RoHS Compliant MetalLions MTQH303020B1R5MBT Mini Molded Chip Power Inductor for Portable Electronics
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The MTQH3030 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these RoHS-compliant inductors offer reliable performance across a wide operating temperature range of -55 to +125. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Series Name: MTQH3030 Series
- Type: Mini Molding Chip type power inductor
- Material Code: B Type
- Coating Color: Black (B)
- Compliance: RoHS compliant
- Brand: Metal-Lions (implied by URL)
Technical Specifications
| Series | L (mm) | G (mm) | W (mm) | T (Max.) | Part Number (P/N) | Inductance (L0 H) @ 1MHz (0A) | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current Irms (A) Typical | Heat Rating Current Irms (A) Max | Saturation Current Isat (A) Typical | Saturation Current Isat (A) Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTQH303012B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 1.2 | MTQH303012B100MBT | 10.0 | 192 | 220 | 2.3 | 2.0 | 2.3 | 2.0 |
| MTQH303015B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 1.5 | MTQH303015B220MBT | 22.0 | 580 | 700 | 1.2 | 1.0 | 1.6 | 1.2 |
| MTQH303018B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 1.8 | MTQH303018BR22MBT | 0.22 | 5.5 | 7.0 | 10.0 | 9.0 | 17 | 16 |
| MTQH303018B1R5MBT | 1.5 | 20 | 26 | 6.8 | 6.4 | 8.0 | 7.0 | |||||
| MTQH303018B4R7MBT | 4.7 | 72 | 87 | 3.4 | 3.0 | 4.7 | 4.2 | |||||
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | 2.0 | MTQH303020BR33MBT | 0.33 | 7.5 | 9 | 10.0 | 9.0 | 17 | 15 |
| MTQH303020BR50MBT | 0.5 | 9.0 | 12 | 9.0 | 8.0 | 15 | 13 | |||||
| MTQH303020BR68MBT | 0.68 | 13 | 16 | 8.5 | 7.8 | 13 | 11 | |||||
| MTQH303020B1R0MBT | 1.0 | 14 | 20 | 6.5 | 6.0 | 8.0 | 7.3 | |||||
| MTQH303020B1R5MBT | 1.5 | 19 | 25 | 6.3 | 5.8 | 7.0 | 6.5 | |||||
| MTQH303020B2R2MBT | 2.2 | 37 | 45 | 4.7 | 4.3 | 6.0 | 5.5 | |||||
| MTQH303020B3R3MBT | 3.3 | 52 | 63 | 4.5 | 4.0 | 5.9 | 5.4 | |||||
| MTQH303020B4R7MBT | 4.7 | 60 | 73 | 4.2 | 3.8 | 4.8 | 4.0 | |||||
| MTQH303020B6R8MBT | 6.8 | 107 | 135 | 3.2 | 3.0 | 4.5 | 3.8 | |||||
| MTQH303020B100MBT | 10.0 | 135 | 160 | 2.5 | 2.2 | 3.8 | 3.3 |
Test Conditions
- Ambient Temperature: 25
- Test Frequency: 1MHz, 1.0Vrms
- Irms: DC current causing approx. T of 40
- Isat: DC current causing L0 drop of approx. 30%
Operating Conditions
- Operating Temperature Range: -55 to +125 (including self temp. rise)
- Maximum Part Temperature: 125 (ambient + temp rise)
Reliability
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and body for 60 seconds. |
| Solderability | 90% or more of electrode area coated by new solder. | Dip pads in flux. Solder: Sn/Ag3.0/Cu0.5. Temp: 2455. Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder: Sn/Ag3.0/Cu0.5. Temp: 2605. Time: 101sec. |
| Adhesion of teral electrode | Strong bond between pad and core, without come off PCB. | Inductors subjected to (2605)for (205)s, then electrode way plus 10 N for (101) seconds. |
| High temperature | No case deformation or appearance change. Inductance change: Within 10%. | Temp: 1252. Time: 1000 hours. Measurement 244 hours after test. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temp: -402. Time: 1000 hours. Measurement 244 hours after test. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-553) and (1253) for (303)s, conversion time 2~3 mins. 32 cycles. Room temp for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 20%. | a+20 ; b: -40 ; c: +20 ; d: +125 . |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | (953)%RH at (602) for (10004) h. Room temp for 2 hours, within 48 hours of testing. |
| High temp storage | No visible mechanical damage. Inductance change: Within 10%. | Store at (852) for (10004) hours with Irms applied. Room temp for 2 hours, within 48 hours of testing. |
Recommended Soldering Condition (Reflow)
- Solder: Sn96.5 / Ag3 / Cu0.5
- Preheat: Tsmin 150, Tsmax 200, ts 60-120 seconds
- Ramp-up rate: 3/second max.
- Time maintained above TL (217): 60-150 seconds
- Peak Temperature (Tp): 260
- Time within +5 of Tp (tp): 2-10 seconds
- Ramp-down Rate: 6/second max.
- Time 25 to Peak Temperature: 8 minutes max.
- Re-flow times: 2 times
- Remark: Use N2 Re-flow furnace to avoid discoloration.
Packing Information
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 | Packing Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 303012 | 8.00 | 3.35 | 3.35 | 1.50 | 1.0 | 1.75 | 3.50 | 1.35 | 4.00 | 2.00 | 4.00 | 0.23 | 3000pcs/Reel |
| 303015 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 1.70 | 4.00 | 2.00 | 8.00 | 0.35 | 3000pcs/Reel |
| 303018 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 2.00 | 4.00 | 2.00 | 8.00 | 0.35 | 3000pcs/Reel |
| 303020 | 12.0 | 3.40 | 3.40 | 1.50 | 1.0 | 1.75 | 5.50 | 2.20 | 4.00 | 2.00 | 8.00 | 0.35 | 3000pcs/Reel |
Reel Dimensions
| Dimension | Value (mm) |
|---|---|
| A | 178 0.5 |
| B | 60 0.5 |
| C | 12 0.5 |
| D | 1.5 1 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina