Power Inductor MetalLions MTQH404030S4R7MBT Mini Molded Chip Type Featuring Vinyl Thermal Spray Coating
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Delivery Time:
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Product Description
Product Overview
The MTQH4040 Series Mini Molded Chip Power Inductors are designed for high current and low loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors are RoHS compliant. They are suitable for a wide range of electronic devices including smartphones, tablets, notebooks, VR/AR equipment, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by URL)
- Series Name: MTQH4040 Series
- Type: Mini Molding Chip type power inductor
- Material: Metal material
- Coating: Vinyl thermal spray
- Magnetic Circuit: Closed magnetic circuit design
- Compliance: RoHS compliant
- Operating Temperature Range: -55 to +125 (Including self temp. rise)
- Coating Color: Black (B)
- Packing: Tape Carrier Package
Technical Specifications
Explanation of Part Number: MTQH 4040 [Size Code] S [Material Code] [Initial Inductance Value] [Tolerance] [Coating Color]
Dimensions and Land Pattern (mm)
| Series | L 0.2 | W 0.2 | T 0.2 | A 0.2 | B 0.2 | C | Max T | Land Pattern L | Land Pattern W | Land Pattern H |
|---|---|---|---|---|---|---|---|---|---|---|
| MTQH404010S | 4.1 | 4.1 | 1.2 | 4.1 | 1.2 | 4.1 | 1.00 | 3.90 | 1.30 | 3.90 |
| MTQH404012S | 4.1 | 4.1 | 1.2 | 4.1 | 1.2 | 4.1 | 2.00 | 3.90 | 1.30 | 3.90 |
| MTQH404020S | 4.1 | 4.1 | 1.2 | 4.1 | 1.2 | 4.1 | 3.00 | 3.90 | 1.30 | 3.90 |
| MTQH404030S | 4.1 | 4.1 | 1.2 | 4.1 | 1.2 | 4.1 | 3.00 | 3.90 | 1.30 | 3.90 |
Electrical Properties
MTQH404010 (4.0*4.0*1.0mm)
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Heat Rating Current Irms (A) | Saturation Current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH404010S100MBT | 10 | 220 | 280 | 2.5 | 2.0 | 2.2 | 2.0 |
MTQH404012 (4.0*4.0*1.2mm)
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Heat Rating Current Irms (A) | Saturation Current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH404012S1R0MBT | 1.0 | 21 | 25 | 6.3 | 5.5 | 11 | 10 |
| MTQH404012S1R5MBT | 1.5 | 29 | 34.5 | 6.0 | 5.0 | 8.0 | 7.0 |
MTQH404020 (4.0*4.0*2.0mm)
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Heat Rating Current Irms (A) | Saturation Current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH404020S2R2MBT | 2.2 | 30 | 36 | 6.5 | 6.0 | 9.5 | 8.5 |
| MTQH404020S4R7MBT | 4.7 | 47 | 58 | 5.0 | 4.0 | 6.3 | 5.5 |
| MTQH404020S100MBT | 10 | 113 | 135 | 3.7 | 3.0 | 4.9 | 4.0 |
| MTQH404020S150MBT | 15 | 210 | 250 | 2.3 | 1.7 | 3.5 | 3.0 |
| MTQH404020S220MBT | 22 | 275 | 330 | 1.8 | 1.3 | 2.9 | 2.3 |
MTQH404030 (4.0*4.0*3.0mm)
| P/N | L0 (H) @ (0A) 1MHz | Rdc (m) | Heat Rating Current Irms (A) | Saturation Current Isat (A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH404030SR68MBT | 0.68 | 8.3 | 10 | 9.5 | 8.0 | 17 | 15 |
| MTQH404030S1R5MBT | 1.5 | 15 | 18 | 6.5 | 6.0 | 12.5 | 11 |
| MTQH404030S4R7MBT | 4.7 | 41 | 46 | 4.3 | 4.0 | 7.0 | 6.0 |
| MTQH404030S6R8MBT | 6.8 | 51 | 62 | 4.2 | 3.8 | 6.3 | 5.1 |
Test Remarks
- Note 1: All test data is referenced to 25 ambient.
- Note 2: Test Condition: 1MHz, 1.0Vrms.
- Note 3: Irms: DC current (A) that will cause an approximate T of 40 .
- Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Note 5: Operating Temperature Range -55 to +125.
- Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions. Part temperature should be verified in the end application.
- Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Item Requirements
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% P = (Lb-Lc)/Lc * 100%; 100% P = (Ld-Lc)/Lc * 100% |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (953)%RH at (602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| High Temp. Load Test | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be stored at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
| Profile Feature | |||||||
|---|---|---|---|---|---|---|---|
| Preheat: Temperature (Tsmin) | 150 | Temperature Max (Tsmax) | 200 | Time (Tsmin to Tsmax) (ts) | 60 -120 seconds | Average ramp-up rate: (Ts max to Tp) | 3/ second max. |
| Time maintained above: Temperature (TL) | 217 | Time (tL) | 60-150 seconds | Peak Temperature (Tp) | 260 | Time within +/5 of actual peak Temperature (tp) | 2-10 seconds |
| Ramp-down Rate | 6/second max. | Time 25 to Peak Temperature | 8 minutes max. | Allowed Re-flow times | 2 times | Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension of Plastic Taping (mm)
| Dimension | A 0.5 | B 0.5 | C 0.5 | D 1 | All | Reel Diameter | Reel Width | Reel Hole | Reel Inner Diameter |
|---|---|---|---|---|---|---|---|---|---|
| Value | 178 | 60 | 12 | 1.5 |
Packing Quantity
- 3000pcs/Reel
Dimension of Reel (mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 404012 | 12.0 | 4.40 | 4.40 | 1.50 | 1.0 | 1.75 | 5.50 | 1.40 | 4.00 | 2.00 | 8.00 | 0.35 |
| 404020 | 12.0 | 4.50.1 | 4.50.1 | 1.5 | 1.5 | 1.75 | 5.5 | 2.40.1 | 4.00 | 2.00 | 8.00 | 0.30 |
| 404030 | 12.0 | 4.40 | 4.40 | 1.50 | 1.0 | 1.75 | 5.50 | 3.40 | 4.00 | 2.00 | 8.00 | 0.35 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina