Mini Molded Chip Power Inductors MetalLions MTQH252010SR24MBT for High Current Low Loss Applications
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Product Description
MTQH2520 Series Mini Molded Chip Power Inductors
Product Overview
The MTQH2520 Series Mini Molded Chip Power Inductors are designed for high-current applications with low loss. Featuring a closed magnetic circuit design to minimize leakage flux and a vinyl thermal spray for enhanced surface compactness, these inductors offer reliable performance. They are RoHS compliant and suitable for a wide operating temperature range of -55 to +125 (including self-temperature rise). Applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (inferred from website URLs)
- Series Name: MTQH2520 Series
- Type: Mini Molding Chip type power inductor
- Material Code: S Type
- Coating Color: Black (B)
- Certifications: RoHS compliant
Technical Specifications
Dimensions and Land Pattern
Dimensions: [mm]
Land Pattern: [mm]
Series Overview
| Series | L (mm) | G (mm) | W (mm) | T (mm) | A (mm) | B (mm) | C (mm) | Internal Code |
|---|---|---|---|---|---|---|---|---|
| MTQH252008S | 2.50.2 | 0.70.2 | 2.00.2 | 0.80Max. | 2.60 | 0.70 | 2.10 | A |
| MTQH252010S | 2.50.2 | 0.70.2 | 2.00.2 | 1.00Max. | 2.60 | 0.70 | 2.10 | A, B |
| MTQH252075S | 2.50.2 | 0.70.2 | 2.00.2 | 0.75Max. | 2.60 | 0.70 | 2.10 | A |
| MTQH252012S | 2.50.2 | 0.70.2 | 2.00.2 | 1.20Max. | 2.60 | 0.70 | 2.10 | A |
Electrical Properties
MTQH252008S (2.5*2.0*0.8mm)
| P/N | L0(H) @ (0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252008SR47MBT | 0.47 | 22 | 27 | 6.5 | 6.0 | 6.0 | 5.3 |
| MTQH252008S1R0MBT | 1.0 | 34 | 40 | 4.3 | 4.0 | 4.5 | 4.0 |
| MTQH252008S1R5MBT | 1.5 | 64 | 75 | 3.4 | 3.0 | 3.5 | 3.0 |
| MTQH252008S2R2MBT | 2.2 | 69 | 77 | 3.0 | 2.6 | 3.0 | 2.6 |
| MTQH252008S3R3MBT | 3.3 | 150 | 180 | 2.5 | 2.1 | 2.5 | 2.1 |
| MTQH252008S100MBT | 10 | 500 | 600 | 1.4 | 1.2 | 1.1 | 0.9 |
MTQH252075S (2.5*2.0*0.75m)
| P/N | L0(H) @ (0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252075S2R2MBT | 2.2 | 78 | 90 | 2.3 | 2.0 | 2.6 | 2.4 |
| MTQH252075S100MBT | 10.0 | 487 | 530 | 1.1 | 0.9 | 1.1 | 0.9 |
MTQH252010S (2.5*2.0*1.0m)
| P/N | L0(H) @(0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252010SR22MBT | 0.22 | 12 | 17 | 6.8 | 6.5 | 8.6 | 7.9 |
| MTQH252010SR24MBT | 0.24 | 12 | 17.5 | 6.7 | 6.4 | 8.5 | 7.8 |
| MTQH252010SR33MBT | 0.33 | 13 | 19 | 6.5 | 6.2 | 7.6 | 7.2 |
| MTQH252010SR47MBT | 0.47 | 15 | 22 | 6.1 | 5.6 | 6.9 | 6.5 |
| MTQH252010SR47MBTA | 0.47 | 13 | 15 | 6.5 | 6.0 | 6.6 | 6.0 |
| MTQH252010SR68MBT | 0.68 | 23 | 27 | 5.6 | 5.0 | 5.9 | 5.5 |
| MTQH252010S1R0MBT | 1.0 | 25 | 30 | 4.5 | 4.1 | 5.3 | 4.8 |
| MTQH252010S1R5MBT | 1.5 | 45 | 55 | 3.4 | 3.0 | 4.3 | 3.9 |
| MTQH252010S2R2MBT | 2.2 | 62 | 70 | 2.4 | 2.1 | 3.3 | 3.0 |
| MTQH252010S2R2MBTA | 2.2 | 62 | 70 | 4.0 | 3.2 | 3.4 | 3.1 |
| MTQH252010S3R3MBT | 3.3 | 86 | 100 | 2.5 | 2.1 | 2.8 | 2.5 |
| MTQH252010S4R7MBT | 4.7 | 160 | 180 | 2.0 | 1.6 | 2.6 | 2.0 |
| MTQH252010S4R7MBTA | 4.7 | 145 | 160 | 2.0 | 1.6 | 2.6 | 2.0 |
| MTQH252010S6R8MBT | 6.8 | 270 | 320 | 1.6 | 1.4 | 2.4 | 1.9 |
| MTQH252010S100MBT | 10.0 | 500 | 560 | 1.05 | 0.95 | 1.55 | 1.4 |
| MTQH252010S220MBT | 22.0 | 1100 | 1300 | 0.85 | 0.6 | 1.1 | 0.9 |
MTQH252012S (2.5*2.0*1.2mm)
| P/N | L0(H) @(0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252012SR10MBT | 0.1 | 6 | 10 | 12 | 10.5 | 13.5 | 12.5 |
| MTQH252012SR15MBT | 0.15 | 7 | 11 | 11.5 | 10 | 13.0 | 12.0 |
| MTQH252012SR22MBT | 0.22 | 9 | 14 | 8.2 | 7.6 | 9.6 | 9.0 |
| MTQH252012SR24MBT | 0.24 | 10 | 15 | 8.0 | 7.5 | 9.3 | 8.8 |
| MTQH252012SR33MBT | 0.33 | 11 | 17 | 6.8 | 6.4 | 8.3 | 7.8 |
| MTQH252012SR47MBT | 0.47 | 13 | 19 | 6.5 | 6.0 | 7.5 | 7.0 |
| MTQH252012SR47MBTA | 0.47 | 11 | 13 | 8.0 | 7.5 | 8.5 | 8.0 |
| MTQH252012SR68MBT | 0.68 | 17 | 23 | 6.3 | 5.5 | 6.5 | 6.0 |
| MTQH252012SR68MBTA | 0.68 | 15 | 18 | 7.5 | 7.0 | 6.7 | 6.0 |
| MTQH252012SR82MBT | 0.82 | 19 | 24 | 5.8 | 5.3 | 6.5 | 5.8 |
| MTQH252012S1R0MBT | 1.0 | 35 | 42 | 4.0 | 3.6 | 5.6 | 5.0 |
| MTQH252012S1R0MBTA | 1.0 | 16 | 22 | 5.2 | 4.5 | 6.5 | 6.0 |
| MTQH252012S1R5MBT | 1.5 | 44 | 50 | 3.7 | 3.2 | 4.5 | 4.1 |
| MTQH252012S1R5MBTA | 1.5 | 27 | 32 | 4.6 | 4.2 | 4.7 | 4.4 |
| MTQH252012S2R2MBT | 2.2 | 55 | 65 | 3.0 | 2.7 | 3.8 | 3.3 |
| MTQH252012S3R3MBT | 3.3 | 80 | 97 | 2.3 | 1.8 | 3.0 | 2.7 |
| MTQH252012S4R7MBT | 4.7 | 150 | 170 | 1.8 | 1.5 | 2.4 | 2.1 |
| MTQH252012S6R8MBT | 6.8 | 245 | 270 | 1.6 | 1.4 | 2.0 | 1.7 |
| MTQH252012S100MBT | 10.0 | 330 | 400 | 1.2 | 1.05 | 1.6 | 1.45 |
Test Remarks
- Note 1: All test data is referenced to 25 ambient.
- Note 2: Test Condition: 1MHz, 1.0Vrms.
- Note 3: Irms: DC current (A) that will cause an approximate T of 40.
- Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Note 5: Operating Temperature Range -55 to +125.
- Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
- Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b c c P Lb L L c-d 100% c c P Ld L L |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Storage Test | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
Recommend Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
| Profile Feature | Lead (Pb)-Free solder |
|---|---|
| Preheat: Temperature Min (Tsmin) | 150 |
| Preheat: Temperature Max (Tsmax) | 200 |
| Preheat: Time (Tsmin to Tsmax ) (ts) | 60 -120 seconds |
| Average ramp-up rate(Ts max to Tp) | 3/ second max. |
| Time maintained above : Temperature (TL) | 217 |
| Time maintained above : Time (tL) | 60-150 seconds |
| Peak Temperature (Tp) | 260 |
| Time within +5of actual peak Temperature (tp) | 10 seconds |
| Ramp-down Rate | 6/second max. |
| Time 25to Peak Temperature | 8 minutes max. |
| Allowed Re-flow times | 2 times |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension of Plastic Taping
Unit: mm
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| All | 178 | 60 | 12 | 1.5 |
Reel Dimension
Unit: mm
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 252010 | 8.00 | 2.40 | 2.80 | 1.50 | 1.0 | 1.75 | 3.50 | 1.20 | 4.00 | 2.00 | 4.00 | 0.23 |
| 252012 | 8.00 | 2.40 | 2.80 | 1.50 | 1.0 | 1.75 | 3.50 | 1.40 | 4.00 | 2.00 | 4.00 | 0.23 |
| 252008 | 8.00 | 2.40 | 2.80 | 1.50 | 1.0 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
Packing Quantity: 3000pcs/Reel
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina