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Thermally Stable MetalLions MTQH322512S3R3MBT Mini Molded Chip Power Inductors for Temperature Range

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Product Description

MTQH3225 Series Mini Molded Chip Power Inductors

Product Overview
The MTQH3225 Series Mini Molded Chip Power Inductors are designed for high-current applications with low loss, featuring a metal material construction and a vinyl thermal spray for enhanced surface compactness. The closed magnetic circuit design effectively minimizes leakage flux. These RoHS-compliant inductors are suitable for a wide range of electronic devices, including smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules. They offer reliable performance within an operating temperature range of -55 to +125 (including self-temperature rise).

Product Attributes

  • Series Name: MTQH3225 Series
  • Type: Mini Molding Chip type power inductor
  • Material Code: S Type
  • Coating Color: B=Black
  • Certification: RoHS compliant

Technical Specifications

Dimensions and Land Pattern

Dimensions: [mm]
Land Pattern: [mm]

Series and Dimensions

Series L (mm) G (mm) W (mm) T (mm) A (Max.) B C
MTQH322512S 3.2 0.2 0.9 0.2 2.5 0.2 1.20 Max. 1.20 3.25 0.90
MTQH322510S 3.2 0.2 0.9 0.2 2.5 0.2 1.00 Max. 1.00 3.25 0.90
MTQH322520S 3.2 0.2 0.9 0.2 2.5 0.2 2.00 Max. 2.00 3.25 0.90

Electrical Properties - MTQH322510S (3.2*2.5*1.0mm)

P/N L0 (H) @ (0A) 1MHz Rdc (m) Heat rating current Irms (A) Saturation current Isat (A)
Typical Max Typical Max Typical Max
MTQH322510SR33MBT 0.33 11 15 8.3 7.8 8.3 7.8
MTQH322510SR47MBT 0.47 17 22 6.4 5.9 8.3 7.6
MTQH322510SR68MBT 0.68 22 28 6.2 5.7 7.5 7.0
MTQH322510S1R0MBT 1.0 25 30 5.4 4.9 6.0 5.3
MTQH322510S1R5MBT 1.5 34 42 4.0 3.6 5.0 4.4
MTQH322510S2R2MBT 2.2 55 66 3.7 3.4 4.0 3.5
MTQH322510S3R3MBT 3.3 105 120 2.7 2.3 3.7 3.3
MTQH322510S4R7MBT 4.7 125 140 2.3 1.9 2.8 2.5
MTQH322510S6R8MBT 6.8 290 320 1.9 1.6 2.4 2.0
MTQH322510S100MBT 10.0 325 365 2.2 1.8 2.2 1.8

Electrical Properties - MTQH322512S (3.2*2.5*1.2mm)

P/N L0 (H) @ (0A) 1MHz Rdc (m) Heat rating current Irms (A) Saturation current Isat (A)
Typical Max Typical Max Typical Max
MTQH322512SR10MBT 0.10 5.2 7.0 12.0 11.0 18.0 16.5
MTQH322512SR22MBT 0.22 6.6 10 9.2 8.7 11.5 11.0
MTQH322512SR24MBT 0.24 7.0 12 9.0 8.5 11 10.5
MTQH322512SR33MBT 0.33 9.0 14 8.4 8.1 10 9.5
MTQH322512SR47MBT 0.47 14 19 7.5 7.2 8.6 8.2
MTQH322512SR47MBTA 0.47 11 14 7.5 7.2 8.6 8.2
MTQH322512SR68MBT 0.68 18 23 7.3 6.8 8.1 7.7
MTQH322512SR68MBTA 0.68 12 15 7.0 6.5 8.0 7.5
MTQH322512S1R0MBT 1.0 26 30 5.3 4.8 6.6 5.8
MTQH322512S1R0MBTA 1.0 18 21 5.5 5.0 7.7 7.0
MTQH322512S1R5MBT 1.5 37 44 4.7 4.3 5.1 4.7
MTQH322512S2R2MBT 2.2 58 70 3.6 3.0 4.6 4.2
MTQH322512S2R2MBTA 2.2 42 50 3.8 3.5 5.0 4.5
MTQH322512S3R3MBT 3.3 75 95 2.9 2.5 3.7 3.2
MTQH322512S4R7MBT 4.7 115 135 2.3 2.0 2.9 2.6
MTQH322512S6R8MBT 6.8 177 210 2.1 1.9 2.8 2.4
MTQH322512S100MBT 10.0 210 230 2.2 1.8 2.3 1.9

Electrical Properties - MTQH322520S (3.2*2.5*2.0mm)

P/N L0 (H) @ (0A) 1MHz Rdc (m) Heat rating current Irms (A) Saturation current Isat (A)
Typical Max Typical Max Typical Max
MTQH322520SR33MBT 0.33 7.5 9 9.5 9 15.5 14
MTQH322520SR47MBT 0.47 9 10.5 9.5 8.5 15 13
MTQH322520SR68MBT 0.68 12.5 14.5 9.0 8.0 13 11
MTQH322520S1R0MBT 1.0 15 17.5 8.2 7.5 9.0 8.3
MTQH322520S2R2MBT 2.2 36 43 5.4 4.8 6.5 5.5
MTQH322520S3R3MBT 3.3 55 60 4.5 4.0 4.5 3.5
MTQH322520S4R7MBT 4.7 81 94 3.5 3.0 4.0 3.0

Test Remarks

  • Note 1: All test data is referenced to 25 ambient.
  • Note 2: Test Condition: 1MHz, 1.0Vrms.
  • Note 3: Irms: DC current (A) that will cause an approximate T of 40.
  • Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
  • Note 5: Operating Temperature Range -55 to +125.
  • Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions. Part temperature should be verified in the end application.
  • Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.

Reliability

Item Requirements Test Methods and Remarks
Insulation Resistance 100M 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability 90% or more of electrode area shall be coated by new solder. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering Heat No visible mechanical damage. Inductance change: Within 10%. Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrode Strong bond between the pad and the core, without come off PCB. Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds.
High temperature No case deformation or change in appearance. Inductance change: Within 10% Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature No visible mechanical damage. Inductance change: Within 10% Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock No visible mechanical damage. Inductance change: Within 10% The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristic Inductance change Pc-b,Pc-d: Within 20% a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b P =Lb -L /L c-d P =Ld -L /L 100%
Static Humidity No visible mechanical damage. Inductance change: Within 10% Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
Load life test No visible mechanical damage. Inductance change: Within 10% Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

Soldering Condition (Recommendation)

Profile Feature Temperature Time
Preheat (Tsmin to Tsmax) 150 - 200 60 -120 seconds (ts)
Average ramp-up rate (Ts max to Tp) 3/ second max.
Time maintained above TL (217) 217 60-150 seconds (tL)
Peak Temperature (Tp) 260 2-10 seconds (tp)
Ramp-down Rate 6/second max.
Time 25 to Peak Temperature 8 minutes max.

Allowed Re-flow times: 2 times. Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.

Packing Dimension of Plastic Taping

Type A 0.5 B 0.5 C 0.5 D 1 All
178 60 12 1.5

Packing Quantity: 3000pcs/Reel

Dimension of Reel

Series W 0.30 A0 0.05 B0 +0.1/-0 D +0.1/-0 D1 Min E 0.10 F 0.10 K0 0.05 P0 0.10 P2 0.10 P 0.10 T 0.05
322510 8.00 2.90 3.50 1.50 1.0 1.75 3.50 1.20 4.00 2.00 4.00 0.23
322512 8.00 2.90 3.50 1.50 1.0 1.75 3.50 1.40 4.00 2.00 4.00 0.23
322520 8.00 2.90 3.50 1.50 1.0 1.75 3.50 2.20 4.00 2.00 4.00 0.28

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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