Mini Molded Chip Power Inductors with Metal Material Construction MetalLions MTQH303020D100MBT Series
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH303020D Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors are RoHS compliant. They are suitable for a wide range of electronic devices including smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Series Name: Mini Molding Chip type power inductor
- Material Code: D Type
- Coating Color: Black (B), Gray (G)
- Packing: Tape Carrier Package
- Certifications: RoHS compliant
- Operating Temperature Range: -55 to +125 (Including self temp. rise)
Technical Specifications
Dimensions: [mm]
Land Pattern: [mm]
| Series | L (mm) | G/Typ (mm) | W (mm) | E (mm) | A/Typ (mm) | B/Typ (mm) | C/Typ (mm) |
|---|---|---|---|---|---|---|---|
| MTQH303020D | 3.00.1 | 1.0 | 3.00.1 | 1.000.2 | 2.00Max. | 3.00 | 0.90 |
Explanation of Part Number: MTQH 303020 D 2R2 M B T
- 1: Series Name
- 2: Size Code (L*W*T)
- 3: Material Code (D Type)
- 4: Initial inductance value (e.g., 2R2 = 2.2uH)
- 5: Tolerance of Inductance (M: 20%)
- 6: Coating color (B=Black, G=Gray)
- 7: Packing (Tape Carrier Package)
- 8: Internal Code (A)
Electrical Properties:
| P/N | L0(H) @ (0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) |
|---|---|---|---|---|
| Typical Max | Typical Max | Typical Max | ||
| MTQH303020DR10MT | 0.10 | 3.3 4.5 | 17.0 16.0 | 25.0 23.0 |
| MTQH303020DR15MT | 0.15 | 4.0 5.0 | 13.0 12.0 | 18.0 17.0 |
| MTQH303020DR22MT | 0.22 | 5.0 6.5 | 11.0 10.0 | 17.5 16 |
| MTQH303020DR33MT | 0.33 | 7.5 9.0 | 10.0 9.0 | 17 15 |
| MTQH303020DR36MT | 0.36 | 7.5 9.0 | 10.0 9.0 | 16.5 14.5 |
| MTQH303020DR47MT | 0.47 | 8.0 11 | 9.0 8.0 | 15 13.5 |
| MTQH303020DR50MT | 0.50 | 9.0 12 | 9.0 8.0 | 15 13 |
| MTQH303020DR50MTA | 0.50 | 7.0 8.3 | 12.5 11.5 | 13.5 12 |
| MTQH303020DR68MT | 0.68 | 13 16 | 8.5 7.8 | 13 11 |
| MTQH303020D1R0MT | 1.0 | 14 20 | 6.5 6.0 | 8.0 7.3 |
| MTQH303020D1R2MT | 1.2 | 16 21 | 7.0 6.5 | 7.5 7.0 |
| MTQH303020D1R5MT | 1.5 | 19 25 | 6.3 5.8 | 7.0 6.5 |
| MTQH303020D2R2MT | 2.2 | 37 45 | 4.7 4.3 | 6.0 5.5 |
| MTQH303020D3R3MT | 3.3 | 52 63 | 4.5 4.0 | 5.9 5.4 |
| MTQH303020D4R7MT | 4.7 | 60 73 | 4.2 3.8 | 4.8 4.0 |
| MTQH303020D6R8MT | 6.8 | 107 135 | 3.2 3.0 | 4.5 3.8 |
| MTQH303020D100MT | 10.0 | 135 160 | 2.5 2.2 | 3.8 3.3 |
| MTQH303020D150MT | 15.0 | 235 260 | 1.8 1.5 | 2.6 2.2 |
Test Remarks:
- Note 1: All test data is referenced to 25 ambient.
- Note 2: Test Condition: 1MHz, 1.0Vrms.
- Note 3: Irms: DC current (A) that will cause an approximate T of 40 .
- Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Note 5: Operating Temperature Range -55 to + 125.
- Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provision all affect the part temperature. Part temperature should be verified in the end application.
- Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability
| No. | Item | Requirements | Test Methods and Remarks | Reference | Sample Size |
|---|---|---|---|---|---|
| 1 | Solderability | (1) No case deformation or change in appearance. (2) Terminal area must have 95% min. Solder coverage. | Temperature: 245 5. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Sample immersion tin furnace 5 0.5s. | AEC-Q200 (J-STD 002) | 32 |
| 2 | Adhesion of teral electrode | (1) Strong bond between the pad and the core, without come off PCB. | Preconditioning245Reflow 3 times Inductors shall be subjected to (260+0/-5.) for (105)s Soldering in the base whit 0.3mm solder. Aplombelectrode way plus tax 12 N for (101) seconds. | AEC-Q200 (AEC-Q200-006) | 32 |
| 3 | Reflow test | (1) No physical damage. (2)L0/L010% | The peak temperature: 260+0/-5. Reflow:3times. Temperature curve is as below | AEC-Q200 (MIL-STD-202 Method 210) | 32 |
| 4 | High temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| 5 | Low temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion | JESD22-A119A | 77 |
| 6 | Thermal shock | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Repeat 500 cycle as follow : (-552 ,303minutes) (Room temperature, 5 minutes)(+1252 ,303minutes)(Room temperature, 5 minutes) Measurement at 244 hours after test conclusion | MIL-STD -202 Method 107 | 77 |
| 7 | Resistance to Soldering Heat | (1) No physical damage. (2)L0/L010% | Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. | AEC-Q200 MIL-STD- 202 Method 210 | 32 |
| 8 | Static Humidity | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times 1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion | AEC-Q200 (MIL-STD-202 Method 103) | 77 |
| 9 | Board Flex | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. | AEC-Q200 (AEC-Q200-005) | 30 |
| 10 | Vibration | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Frequency range : 10~2000Hz. Amplitude: 1.5mm or 20g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours in X,Y,Z direction, 12hours in total. | AEC-Q200 (MIL-STD-202 Method 204) | 32 |
| 11 | Mechanical Shock | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Peak acceleration:100G/S Duration of pulse:6ms 3times in each of 6(X, Y, Z) axes. | AEC-Q200 (MIL-STD-202 Method 213) | 32 |
| 12 | Loading at High Temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion | AEC-Q200 (MIL-STD-202 Method 108) | 77 |
Soldering Condition (Recommendation)
Recommend Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
| Profile Feature | Lead (Pb)-Free solder |
|---|---|
| Preheat: Temperature Min (Tsmin) | 150 |
| Preheat: Temperature Max (Tsmax) | 200 |
| Preheat: Time (Tsmin to Tsmax ) (ts) | 60 -120 seconds |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. |
| Time maintained above : Temperature (TL) | 217 |
| Time maintained above : Time (tL) | 60-150 seconds |
| Peak Temperature (Tp) | 260 |
| Time within + 5 0of actual peak Temperature (tp) | 2 10 seconds |
| Ramp-down Rate | 6/second max. |
| Time 25to Peak Temperature | 8 minutes max. |
| Allowed Re-flow times | 2 times |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing
Dimension of plastic taping: (Unit: mm)
| Series | W | A0 0.30 | B0 0.10 | D0 0.10 | D1 +0.1/-0 | E 0.20 | F 0.10 | K0 0.10 | P0 0.10 | P2 0.10 | P1 0.05 | T | Packing quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 303020 | 12.0 | 3.40 | 3.40 | 1.5 | 1.5 | 1.75 | 5.5 | 2.20 | 4.0 | 2.0 | 8.0 | 0.30 | 3K |
Dimension of Reel: (Unit: mm)
| Type | A 2.0 | B 2.0 | C 2.0 |
|---|---|---|---|
| All | 330 | 100 | 13.0 |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina