N for (101)s |
| High temperature | No deformation/appearance change; Inductance change: 10% | 1252, 1000 hours |
| Low temperature | No visible mechanical damage; Inductance change: 10% | -402, 1000 hours |
| Thermal shock | No visible mechanical damage; Inductance change: 10% | (-553) and (1253) for (303)s, 32 cycles |
| Temperature characteristic | Inductance change Pc-b, Pc-d: 20% | Test points: +20, -40, +125 |
| Static Humidity | No visible mechanical damage; Inductance change: 10% | (953)%RH at (602) for 1000h |
| Storage Test | No visible mechanical damage; Inductance change: 10% | (852) for 1000 hours with Irms applied |
Soldering Conditions (Recommendation)
| Profile Feature | Value | Unit |
|---|---|---|
| Solder Type | Sn96.5 / Ag3 / Cu0.5 | |
| Preheat Tsmin | 150 | |
| Preheat Tsmax | 200 | |
| Time (Tsmin to Tsmax) (ts) | 60 - 120 | seconds |
| Average ramp-up rate (Ts max to Tp) | 3 | / second max. |
| Time maintained above TL (217) | 60 - 150 | seconds |
| Peak Temperature (Tp) | 260 | |
| Time within 5 of actual peak (tp) | 2 | seconds |
| Ramp-down Rate | 6 | /second max. |
| Time 25 to Peak Temperature | 8 | minutes max. |
| Allowed Re-flow times | 2 | times |
| Remark | Use N2 Re-flow furnace to avoid discoloration phenomena. | |
Packing Dimensions
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | Reel Dimension | Quantity/Reel |
|---|---|---|---|---|---|---|
| [mm] | [mm] | [mm] | [mm] | [mm] | [pcs] | |
| Plastic Taping | 178 | 60 | 12 | 1.5 | 178*60*12 | 3000 |
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | [mm] | |
| 303012 | 8.00 | 3.35 | 3.45 | 1.50 | 1.0 | 1.75 | 3.50 | 1.35 | 4.00 | 2.00 | 4.00 | 0.23 |
| 303015 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 1.70 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303018 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 2.00 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303020 | 12.0 | 3.40 | 3.40 | 1.50 | 1.0 | 1.75 | 5.50 | 2.20 | 4.00 | 2.00 | 8.00 | 0.35 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina