Lead Free SMD Power Inductor Microgate MPIT4012-6R8M-LF Featuring Ni-Zn Ferrite Core and Copper Wire
Product Overview
The MPIT4012 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder magnetic glue.
- Certifications: Lead-free products (LF).
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIT4012-R82M-LF | 0.8220% | 0.065 | 0.050 | 3.45 | 3.65 | 2.00 | 2.20 |
| MPIT4012-1R0M-LF | 1.020% | 0.065 | 0.050 | 3.00 | 3.20 | 2.00 | 2.20 |
| MPIT4012-1R5M-LF | 1.520% | 0.078 | 0.065 | 2.30 | 2.50 | 1.90 | 2.00 |
| MPIT4012-2R2M-LF | 2.220% | 0.104 | 0.087 | 2.00 | 2.10 | 1.85 | 2.10 |
| MPIT4012-3R3M-LF | 3.320% | 0.143 | 0.110 | 1.80 | 1.95 | 1.50 | 1.70 |
| MPIT4012-4R7M-LF | 4.720% | 0.182 | 0.140 | 1.40 | 1.55 | 1.35 | 1.50 |
| MPIT4012-5R6M-LF | 5.620% | 0.215 | 0.165 | 1.50 | 1.60 | 1.25 | 1.35 |
| MPIT4012-6R8M-LF | 6.820% | 0.257 | 0.198 | 1.25 | 1.40 | 1.15 | 1.30 |
| MPIT4012-100M-LF | 1020% | 0.312 | 0.240 | 0.90 | 1.05 | 0.95 | 1.05 |
| MPIT4012-150M-LF | 1520% | 0.494 | 0.380 | 0.70 | 0.90 | 0.80 | 0.90 |
| MPIT4012-220M-LF | 2220% | 0.741 | 0.570 | 0.60 | 0.70 | 0.67 | 0.75 |
| MPIT4012-330M-LF | 3320% | 1.050 | 0.810 | 0.45 | 0.69 | 0.45 | 0.50 |
| MPIT4012-470M-LF | 4720% | 1.760 | 1.350 | 0.40 | 0.45 | 0.40 | 0.45 |
| MPIT4012-101M-LF | 10020% | 3.600 | 3.000 | 0.30 | 0.35 | 0.28 | 0.30 |
Testing Conditions
Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Electrical Characteristics Test Instruments
L and DCR tested with CHROMA 3302 meter. IDC tested with CHROMA 3302 and 1320 meter. Inductance test condition: 100KHz/1V. Saturation current: Based on inductance change (|LI-L|/L30%). Temperature rise current: Based on temperature rise (T:40 TYP).
Working Conditions
Product normal work ambient temperature: -40 ~ +125.
Reliability Testing
High temperature storage test: 1252 for 1000 hours. No case deformation, |L|/L10% after 244 hours at room temperature.
Low temperature storage test: -402 for 1000 hours. No case deformation, |L|/L10% after 244 hours at room temperature.
Humidity test: 25-85, 85% RH for 1000 hours. No case deformation, |L|/L10% after 244 hours at room temperature.
Thermal shock test: 1000 cycles of -40 for 30 min. and 125 for 30 min.
Solderability test: Terminal area must have 90% min. solder coverage after dipping in solder at 2455 for 50.1 seconds.
Heat endurance of reflow soldering: 3 reflow cycles. Peak temperature: 260+5/-0. No case deformation, |L|/L10%.
Vibration test: 10~55Hz, 1.5mm amplitude for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Drop test: Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test: 17.64N force for 10 seconds.
Terminal strength bending test: Bend testing PCB at middle point with 2mm deflection. Pressurizing Speed: 0.5mm/sec, Keep time: 60 1s.
Loading at High Temperature: 852 for 1000 hours with rated current. No case deformation, |L|/L10% after 244 hours at room temperature.
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
Flux & Solder: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%. Use Sn solder.
Flow soldering conditions: Temperature difference between solder and product surface limited to 150 max during pre-heating. Temperature difference during cooling limited to 100 max.
Reflow soldering conditions:
- Average Ramp-Up Rate (Ts max. to Tp): 3/second max.
- Preheat (Ts min. to Ts max.): 150 to 200, 60-180 seconds.
- Time maintained above Temperature (TL): 217, 60-150 seconds.
- Peak/Classification Temperature (Tp): 260, 3-4 seconds.
- Time within 5 C of actual Peak Temperature (Tp): 20-40 seconds.
- Ramp-Down Rate: 6/second max.
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