Common Mode Noise Filter Coil Microgate MGRC7060M701T-2-LF 7x6mm 5 Amp Rated Current Electronic Part
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
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Product Description
Product Overview
The MGRC series of Common Mode Choke Coils are designed for effective noise suppression. These coils are manufactured by Shenzhen Microgate Technology Co., Ltd. and are lead-free compliant. They are suitable for various electronic applications requiring reliable common mode noise filtering.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Series Name: MGRC
- Lead Free: Yes
- Origin: Shenzhen, China
Technical Specifications
| Part Number | Series | Dimensions (L x W) | Material Code | Impedance (min) @ 100MHz | DC Resistance (max) | Rated DC Current (max) | Insulation Voltage (min) | Cut-off Frequency (3dB Attenuation) | Packing Style | Number of Signal Lines |
|---|---|---|---|---|---|---|---|---|---|---|
| MGRC7060M701T-2-LF | MGRC | 7.0 x 6.0 mm | M701 | 700 | 0.24 | 5.0 A | 125 V | 500 MHz | T (Taping) | 2 |
Dimensions (mm)
| Dimension | Value |
|---|---|
| A | 7.0 0.5 |
| B | 6.0 0.5 |
| C | 3.5 0.3 |
| D | 3.5 (Typ) |
| E | 1.5 0.2 |
| F | 1.5 0.2 |
| G | 1.75 0.2 |
| A1 | 7.5 0.5 |
Reliable Performance
| NO. | Item | Specifications | Test Methods |
|---|---|---|---|
| 1 | Solder-Ability | It can be connected on the Recommendation soldering condition. Solder: Sn Temperature: 255 +5 / -0 Flux: rosin Duration: 3.50.5s | Recommendation soldering condition |
| 2 | Leaching Resistance | More than 75% of termination Should be covered with new solder. Solder: Sn Temperature: 270 +2 / -0 Flux: rosin Duration: 100.5s | |
| 3 | Terminal Strength | The terminal and body should be no damage | Solder a chip to test substrate, and then laterally apply a load 9.8N in the X, Y and Z directions |
| 4 | Bending Strength | No mechanical damage should be noticed | When the board curve to 2mm (0.079 inches) |
| 5 | Vibration | Frequency: 10 to 55Hz Amplitude: 1.52mm Direction and time :X, Y and Z directions for 2 hours each. | |
| 6 | Humidity resistance | a. Test condition Temp.: 852 Humidity: 90%~95% Test time: 50012 h | b. Measurement method: The component should be stabilized at normal condition for (242) hours before test. |
| 7 | High temperature resistance | a. Test condition Applied rated current. Temp.: 852 Test time: 50012 h | b. Measurement method: The component should be stabilized at normal condition for (242) hours before test. |
| 8 | Low temperature resistance | a. Test condition Temp.: -402 Test time: 50012 h | b. Measurement method: The component should be stabilized at normal condition for (242) hours before test. |
| 9 | Thermal shock (Temperature cycle) | 1. No mechanical damage shall be noticed 2. Impedance shall be within 20% of the initial value 3. Insulation resistance: >10 M DC | a. Test condition 1) Temp.: -40, time: 303min 2) Temp.: +85, time: 303min 100 cycles b. Measurement method: The component should be stabilized at normal condition for (242) hours before test. |
Recommended Soldering Conditions
Recommended Reflow Soldering Conditions (Lead-Free Assembly)
| Profile Feature | Value |
|---|---|
| Average Ramp-Up Rate (Tsmax to Tp) | 3 C/second max. |
| Preheat Temperature Min (Tsmin) | 150 C |
| Temperature Max (Tsmax) | 200 C |
| Time (tsmin to tsmax) | 60-180 seconds |
| Time maintained above: Temperature (TL) | 217 C |
| Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 C |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Note 1: All temperatures refer to topside of the package, measured on the package body surface.
Reworking with Soldering Iron
| Parameter | Condition |
|---|---|
| Pre-heating | 150, 1 minute |
| Tip temperature | 280 max |
| Soldering iron output | 30W max |
| End of soldering iron | 1mm max |
| Soldering time | 2 seconds max |
Packaging
Tape Dimensions
| Dimension | Value |
|---|---|
| A | 180 +0/-3 |
| B | 60 +1/-0 |
| C | 13.0 0.2 |
| D | 2.2 0.5 |
| W | 9.0 1.0 |
| t | 1.2 |
| R | 1.0 |
Reel Dimensions
| Parameter | Value |
|---|---|
| Reel material | PS (Polystyrene) |
Taping Strength
| Parameter | Value |
|---|---|
| Pulling strength of tapes (Carrier tape) | 10 N or more (1kgf or more) |
| Peeling strength of cover tape | 5 N or more (1kgf or more) |
Test condition: Temperature: 5~35 Humidity: 45~85%
Packing Quantity
| Reel Size | Type | Quantity |
|---|---|---|
| 180mm reel | T type | 1500 pcs/reel |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina