Electronic power management SMD power inductor microgate MPIT4018-150M-LF lead free component series
MPIT4018 Series SMD Power Inductor - Specification
This specification document details the MPIT4018 series of SMD power inductors manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. These inductors are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Product Series: MPIT4018 series
- Product Type: SMD power inductor
- Environmental: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
|---|---|---|---|---|---|---|---|
| MPIT4018-R24M-LF | 0.2420% | 0.016 | 0.012 | 6.50 | 7.00 | 4.60 | 5.00 |
| MPIT4018-R68M-LF | 0.6820% | 0.025 | 0.021 | 6.00 | 7.00 | 3.80 | 4.15 |
| MPIT4018-1R0M-LF | 1.020% | 0.030 | 0.025 | 4.55 | 4.85 | 3.40 | 3.80 |
| MPIT4018-1R2M-LF | 1.220% | 0.030 | 0.025 | 4.20 | 4.80 | 3.40 | 3.80 |
| MPIT4018-1R5M-LF | 1.520% | 0.036 | 0.030 | 3.90 | 4.25 | 2.95 | 3.20 |
| MPIT4018-2R2M-LF | 2.220% | 0.048 | 0.040 | 3.15 | 3.40 | 2.60 | 2.90 |
| MPIT4018-2R7M-LF | 2.720% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R3M-LF | 3.320% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R9M-LF | 3.920% | 0.078 | 0.065 | 2.60 | 2.80 | 2.00 | 2.20 |
| MPIT4018-4R7M-LF | 4.720% | 0.078 | 0.065 | 2.10 | 2.30 | 2.00 | 2.20 |
| MPIT4018-6R8M-LF | 6.820% | 0.108 | 0.090 | 1.70 | 1.85 | 1.70 | 1.90 |
| MPIT4018-100M-LF | 1020% | 0.168 | 0.140 | 1.40 | 1.55 | 1.20 | 1.30 |
| MPIT4018-150M-LF | 1520% | 0.228 | 0.190 | 1.15 | 1.25 | 1.00 | 1.20 |
| MPIT4018-220M-LF | 2220% | 0.336 | 0.280 | 1.00 | 1.10 | 0.95 | 1.10 |
| MPIT4018-330M-LF | 3320% | 0.480 | 0.400 | 0.80 | 0.90 | 0.75 | 0.85 |
| MPIT4018-470M-LF | 4720% | 0.720 | 0.600 | 0.70 | 0.80 | 0.60 | 0.70 |
| MPIT4018-560M-LF | 5620% | 0.912 | 0.760 | 0.65 | 0.80 | 0.53 | 0.58 |
| MPIT4018-101M-LF | 10020% | 1.740 | 1.450 | 0.45 | 0.55 | 0.30 | 0.35 |
| MPIT4018-221M-LF | 22020% | 3.600 | 3.000 | 0.30 | 0.34 | 0.21 | 0.23 |
Operating Conditions
Ambient Temperature: -40 ~ +125
Reliability and Test Conditions
High Temperature Storage: 1252 for 1000 hours. No case deformation, inductance change 10%.
Low Temperature Storage: -552 for 1000 hours. No case deformation, inductance change 10%.
Humidity Test: 85, 85% RH for 1000 hours. No case deformation, inductance change 10%.
Thermal Shock: 1000 cycles of -40 (30 min) to 125 (30 min).
Solderability: 90% min. solder coverage on terminal area. Dip in solder at 2455 for 50.1 sec.
Heat Endurance of Reflow Soldering: 3 reflow cycles. Peak temperature: 260+5/-0. No case deformation, inductance change 10%.
Vibration Test: 10~55Hz, 1.5mm amplitude for 2 hours per direction (3 directions total).
Drop Test: 1 meter onto concrete floor, 10 times.
Terminal Strength: Pulling test: 17.64N. Bending test: 2mm deflection.
Loading at High Temperature: 852 for 1000 hours with rated current. No case deformation, inductance change 10%.
Recommended Soldering Conditions
Flux: Rosin-based flux. Halide content must not exceed 0.2wt%.
Solder: Sn solder.
Flow Soldering: Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference during cooling should not exceed 100.
Reflow Soldering: Pre-heating: 150, 1 minute max. Peak Temperature: 350, 3 seconds max.
Packaging
Packaging details are not specified in this section of the document.
Visual Inspection Standard
Visual inspection standards are not detailed in this section of the document.
Storage
Storage conditions are not detailed in this section of the document.
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