Noise Filter Microgate MGCC1210M900T-2-LF with Ferrite Base Material and Lead Free Terminal Electrodes
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Product Description
Product Overview
The MGCC series of Common Mode Filters from Shenzhen Microgate Technology Co., Ltd. are designed for effective noise suppression. These filters, particularly the MGCC1210M900T-2-LF model, are constructed with a ferrite base material and feature silver internal conductors and terminal electrodes, plated with nickel and tin. They are suitable for applications requiring reliable EMI/RFI filtering, operating within a wide temperature range of -40 to +85C.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, China
- Product Series: MGCC
- Material: Ferrite (Base Material), Silver (Internal Conductor, Terminal Electrode), Nickel (Terminal Electrode), Tin (Terminal Electrode)
- Environmental Compliance: Lead Free (LF)
- Polarity: No polarity
Technical Specifications
| Part Number | Series Name | Dimensions (LW) | Impedance at 100MHz | Differential Mode Impedance at 100MHz (max.) | Rated Voltage (V DC) | Rated Current (mA DC) | DC Resistance ( max.) | Operating Temperature Range | Storage Temperature Range |
|---|---|---|---|---|---|---|---|---|---|
| MGCC1210M900T-2-LF | MGCC | 1.251.00 mm [0504] | 90 (25%) | 15 | 5V | 160mA | 1.75 | -40 to +85C | -40 to +125C |
Dimensions (mm)
| Type | A | B | C | D | E | F |
|---|---|---|---|---|---|---|
| 1210 [0504] | 1.250.15 | 1.000.15 | 0.50.1 | 0.200.15 | 0.550.10 | 0.30.1 |
Reliability Testing Specifications
| Item | Specifications |
|---|---|
| Solder-Ability | More than 90% of termination should be covered with new solder. |
| Resistance to Soldering Heat | Impedance variation: within 30 %; Remaining terminal: 70 % min. |
| Bending Strength | No abnormality of appearance; Impedance variation: within 30 %. |
| Vibration | No abnormality of appearance; Impedance variation: within 30 %. |
| Heat Cycle | No abnormality of appearance; Impedance variation: within 30 %. |
| Load Life | No abnormality of appearance; Impedance variation: within 30 %. |
| Humidity | No abnormality of appearance; Impedance variation: within 30 %. |
| Humidity Load Life | No abnormality of appearance; Impedance variation: within 30 %. |
Recommended Soldering Conditions (Reflow Soldering)
| Parameter | SnAgCu lead-free (Sn-3Ag-0.5Cu) |
|---|---|
| Preheating Temp. | 150 to 170C |
| Preheating Time | 30 to 60 S |
| Rising temp. 1 | Preheating to 210C |
| Main heating | 250+10/-5C |
| Rising temp. 2 | 210 to 100C |
| Cooling | Gradual cooling |
| Time (above 200 C) | 20 to 40 S |
Packaging
- Packaging Style: Taping (T)
- Quantity per Reel: 5,000 PCS/Reel
- Cover Tape Peeling Strength: 0.3~1.3N (at 165~180 peel angle, 300mm/min 10% peel speed)
Storage Conditions
- Storage Period: Use within six months from MICROGATE inspection date. Check solderability if exceeded.
- Temperature: 40
- Humidity: 70% relative humidity
- Other: Store in a warehouse without rapid temperature/humidity changes, corrosive substances, heat shock, vibration, or direct sunlight. Keep in airtight packaging.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina