Lead-free microgate MPIH252010-R47M-LF SMD power inductors suitable for various electronic applications
Product Overview
The MPIH252010 series of SMD power inductors from SHENZHEN MICROGATE TECHNOLOGY CO., LTD. are designed for various electronic applications. These inductors are manufactured using high-quality materials including Ni-Zn Ferrite cores, Enameled Copper Wire, and Ag/Ni/Sn/Cu terminals, with epoxy resin and magnetic powder for magnetic glue. They are suitable for lead-free applications.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Manufacturing Company: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Environmental Compliance: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIH252010-R47M-LF | 0.4720% | 0.042 | 0.035 | 3.40 | 3.60 | 3.20 | 3.50 |
| MPIH252010-R68M-LF | 0.6820% | 0.058 | 0.045 | 2.80 | 3.20 | 2.75 | 3.20 |
| MPIH252010-1R0M-LF | 1.020% | 0.072 | 0.055 | 2.00 | 2.70 | 2.45 | 2.70 |
| MPIH252010-1R5M-LF | 1.520% | 0.108 | 0.090 | 1.80 | 2.00 | 1.80 | 2.00 |
| MPIH252010-2R2M-LF | 2.220% | 0.142 | 0.115 | 1.55 | 1.70 | 1.55 | 1.75 |
| MPIH252010-3R3M-LF | 3.320% | 0.270 | 0.225 | 1.45 | 1.50 | 1.15 | 1.25 |
| MPIH252010-4R7M-LF | 4.720% | 0.330 | 0.275 | 1.15 | 1.25 | 1.00 | 1.10 |
Dimensions (mm): A: 2.500.20, B: 2.000.20, C: 1.00Max., D: 0.800.2, E: 0.800.2, f: 0.80 Typ., g: 2.50 Typ., h: 2.00 Typ.
Material List: Core: Ni-Zn Ferrite; Wire: Enameled Copper Wire; Terminal: Ag/Ni/Sn/Cu; Magnetic Glue: Epoxy resin and magnetic powder.
Testing Conditions: Temperature: Ordinary Temperature (5 to 35), Humidity: Ordinary Humidity (25 to 85% RH). For doubtful results: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Test Instruments: L: CHROMA 3302; DCR: Tonghui TH2516B; IDC: CHROMA 3302 and 1320. L test condition: 1.0MHz/1V. Isat: Based on inductance change (|LI-L|/L30%). Irms: Based on temperature rise (T:40 TYP).
Operating Conditions: Ambient temperature: -40 ~ +125.
Reliability Test Conditions: High temperature storage (1252, 1000h), Low temperature storage (-402, 1000h), Humidity test (25-85, 85% RH, 1000h), Thermal shock (-40 to 125, 1000 cycles), Solderability (2455, 50.1s), Heat endurance of reflow soldering (Peak temp: 260+5/-0, 3 times), Vibration (10~55Hz, 1.5mm, 2h/direction), Drop test (1m height, 10 times), Terminal strength (17.64N pull, 10s), Loading at High Temperature (852, 1000h, rated current).
Recommended Soldering Conditions: Suitable for flow and reflow soldering. Flux: Rosin-based flux. Solder: Sn solder. Flow soldering: Temperature difference between product surface and solder 150 (preheating), 100 (cooling). Reflow soldering profile: Preheat (150, 1 min max), Peak temp (350, 3 sec max). Reflow curve profile: Average Ramp-Up Rate (3/sec max), Preheat (Ts min: 150, Ts max: 200, Time: 60-180s), Liquidus (TL: 217, Time: 60-150s), Peak/Classification Temp (Tp: 260, Time: 3-4s), Time within 5C of Peak (20-40s), Ramp-Down Rate (6C/sec max), Time 25C to Peak (8 min max). All temperatures measured on product surface.
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