Surface Mount Wire Wound Chip Ferrite Inductors MetalLions MLW1608RD-2R2MT RoHS Compliant for Electronic Devices

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Product Description

Product Overview

The MLW1608RD Series Wire Wound Chip Ferrite Inductors are designed for surface mounting, offering large inductance values due to their ferrite material construction. These compact inductors are RoHS compliant and suitable for operation within a temperature range of -40 to +85 (including self-temperature rise). They are ideal for applications in mobile phones, other electronic devices, Bluetooth modules, and TWS earphones.

Product Attributes

Product Series: MLW1608RD
Type: Wire Wound Chip Ferrite Inductors
Material: Ferrite
Compliance: RoHS compliant
Brand: Metal-Lions (implied by website URL)

Technical Specifications

Explanation of Part Number: MLW 1608 RD - 1R0 M T 6

1: Product Series: Wire Wound Chip Ceramic Inductors (Note: Text also states Ferrite material in other sections)
2: Dimensions: 1608
3: Material Code: RD Type
4: Nominal Inductance: e.g., 1R0 = 1.0uH
5: Inductance Tolerance: e.g., M = 20%
6: Packing: Tape & Reel

Dimensions: [mm]

Parameter	Value (MAX)	Typ
L	1.80	-
W	1.60	-
T	0.80	-
E	-	0.64
F	-	1.02
D	-	1.25

Electrical Characteristics List

Part Number	Inductance (H) Typ	SRF (MHz) Typ	Rdc () Typ	Irms (mA) Typ	Isat (mA) Typ	Q Typ
MLW1608RD-1R0MT	1.0	350.00	0.14	350.00	800.00	25.00
MLW1608RD-2R2MT	2.2	300.00	0.30	270.00	580.00	25.00
MLW1608RD-4R7MT	4.7	57.00	0.46	500.00	450.00	25.00
MLW1608RD-6R8MT	6.8	9@1MHZ	0.67	500.00	410.00	25.00
MLW1608RD-100MT	10.0	9@1MHZ	1.00	380.00	270.00	25.00
MLW1608RD-150MT	15.0	9@1MHZ	1.42	270.00	180.00	20.00
MLW1608RD-220MT	22.0	8@1MHZ	2.46	220.00	-	20.00

Soldering Conditions

Re-flow Soldering (Lead Free)

Preheat circuit and products to 150
260 tip temperature (max)
Reflow times: no more than 2 times
Solder paste thickness: best 0.08mm, max 0.1mm

Stage	Temperature (C)	Time (sec)
Pre-heating	150	60~180s
Soldering	260 (TP)	10s max.
Cooling	-	480s max.

Hand Soldering

Use a 20 watt soldering iron with tip diameter of 1.0mm
Limit soldering time to 3 sec.

Stage	Temperature (C)	Time (sec)
Pre-heating	150	60~150s
Soldering	350	3s (max.)
Cooling	-	10s (max.)

Packaging

Parameter	Typ
A	1.15
B	1.83
T	0.95
E	2
W	8.4
t	2
A	178
B	60
C	13
D	21

Packaging Quantity: 4000Pcs/

Reliability Test

Test Item	Specification	Test Condition
Rating current	According to product specifications	Current sources:33010D
Inductance	According to product specifications	Test Frequency:0.252~250MHz; Test Equipment:HP4291AHP4286AHP4287A HP4284A; Test Fixture:16193A or 16334A
Q	According to product specifications	Test Frequency:0.252~1500MHz; Test Equipment:HP4291AHP4286AHP4287A; Test Fixture:16193A or 16334A
RDC	According to product specifications	Test Equipment:HP4263B
SRF	According to product specifications	Test Equipment:HP4291A; Test Fixture:16193A
Solderability	Metalized area must have more than 90% of solder coverage	Soldering Temp:2305; Dipping time:51S
Resistance to soldering heat	No mechanical damage; Metalized area must have more than 75% of solder coverage; Inductance change, less than 5%; Q change less than 10%	Soldering Temp:2605; Dipping time:101S
Thermal Shock	No mechanical damage; Inductance change less than 5%; Q change less than 10%	Cycle: -40 (30Min) to 85 (30Min); Cycle Times: 10
High Temperature Storage	No mechanical damage; Inductance change less than 5%; Q change less than 10%	Test Temperature:1252 (Ceramic core), 852 (Ferrite core); Test Time:962Hours
Low Temperature Storage	No mechanical damage; Inductance change less than 5%; Q change less than 10%	Test Temperature:-402; Test Time:962Hours
Moisture Resistance	No mechanical damage; Inductance change less than 5%; Q change less than 10%	Test Temperature:502; Test Time:100Hours; Relative humidity:90~95%
Vibration	No mechanical damage; Inductance change less than 5%; Q change less than 10%	Amplitude:1.5mm (X, Y, Z each direction for 1Hour and 45min); Frequency range:10~55~10Hz (min)
Component Adhesion	No mechanical damage; No peel off or broken; Keep continuity of FSnding	Force:2Kg; Test Time:51sec
Resistance to bend	No mechanical damage	Camber:20mm; Test Board:Glass-Epoxy board; Thickness:8mm
Life	No mechanical damage; Inductance change less than 5%; Q change less than 10%	Test Temperature:852; Test Time:1000Hours; FSth rating current