Mini Molded Chip Power Inductor MetalLions MTQH160808S2R2MBT for WiFi Modules and Mobile Electronics
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Negotiable
MOQ:
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Delivery Time:
Negotiable
Product Description
Product Overview
The MTQH1608 Series Mini Molded Chip Power Inductors are designed for high-current applications requiring low loss. Featuring a metal material, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors are RoHS compliant. They are suitable for a wide operating temperature range of -55 to +125. Key applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (inferred from URL)
- Series: MTQH1608 Series
- Type: Mini Molded Chip Power Inductor
- Material Code: S, B Type
- Coating Color: B (Black)
- Certification: RoHS compliant
Technical Specifications
| Series | P/N | L (mm) | W (mm) | T (mm) | L0 (H) @ 1MHz (0A) | Rdc (m) Typical | Rdc (m) Max | Irms (A) Typical | Irms (A) Max | Isat (A) Typical | Isat (A) Max |
|---|---|---|---|---|---|---|---|---|---|---|---|
| MTQH160865 | MTQH160865BR22MBT | 1.6 0.1 | 0.5 0.2 | 0.8 0.1 | 0.22 | 35 | 43 | 3.8 | 3.5 | 4.7 | 4.3 |
| MTQH160865 | MTQH160865SR47MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.47 | 66 | 82 | 2.3 | 2.0 | 3.3 | 3.0 |
| MTQH160808 | MTQH160808SR22MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.22 | 33 | 40 | 3.4 | 3.0 | 5.5 | 5.0 |
| MTQH160808 | MTQH160808SR24MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.24 | 34 | 41 | 3.3 | 2.9 | 5.3 | 4.8 |
| MTQH160808 | MTQH160808SR24MBTA | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.24 | 22 | 26 | 3.9 | 3.5 | 4.9 | 4.4 |
| MTQH160808 | MTQH160808SR47MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.47 | 80 | 100 | 2.6 | 2.3 | 4.1 | 3.7 |
| MTQH160808 | MTQH160808SR47MBTA | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.47 | 38 | 45 | 3.8 | 3.4 | 4.0 | 3.5 |
| MTQH160808 | MTQH160808SR56MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.56 | 85 | 110 | 2.2 | 1.9 | 4.0 | 3.5 |
| MTQH160808 | MTQH160808SR68MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.68 | 110 | 130 | 2.1 | 1.9 | 3.3 | 3.0 |
| MTQH160808 | MTQH160808S1R0MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 1.0 | 180 | 200 | 2.1 | 1.8 | 3.0 | 2.6 |
| MTQH160808 | MTQH160808S1R0MBTA | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 1.0 | 105 | 115 | 2.1 | 1.8 | 2.3 | 2.1 |
| MTQH160808 | MTQH160808S2R2MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 2.2 | 220 | 260 | 1.4 | 1.2 | 1.5 | 1.3 |
| MTQH160808 | MTQH160808S4R7MBT | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 4.7 | 585 | 700 | 1.0 | 0.8 | 1.2 | 1.0 |
Operating Conditions
- Operating Temperature Range: -55 to +125 (Including self-temperature rise)
- Maximum Part Temperature: 125 (Ambient + temperature rise)
Reliability Test Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base with 0.3mm solder. And then apply electrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% P = (Lb - Lc)/Lc 100%; 100% P = (Ld - Lc)/Lc 100% |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Storage at High Temperature | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
Recommend Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
| Profile Feature | Lead (Pb)-Free solder |
|---|---|
| Preheat: Temperature Min (Tsmin) | 150 |
| Preheat: Temperature Max (Tsmax) | 200 |
| Preheat: Time (Tsmin to Tsmax) (ts) | 60 -120 seconds |
| Average ramp-up rate: (Ts max to Tp) | 3/ second max. |
| Time maintained above: Temperature (TL) | 217 |
| Time maintained above: Time (tL) | 60 -150 seconds |
| Peak Temperature (Tp) | 260 |
| Time within 5 of actual peak Temperature (tp) | 2 - 10 seconds |
| Ramp-down Rate | 6/second max. |
| Time 25 to Peak Temperature | 8 minutes max. |
| Allowed Re-flow times | 2 times |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension
Plastic Taping Dimension (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1608065 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 0.80 | 4.00 | 2.00 | 4.00 | 0.23 |
| 160808 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
Reel Dimension (Unit: mm)
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| All | 178 | 60 | 12 | 1.5 |
Packing Quantity: 3000pcs/Reel
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina